C08G59/423 - CPC Classification Index

ClassID:

99201 ⎘

C08G59/423 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to , carbon and hydrogen

Recent Application in this class:

20260152600

2026-06-04

HEAT-CURABLE COMPOSITION, CURED ARTICLE, ADHESIVE AGENT, AND HEAT-CURABLE COMPOSITION PRODUCTION METHOD

20260109849

2026-04-23

EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE

20250155813

2025-05-15

PROTECTIVE FILM FORMING COMPOSITION

20230029997

2023-02-02

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

20220356298

2022-11-10

Room temperature ionic liquid curing agent

20220185945

2022-06-16

Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

20220145119

2022-05-12

CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF

20200291172

2020-09-17

Phosphorated anhydride containing epoxy resin

20200283595

2020-09-10

Reversible self-repairing epoxy resin and preparation and recovery remoulding method therefor

#10

20200148931

2020-05-14

Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound

#11