AMINE CURABLE EPOXY RESIN COMPOSITION

Curing agent for epoxy resin coatings

Liquid accelerator composition for hardeners

Hardeners for epoxy resin coatings

Hardeners for epoxy resins, which comprise aromatic amino groups

Prepreg and fiber-reinforced composite material

Hardener for epoxy resins

Low-emission hardener for epoxy resins

Prepreg and method for manufacturing same

Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

Composite material for structural applications

Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material

Curing agents

Hardeners for thermosettable resin compositions

Polycyclopentadiene compounds

Liquid methylenedianiline compositions

ELECTRICAL CONDUCTOR COATED IN A BONDING LAYER, AND A METHOD OF MANUFACTURING SUCH AN ELECTRICAL CONDUCTOR

CURING AGENTS FOR EPOXY RESINS

Prepreg, fiber-reinforced composite material, and method for producing prepreg

Curing agents

EPOXY RESIN COMPOSITION

SEMICONDUCTOR-ENCAPSULATING LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Epoxy-rubber composition for cured materials

ENDOSCOPIC DEVICE

Fiber-reinforced composite sheet

INPUT DEVICE

NOVEL EPOXY RESIN AND EPOXY RESIN COMPOSITION COMPRISING THE SAME

LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME

EPOXY SYSTEMS FOR COMPOSITES

Composite Materials With Improved Performance

Composite material for structural applications

Ionic liquid epoxy resin monomers

INPUT DEVICE

Conductivity of resin materials and composite materials

Multifunctional additives in engineering thermoplastics

Composite materials with blend of thermoplastic particles

Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices

Development of a cross-linked epoxy resin with flame-retardant properties

Prepreg containing epoxy resin with improved flexural properties

EPOXY RESIN COMPOSITION AND PREPREG USING THE SAME

EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME

Nano graphene-modified curing agents for thermoset resins

Epoxy resin composition, prepreg, and fiber reinforced composite material

ADHESIVE COMPOSITION, BONDING MEMBER USING THE ADHESIVE COMPOSITION, SUPPORT MEMBER FOR SEMICONDUCTOR MOUNTING, SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE

Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same

Epoxy resin and 4,4′-diaminobenzanilide powder

Phenalkamine and salted amine blends as curing agents for epoxy resins

Low-Voiding Die Attach Film, Semiconductor Package, and Processes for Making and Using Same

EPOXY RESIN COMPOSITION

Method for making composite material with blend of thermoplastic particles

Distortional matrix of epoxy resin and diamine

RESIN COMPOSITION

EPOXY RESIN COMPOSITION FOR FIBER REINFORCED COMPOSITE MATERIAL, A PRODUCTION METHOD FOR FIBER REINFORCED COMPOSITE MATERIAL, AND A FIBER REINFORCED COMPOSITE MATERIAL

EPOXY RESIN COMPOSITION

Epoxy resin, curing agent and 9,10-Dihydro-9-oxa-10-phosphaphenanthrene derivative

METHOD FOR MANUFACTURING EPOXY NANOCOMPOSITE MATERIAL CONTAINING VAPOR-GROWN CARBON NANOFIBERS AND ITS PRODUCTS THEREBY

Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof

EPOXY COMPOSITION

Alkylated 4-Aminobenzyl-4-Aminocyclohexane

Crystalline resin cured product, crystalline resin composite material, and method for producing the same

Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same

Corrosion-Resistant Epoxy Nanocomposite Coatings containing Submicron Emeraldine-Base Polyaniline and Organomodified Montmorrilonite

Ionic liquid epoxy resins

Epoxy resins adducted with reactive liquid rubber having improved low temperature performance properties

Composite materials with improved performance

Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler

Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product

Epoxy resin composition for fiber-reinforced composite material

Epoxy Resin Composition and Cured Epoxy Resin

Article and associated method

Composite materials with blend of thermoplastic particles

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Process for Preparing Composites Using Epoxy Resin Formulations

Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment

Continuous pultrusion process for producing high performance structural profiles

Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material

Pre-impregnated composite materials with improved performance

Epoxy Resin, Epoxy Resin Composition and Cured Product Thereof

Liquid epoxy resin composition

Epoxy compounds and cured epoxy resins obtained by curing the compounds

Curing epoxy resin with aliphatic diamine-styrene product and carboxyl- and hydroxyl-containing accelerator

Distortional matrix of epoxy resin and diamine

Liquid epoxy resin composition

Polymer composite formed article, printed wiring board using the formed article, and methods of producing them

Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods

Thermosetting resin compounds

Radiopaque polymers for circuit board assembly

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Epoxy compound and cured epoxy resin product

Polyepoxy compounds having an amide linkage

Liquid epoxy resin composition and semiconductor device

Epoxy resin composition and fiber reinforced composite material using epoxy resin composition

Epoxy resin polymer and alignment film materials containing same for liquid crystal display

Adhesive of epoxy resin and curing agent with xylylene diamine structure

Methods of curing ionic liquid epoxy mixtures

Super-hydrophobic epoxy resin compositions