ClassID:

99199

C08G59/4215 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic

Recent Application in this class:
#1
20260062548
2026-03-05

RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION

#2
20250294930
2025-09-18

SOLVENT-FREE THERMOSETTING QUANTUM DOT RESIN COMPOSITION, QUANTUM DOT RESIN COMPOSITE PREPARED THEREFROM, AND LED PACKAGE AND DISPLAY DEVICE EMPLOYING SAME

#3
20250199409
2025-06-19

RESIST UNDERLAYER FILM-FORMING COMPOSITION

#4
20250179239
2025-06-05

EPOXY RESIN CURED PRODUCT AND FABRICATING METHOD THEREOF

#5
20250179238
2025-06-05

Sub-Conductor Insulation and Sub-Conductor Composite of an Electric Rotating Machine

#6
20250155813
2025-05-15

PROTECTIVE FILM FORMING COMPOSITION

#7
20240294702
2024-09-05

Rosin-based polymer for stain-blocking coating compositions

#8
20240002612
2024-01-04

FIBER-REINFORCED PULTRUSION-MOLDED ARTICLE

#9
20230287179
2023-09-14

Highly soluble tris-(2,3-epoxypropyl)-isocyanurate and method for producing same

#10
20230242703
2023-08-03

EPOXY RESIN COMPOSITION AND IGNITION COIL

#11
20230203239
2023-06-29

Cyclic ether-anhydride photopolyaddition and uses thereof

#12
20230141772
2023-05-11

SMA resin formulation

#13
20220194912
2022-06-23

ELASTOMER GEL FROM EPOXIDIZED VEGETABLE OIL AND USES THEREOF

#14
20220153919
2022-05-19

SILICONE HYBRID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

#15
20220017684
2022-01-20

ROOM TEMPERATURE STABLE ONE-PART VOID FILLER

#16
20210363308
2021-11-25

Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same

#17
20210311396
2021-10-07

RESIST UNDERLAYER FILM-FORMING COMPOSITION

#18
20210009748
2021-01-14

Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates

#19
20200385565
2020-12-10

Epoxy resin composition

#20
20200283566
2020-09-10

Epoxy resin composition, process for producing same, and uses of said composition

#21
20200239649
2020-07-30

Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel

#22
20200239648
2020-07-30

Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel

#23
20200115554
2020-04-16

EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND USE OF COMPOSITION

#24
20200087444
2020-03-19

EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

#25
20190270873
2019-09-05

SMA resin formulation

#26
20190256657
2019-08-22

Highly soluble tris-(2, 3-epoxypropyl)-isocyanurate and method for producing same

#27
20190248952
2019-08-15

Highly functional epoxidized resins and coatings

#28
20190169358
2019-06-06

Epoxy resin composition and transformer comprising the same

#29
20190092963
2019-03-28

Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

#30
20190062491
2019-02-28

Highly soluble modified epoxy resin composition

#31
20190055369
2019-02-21

Curable epoxy resin composition, and fiber-reinforced composite material obtained using same

#32
20180371197
2018-12-27

Composition for resin surface roughening

#33
20180186946
2018-07-05

Epoxy resin composition, fiber reinforced composite material, molded article, and pressure vessel

#34
20180100076
2018-04-12

Curable compositions

#35
20170355886
2017-12-14

Color-changing adhesive composition

#36
20170283581
2017-10-05

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

#37
20170275453
2017-09-28

Resin composition

#38
20170233615
2017-08-17

Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

#39
20170233599
2017-08-17

Inkjet adhesive, manufacturing method for semiconductor device, and electronic component

#40
20170145150
2017-05-25

Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof

#41
20170073457
2017-03-16

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

#42
20170040513
2017-02-09

Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection

#43
20170018693
2017-01-19

Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

#44
20170002131
2017-01-05

Epoxy resin composition, prepreg and laminate using same

#45
20160368015
2016-12-22

Liquid ejection device

#46
20160346439
2016-12-01

Modified hyaluronate hydrophilic compositions, coatings and methods

#47
20160340469
2016-11-24

Highly soluble modified epoxy resin composition

#48
20160280846
2016-09-29

CURABLE COMPOSITIONS

#49
20160272809
2016-09-22

EPOXY RESIN COMPOSITION FOR OUTDOOR ELECTRICAL INSULATION AND COMPONENT FOR OUTDOOR ELECTRICAL INSULATION

#50
20160185895
2016-06-30

Resin composition and coating material using the same

#51
20160177085
2016-06-23

Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

#52
20160096916
2016-04-07

Highly functional epoxidized resins and coatings

#53
20160090440
2016-03-31

Epoxy Resin Composition For Transparent Sheets And Cured Product Thereof

#54
20160083615
2016-03-24

Epoxy resin composition for transparent sheets and cured product thereof

#55
20160083576
2016-03-24

Epoxy resin composition for transparent sheets and cured product thereof

#56
20160075819
2016-03-17

Polycarboxylic acid anhydride and use thereof

#57
20160017191
2016-01-21

Underfill material and method for manufacturing semiconductor device using the same

#58
20150337075
2015-11-26

Resin composition, prepreg, and film

#59
20150291729
2015-10-15

Epoxy resin curing agent

#60
20150087750
2015-03-26

Method for producing cellulose nanofiber, cellulose nanofiber, master batch, and resin composition

#61
20150041846
2015-02-12

CURABLE EPOXY RESIN COMPOSITION

#62
20150030843
2015-01-29

Auto-repairing compositions for overcoat layer, method of producing the same, and display apparatus

#63
20140336301
2014-11-13

Highly functional epoxidized resins and coatings

#64
20140299270
2014-10-09

Adhesive compositions containing graphenic carbon particles

#65
20140296381
2014-10-02

Liquid accelerator composition for hardeners

#66
20140275344
2014-09-18

Epoxy resin composition, and method for producing the same

#67
20140235792
2014-08-21

High Tepoxy systems for composite applications

#68
20140058014
2014-02-27

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

#69
20130320379
2013-12-05

Epoxy resin composition and light emitting apparatus

#70
20130059127
2013-03-07

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

#71
20130035461
2013-02-07

Fluorine and epoxy group-containing copolymer, and method for producing same

#72
20120328858
2012-12-27

Prepreg, fiber-reinforced composite material, and method for producing prepreg

#73
20120326301
2012-12-27

THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE

#74
20120299039
2012-11-29

Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same

#75
20120248498
2012-10-04

Curable epoxy resin composition

#76
20120217532
2012-08-30

RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME

#77
20120211160
2012-08-23

Adhesive compositions containing graphenic carbon particles

#78
20120184647
2012-07-19

Epoxy resin compositions

#79
20120168814
2012-07-05

ADHESIVE COMPOSITION

#80
20120168215
2012-07-05

CURABLE RESIN COMPOSITION

#81
20120142822
2012-06-07

Thermosetting resin composition for surface protection layers

#82
20120022185
2012-01-26

Epoxy resin based core filler material developing low exothermic heat

#83
20110313103
2011-12-22

Casting resin system for insulating materials in switch gears

#84
20110298003
2011-12-08

EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME

#85
20110294241
2011-12-01

Method of using white resin in an electronic device

#86
20110287679
2011-11-24

IMPREGNATING RESIN SYSTEM FOR INSULATING MATERIALS IN SWITCHGEAR ASSEMBLIES

#87
20110284915
2011-11-24

Electronic device incorporating the white resin

#88
20110278630
2011-11-17

Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device

#89
20110272829
2011-11-10

EPOXY RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL-SEMICONDUCTOR DEVICE USING THE SAME

#90
20110200950
2011-08-18

Photocurable composition

#91
20110184092
2011-07-28

EPOXY RESIN COMPOSITION

#92
20110166258
2011-07-07

RESIN COMPOSITION FOR NO-FLOW UNDERFILL, NO-FLOW UNDERFILL FLIM USING THE SAME AND MANUFACTURING METHOD THEREOF

#93
20110139496
2011-06-16

Resin composition adhesive film and prepreg containing the same, multilayered printed wiring board containing an insulating layer formed by curing such a resin composition, semiconductor device containing such a multilayered printed wiring board, and method of producing such a resin composition

#94
20110114972
2011-05-19

Optical semiconductor sealing resin composition and optical semiconductor device using same

#95
20110098395
2011-04-28

Organic vegetable oil based resin and preparation method thereof

#96
20110058776
2011-03-10

Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device

#97
20110057228
2011-03-10

Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same

#98
20110054076
2011-03-03

Silicone containing encapsulant

#99
20110039978
2011-02-17

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

#100
20110021722
2011-01-27

Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst

#101
20100311891
2010-12-09

Thermosetting compositions comprising silicone polyethers, their manufacture, and uses

#102
20100298491
2010-11-25

Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those

#103
20100292415
2010-11-18

High Tepoxy systems for composite applications

#104
20100292400
2010-11-18

Curable Liquid Epoxy Resin Composition and Cured Product Thereof

#105
20100201004
2010-08-12

Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same

#106
20100187715
2010-07-29

Catalyst for curing epoxides

#107
20100164127
2010-07-01

Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same

#108
20100140638
2010-06-10

Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

#109
20100113649
2010-05-06

One component epoxy resin composition and motor or dynamo using the same

#110
20090281275
2009-11-12

Curable resin compositions and interlayer dielectric films

#111
20090250825
2009-10-08

Epoxy resin curing agent produced by heating anhydride and polyester in presence of hydrogen and hydrogenation catalyst

#112
20090230570
2009-09-17

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME

#113
20090215969
2009-08-27

Epoxy resin composition

#114
20090137777
2009-05-28

Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product

#115
20090061549
2009-03-05

Process for producing optical semiconductor device

#116
20090061167
2009-03-05

Inkjet ink composition for color filter, production method for color filter, and color filter

#117
20090038834
2009-02-12

Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same

#118
20090020038
2009-01-22

Cationic electrodepositable coatings comprising rosin

#119
20090018278
2009-01-15

Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof

#120
20090012203
2009-01-08

Epoxy Resin and Epoxy Resin Composition

#121
20080306223
2008-12-11

Curing agent for epoxy resins and epoxy resin compositions

#122
20080265438
2008-10-30

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

#123
20080249220
2008-10-09

Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer

#124
20080197376
2008-08-21

Method for producing an optical, radiation-emitting component and optical, radiation-emitting component

#125
20070295983
2007-12-27

Optoelectronic device

#126
20070295956
2007-12-27

Optoelectronic device

#127
20070265427
2007-11-15

Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator

#128
20070181902
2007-08-09

Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same

#129
20070100092
2007-05-03

High optical-performance resin compound

#130
20060222860
2006-10-05

Radiopaque polymers for circuit board assembly

#131
20060204761
2006-09-14

Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same

#132
20060204760
2006-09-14

Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin

#133
20060156955
2006-07-20

Thermosetting resin composition

#134
20060131502
2006-06-22

Radiation detector

#135
20060084727
2006-04-20

Filled epoxy resin compositions

#136
20060083851
2006-04-20

Method for making filled epoxy resin compositions

#137
20050282975
2005-12-22

Silicone epoxy formulations

#138
20050222298
2005-10-06

Epoxy resin compositions, solid state devices encapsulated therewith and method

#139
20050191476
2005-09-01

Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials

#140
20050170188
2005-08-04

Resin compositions and methods of use thereof

#141
20050058772
2005-03-17

Patching resins for insulating tapes

#142
20050004270
2005-01-06

Curable epoxy resin composition, fabrication process using the same and shaped articles obtained therefrom