99208 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE
#2CURING AGENT FOR EPOXY RESINS, WHICH CURING AGENT HAS DIPHENOLIC ACID
#3METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHESIVES
#4OLIGOSILOXANE EPOXY COVALENT ADAPTABLE NETWORKS
#5Room temperature ionic liquid curing agent
#6CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF
#7Process for the production of epoxy resins
#8Epoxy resin composition, process for producing same, and uses of said composition
#9HARDENER COMPOSITION
#10EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED-CIRCUIT BOARD COMPRISING SAME
#11Image display device sealing material and image display device sealing sheet
#12Low temperature anhydride epoxy cured systems
#13Sheet-shaped prepreg
#14CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS
#15ROOM TEMPERATURE IONIC LIQUID CURING AGENT
#16HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE
#17EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCING SAME, AND USES OF SAID COMPOSITION
#18Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#19Halogen-free epoxy resin composition, prepreg and laminate using same
#20Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
#21Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
#22Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
#23Resin composition, prepreg and laminate board
#24TWO-PACK EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, AND FIBER-REINFORCED COMPOSITE MATERIAL
#25Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board
#26PREPREG AND USES OF THE SAME
#27PROCESSING-FRIENDLY DIANHYDRIDE HARDENER FOR EPOXY RESIN SYSTEMS BASED ON 5,5'-CARBONYLBIS(ISOBENZOFURAN-1,3-DIONE)
#28Two-pack type epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material
#29HARDENER FOR EPOXY RESIN SYSTEMS AND USE THEREOF
#30Curable composition, articles comprising the curable composition, and method of making the same
#31EPOXY COMPOUND WITH NITROGEN-CONTAINING RING
#32Halogen-free resin composition and its application for copper clad laminate and printed circuit board
#33THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE
#34Curable epoxy resin composition
#35Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom
#36Compositions comprising solvated aromatic amines and methods for the preparation thereof
#37CURABLE EPOXY RESIN COMPOSITION
#38Thermosettable composition containing a combination of an amphiphilic block copolymer and a polyol and a thermoset product therefrom
#39SILVER COATED FLAKY MATERIAL FILLED CONDUCTIVE CURABLE COMPOSITION AND THE APPLICATION IN DIE ATTACH
#40METHOD FOR PREPARING A HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS
#41SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT
#42Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
#43Thermosetting Resin Composition and Application Thereof
#44Flame-retardant adhesive resin composition and adhesive film using the same
#45INSULATING POLYMER MATERIAL COMPOSITION
#46Rubber-modified polyamide resin, epoxy resin composition and cured product thereof
#47Two-part epoxy composition
#48Method for making amine-modified epoxy resin and cationic electrodeposition coating composition
#49Method for making amine-modified epoxy resin and cationic electrodeposition coating composition
#50Optoelectronic molding compound that transmits visible light and blocks infrared light
#51Low voiding no flow fluxing underfill for electronic devices
#52Epoxy resin compositions, solid state devices encapsulated therewith and method
#53Solvent-borne two component modified epoxy/polyamine coating composition
#54Resin composition, composition for solder resist, and cured article obtained therefrom
#55Epoxy resin composition and article made therefrom