99199 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION
#2SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME
#3RESIST UNDERLAYER FILM-FORMING COMPOSITION
#4EPOXY RESIN CURED PRODUCT AND FABRICATING METHOD THEREOF
#5Sub-Conductor Insulation and Sub-Conductor Composite of an Electric Rotating Machine
#6PROTECTIVE FILM FORMING COMPOSITION
#7Rosin-based polymer for stain-blocking coating compositions
#8FIBER-REINFORCED PULTRUSION-MOLDED ARTICLE
#9Highly soluble tris-(2,3-epoxypropyl)-isocyanurate and method for producing same
#10EPOXY RESIN COMPOSITION AND IGNITION COIL
#11Cyclic ether-anhydride photopolyaddition and uses thereof
#12SMA resin formulation
#13ELASTOMER GEL FROM EPOXIDIZED VEGETABLE OIL AND USES THEREOF
#14SILICONE HYBRID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#15ROOM TEMPERATURE STABLE ONE-PART VOID FILLER
#16Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
#17RESIST UNDERLAYER FILM-FORMING COMPOSITION
#18Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates
#19Epoxy resin composition
#20Epoxy resin composition, process for producing same, and uses of said composition
#21Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel
#22Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel
#23EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND USE OF COMPOSITION
#24EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
#25SMA resin formulation
#26Highly soluble tris-(2, 3-epoxypropyl)-isocyanurate and method for producing same
#27Highly functional epoxidized resins and coatings
#28Epoxy resin composition and transformer comprising the same
#29Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#30Highly soluble modified epoxy resin composition
#31Curable epoxy resin composition, and fiber-reinforced composite material obtained using same
#32Composition for resin surface roughening
#33Epoxy resin composition, fiber reinforced composite material, molded article, and pressure vessel
#34Curable compositions
#35Color-changing adhesive composition
#36Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
#37Resin composition
#38Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#39Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#40Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof
#41Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
#42Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection
#43Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
#44Epoxy resin composition, prepreg and laminate using same
#45Liquid ejection device
#46Modified hyaluronate hydrophilic compositions, coatings and methods
#47Highly soluble modified epoxy resin composition
#48CURABLE COMPOSITIONS
#49EPOXY RESIN COMPOSITION FOR OUTDOOR ELECTRICAL INSULATION AND COMPONENT FOR OUTDOOR ELECTRICAL INSULATION
#50Resin composition and coating material using the same
#51Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof
#52Highly functional epoxidized resins and coatings
#53Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof
#54Epoxy resin composition for transparent sheets and cured product thereof
#55Epoxy resin composition for transparent sheets and cured product thereof
#56Polycarboxylic acid anhydride and use thereof
#57Underfill material and method for manufacturing semiconductor device using the same
#58Resin composition, prepreg, and film
#59Epoxy resin curing agent
#60Method for producing cellulose nanofiber, cellulose nanofiber, master batch, and resin composition
#61CURABLE EPOXY RESIN COMPOSITION
#62Auto-repairing compositions for overcoat layer, method of producing the same, and display apparatus
#63Highly functional epoxidized resins and coatings
#64Adhesive compositions containing graphenic carbon particles
#65Liquid accelerator composition for hardeners
#66Epoxy resin composition, and method for producing the same
#67High Tepoxy systems for composite applications
#68Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
#69Epoxy resin composition and light emitting apparatus
#70Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
#71Fluorine and epoxy group-containing copolymer, and method for producing same
#72Prepreg, fiber-reinforced composite material, and method for producing prepreg
#73THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE
#74Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
#75Curable epoxy resin composition
#76RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME
#77Adhesive compositions containing graphenic carbon particles
#78Epoxy resin compositions
#79ADHESIVE COMPOSITION
#80CURABLE RESIN COMPOSITION
#81Thermosetting resin composition for surface protection layers
#82Epoxy resin based core filler material developing low exothermic heat
#83Casting resin system for insulating materials in switch gears
#84EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME
#85Method of using white resin in an electronic device
#86IMPREGNATING RESIN SYSTEM FOR INSULATING MATERIALS IN SWITCHGEAR ASSEMBLIES
#87Electronic device incorporating the white resin
#88Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
#89EPOXY RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL-SEMICONDUCTOR DEVICE USING THE SAME
#90Photocurable composition
#91EPOXY RESIN COMPOSITION
#92RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF
#93Resin composition adhesive film and prepreg containing the same, multilayered printed wiring board containing an insulating layer formed by curing such a resin composition, semiconductor device containing such a multilayered printed wiring board, and method of producing such a resin composition
#94Optical semiconductor sealing resin composition and optical semiconductor device using same
#95Organic vegetable oil based resin and preparation method thereof
#96Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device
#97Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
#98Silicone containing encapsulant
#99Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
#100Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst
#101Thermosetting compositions comprising silicone polyethers, their manufacture, and uses
#102Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those
#103High Tepoxy systems for composite applications
#104Curable Liquid Epoxy Resin Composition and Cured Product Thereof
#105Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same
#106Catalyst for curing epoxides
#107Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
#108Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
#109One component epoxy resin composition and motor or dynamo using the same
#110Curable resin compositions and interlayer dielectric films
#111Epoxy resin curing agent produced by heating anhydride and polyester in presence of hydrogen and hydrogenation catalyst
#112RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME
#113Epoxy resin composition
#114Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product
#115Process for producing optical semiconductor device
#116Inkjet ink composition for color filter, production method for color filter, and color filter
#117Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same
#118Cationic electrodepositable coatings comprising rosin
#119Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof
#120Epoxy Resin and Epoxy Resin Composition
#121Curing agent for epoxy resins and epoxy resin compositions
#122LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#123Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer
#124Method for producing an optical, radiation-emitting component and optical, radiation-emitting component
#125Optoelectronic device
#126Optoelectronic device
#127Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
#128Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
#129High optical-performance resin compound
#130Radiopaque polymers for circuit board assembly
#131Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same
#132Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
#133Thermosetting resin composition
#134Radiation detector
#135Filled epoxy resin compositions
#136Method for making filled epoxy resin compositions
#137Silicone epoxy formulations
#138Epoxy resin compositions, solid state devices encapsulated therewith and method
#139Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
#140Resin compositions and methods of use thereof
#141Patching resins for insulating tapes
#142Curable epoxy resin composition, fabrication process using the same and shaped articles obtained therefrom