99202 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof heterocyclic
NITROGEN ASSISTED POLYESTER COVALENT ADAPTABLE NETWORKS
#2POLYESTER COVALENTLY ADAPTABLE NETWORKS WITH AMINES FOR ENHANCED RECYCLABILITY AND CURE
#3DEGRADABLE LOST CIRCULATION MATERIAL FOR PROTECTION OIL AND GAS RESERVOIRS, AND PREPARATION METHOD AND USE THEREOF
#4RESIN COMPOSITION AND APPLICATION THEREOF
#5EPOXY-BASED RESIN COMPOSITION FOR CLEAR FIBER COMPOSITES AND EPOXY-BASED CLEAR FIBER COMPOSITES
#6Vegetable oil-derived epoxy compositions having improved performance
#7NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE
#8POLYMER, PHOTOSENSITIVE COMPOSITION, DRY FILM PHOTORESIST, AND LITHOGRAPHY METHOD
#9MAGNETIC PASTE
#10SCINTILLATOR STRUCTURE
#11NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE
#12CURABLE EPOXY COMPOSITION FOR ROTARY ELECTRIC MACHINE
#13Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
#14COMPOSITION, CURABLE COMPOSITION, AND CURED PRODUCT
#15Process to produce blended (meth)acrylate/vinyl ester resin cross-linkers
#16Impregnating Formulation, Insulation Material, Method for Producing an Insulation Material, and Electrical Machine with an Insulation Material
#17ARTICLE MADE OF CONGLOMERATE MATERIAL, COMPOSITE ASSEMBLY COMPRISING SUCH ARTICLE AND METHOD FOR MANUFACTURING THE ARTICLE MADE OF CONGLOMERATE MATERIAL
#18RESIN COMPOSITION FOR FIBER-REINFORCED PLASTIC, AND FIBERREINFORCED PLASTIC CONTAINING SAID COMPOSITION
#19COMPOSITION COMPRISING A POLYMER BASED ON EPOXIDE COMPOUNDS
#20Epoxy resin solution
#21RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
#22Vegetable oil-derived epoxy compositions having improved performance
#23COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL
#24Epoxy resin composition, process for producing same, and uses of said composition
#25HARDENER COMPOSITION
#26Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel
#27Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel
#28Cured product and production method of same, and resin sheet and resin composition
#29Epoxy resin composition, electronic component mounting structure, and method for producing the same
#30Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound
#31Low temperature anhydride epoxy cured systems
#32Sheet-shaped prepreg
#33RESIN COMPOSITION, MOLDED ARTICLE, LAMINATE, COATING MATERIAL, AND ADHESIVE
#34CURABLE EPOXY COMPOSITIONS
#35HIGH HEAT THERMOSET EPOXY COMPOSITIONS
#36Process to produce blended (meth)acrylate/vinyl ester resin cross-linkers
#37HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE
#38BIORENEWABLE EPOXY RESINS DERIVED FROM PHENOLIC ACIDS
#39Epoxy resin composition and transformer comprising the same
#40EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION
#41A Process for the Preparation of Insulation Systems for Electrical Engineering, the Articles Obtained Therefrom and the Use Thereof
#42Highly soluble modified epoxy resin composition
#43Curable epoxy resin composition, and fiber-reinforced composite material obtained using same
#44METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL
#45Resist underlayer composition, and method of forming patterns using the composition
#46Epoxy resin composition, fiber reinforced composite material, molded article, and pressure vessel
#47METHOD FOR THE RUBBER MODIFICATION OF THERMOSETTING RESINS
#48White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
#49COMPOSITION COMPRISING A POLYMER BASED ON EPOXIDE COMPOUNDS
#50Method for encapsulating large-area semiconductor element-mounted base material
#51Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#52Preparation of thermoplastic epoxidized polymers and thermosetting materials from triglycerides
#53Halogen-free epoxy resin composition, prepreg and laminate using same
#54Fatty acid polyester derivatives of polyglycosides
#55Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
#56Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product
#57Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
#58FAST CURING RESIN COMPOSITIONS, MANUFACTURE AND USE THEREOF
#59HEAT-CURABLE RESIN COMPOSITION
#60USE OF A VITRIMER-TYPE THERMOSETTING RESIN COMPOSITION FOR MANUFACTURING ELECTRICAL INSULATION PARTS
#61COMPOSITION FOR MANUFACTURING EPOXY/ANHYDRIDE VITRIMER RESINS INCLUDING AN ORGANIC CATALYST
#62FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
#63Highly soluble modified epoxy resin composition
#64ALDEHYDE FREE THERMOSET BIORESINS AND BIOCOMPOSITES
#65Curable compositions
#66Epoxy resin-based composition as a filler honeycomb cells
#67ORGANIC VEGETABLE OIL BASED RESIN AND PREPARATION METHOD THEREOF
#68Resin composition, prepreg, and film
#69Isosorbide-derived epoxy resins and methods of making same
#70Epoxy resin curing agent
#71Polymer particle dispersions with polyols
#72Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device
#73Epoxy elastomer compositions
#74Epoxy resin composition, prepreg and fiber-reinforced composite material
#75COMPOSITES
#76Epoxy resin composition, prepreg and fiber-reinforced composite material
#77Organic vegetable oil based resin and preparation method thereof
#78Composition Containing Porphyrin to Improve Adhesion
#79Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same