ClassID:

99237

C08G59/623 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Alcohols or phenols; Phenols Aminophenols

Recent Application in this class:
#1
20250289951
2025-09-18

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

#2
20250043066
2025-02-06

AMINE COMPOSITION, EPOXY SYSTEM PREPARED FROM THE AMINE COMPOSITION AND AN EPOXY RESIN, AND USE OF THE EPOXY SYSTEM

#3
20250043063
2025-02-06

TWO-PART CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

#4
20250034321
2025-01-30

COMPOSITIONS OF EPOXY CURING AGENT INCORPORATING NAPHTHOL AND NAPHTHOL DERIVATIVES

#5
20240368337
2024-11-07

MODIFIED PHENALKAMINE CURING AGENT FOR EPOXY RESIN COMPOSITION AND USE THEREOF

#6
20240360271
2024-10-31

BIO-BASED AMINE CURING AGENT FOR CURABLE COMPOSITIONS

#7
20240026067
2024-01-25

POLYMERIC MANNICH BASE, PREPARATION METHODS AND USE AS AN EPOXY RESIN CURATIVE

#8
20230220152
2023-07-13

TWO PART CURABLE COMPOSITIONS

#9
20220267544
2022-08-25

METHOD FOR PRODUCING PREPREG, AND PREPREG

#10
20220185949
2022-06-16

ADHESION PROMOTERS FOR STRUCTURAL ADHESIVE APPLICATIONS

#11
20220145144
2022-05-12

TWO-COMPONENT COMPOSITION WITH A HIGH DEGREE OF STRENGTH

#12
20220145068
2022-05-12

Curable composition

#13
20220135861
2022-05-05

COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND SURFACE-MODIFIED INORGANIC SUBSTANCE

#14
20210380756
2021-12-09

Thermoset epoxy resin, its preparing composition and making process thereof

#15
20210324135
2021-10-21

Modified phenalkamine curing agent for epoxy resin composition and use thereof

#16
20210324134
2021-10-21

Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

#17
20210246258
2021-08-12

Cardanol based curing agent for epoxy resins compositions

#18
20210139642
2021-05-13

Phenalkamine epoxy curing agents from methylene bridged poly(cyclohexyl-aromatic) amines and epoxy resin compositions containing the same

#19
20200291174
2020-09-17

COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL

#20
20200190252
2020-06-18

Heat-curing epoxy resin adhesives

#21
20190382427
2019-12-19

Preparation method of phosphaphenanthrene-structure reactive flame retardant and application thereof

#22
20190211140
2019-07-11

LIGHT-FIXABLE CASTING COMPOSITION AND METHOD OF SELECTIVELY CASTING SUBSTRATES/COMPONENTS USING THE COMPOSITIONS

#23
20170313043
2017-11-02

CURABLE EPOXY COMPOSITION AND FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE ARTICLE OBTAINED USING SAME

#24
20170250162
2017-08-31

Method for manufacturing semiconductor apparatus, method for manufacturing flip-chip type semiconductor apparatus, semiconductor apparatus, and flip-chip type semiconductor apparatus

#25
20170240691
2017-08-24

Benzylated mannich base curing agents, compositions, and methods

#26
20160355437
2016-12-08

Epoxy-based substance for fixing purposes, the use thereof and the use of specific components

#27
20160326302
2016-11-10

Method of preparing accelerator, curing agent and diluent and applying the same to eliminate amine blushing and amine blooming

#28
20160068726
2016-03-10

Adhesive composition and article including the same

#29
20160016888
2016-01-21

Condensation products of amino-functional polymers

#30
20150018500
2015-01-15

Reactive polymer catalysts for 2-component epoxy resin systems

#31
20140213698
2014-07-31

Thermosetting composition and process for preparing fiber-reinforced composites

#32
20140128506
2014-05-08

Hardener for epoxy resins

#33
20130256002
2013-10-03

Flexible printed wiring board and laminate for production of flexible printed wiring board

#34
20120259040
2012-10-11

Curable compositions

#35
20120077943
2012-03-29

Low temperature curable epoxy compositions

#36
20120046424
2012-02-23

Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility

#37
20110253434
2011-10-20

EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

#38
20110253433
2011-10-20

Epoxy resin composition, and prepreg and printed circuit board using the same

#39
20110118385
2011-05-19

Process for preparing self-healing composite materials of high efficiency for structural applications

#40
20110020555
2011-01-27

Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same

#41
20100204410
2010-08-12

Cyanate ester, epoxy resin and curing agent of phenol resin and epoxy compound-modified polyamine

#42
20090226729
2009-09-10

HIGH-SOLID ANTICORROSIVE COATING COMPOSITION, HIGH-SOLID RAPIDLY-CURABLE ANTICORROSIVE COATING COMPOSITION, METHOD OF COATING SHIP OR THE LIKE, HIGH-SOLID ANTICORROSIVE FILM AND RAPIDLY CURED HIGH- ANTICORROSIVE FILM OBTAINED, AND COATED SHIP AND UNDERWATER STRUCTURE COATED WITH THESE COATING FILMS

#43
20090221465
2009-09-03

WATER-BORNE CATIONIC BINDERS FOR WASH PRIMERS

#44
20090118457
2009-05-07

Resorcinol-based mannich base

#45
20080308972
2008-12-18

Process for Preparing Composites Using Epoxy Resin Formulations

#46
20070264506
2007-11-15

Epoxy Resin Compositions Containing Mannich Bases, Suitable for High-Temperature Applications

#47
20070119745
2007-05-31

Multi-component kit of epoxy resin and mannich base components

#48
20070093630
2007-04-26

Mannich bases and processes for the preparation of mannich bases

#49
20050176899
2005-08-11

Mannich bases from isolated amine adducts