99215 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Amides together with other curing agents
Sub-classes:ARYLATED AND NON-ARYLATED FAT-BASED EPOXY POLYMERS
#2NOVEL CURING AGENT HAVING ESTER AND AMIDE GROUPS, METHOD FOR PREPARING THE SAME, EPOXY COMPOSITION, CURED PRODUCT, AND ARTICLE COMPRISING THE SAME
#3Toughened Two Component Epoxy Structural Adhesive
#4NEW EPOXY RESIN COMPOSITION FOR USE AS STRUCTURAL ADHESIVE
#5CURING AGENTS FOR EPOXY RESIN COATINGS
#6Thermosetting epoxy resin composition having low curing temperature and good storage stability
#7EPOXY COMPOSITE FORMULATION
#8Epoxy compound, composition, cured product and laminate
#9Epoxy resin composition for fiber-reinforced composite materials, and fiber-reinforced composite material
#10SULFANILAMIDE CONTAINING EPOXY RESIN COMPOSITIONS
#11Epoxy resin composition, prepreg, and fiber-reinforced composite material
#12COMPOSITION FOR RECOVERING HYDROCARBON FLUIDS FROM A SUBTERRANEAN RESERVOIR
#13Thermosetting resin composition, and prepreg and substrate using same
#14Two-component epoxy resin paint
#15Epoxy resin composition, prepreg for fiber-reinforced composite material, and fiber-reinforced composite material
#16Encapsulation composition for storage or confinement of waste which is toxic to health and/or the environment
#17APCHA as a building block in curing agent formulations for structural adhesives
#18EPOXY RESIN COMPOSITION
#19Suspension polymerization compositions, methods and uses thereof
#20Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material
#21Conductive coating material for shielding electronic component package and method for producing shielded package
#22Uspension polymerization compositions, methods and uses thereof
#23Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article
#24High-latency hardeners for epoxy resins
#25Carbon fibre-containing prepregs
#26Epoxy liquid curing agent compositions
#27Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#28High-latency hardeners for epoxy resins
#29Curing agents for epoxy resins
#30HEAT-CURABLE POWDER COATING COMPOSITIONS, WHICH AFTER THE COATING HAS CURED RESULT IN A MATT SURFACE AND SIMPLE METHOD FOR PRODUCING SAME
#31Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
#32Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
#33Heat curable epoxy resin composition with water as foaming agent
#34ROOM-TEMPERATURE CURABLE EPOXY STRUCTURAL ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF
#35Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#36Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#37Epoxy resin composition and prepreg using the same, fiber-reinforced composite resin tubular body manufactured from the prepreg and manufacturing method therefor, and fiber-reinforced composite resin molded body
#38Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
#39Epoxy resin curable composition for prepreg