C08G59/64 - CPC Classification Index

ClassID:

99241 ⎘

C08G59/64 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Alcohols or phenols Amino alcohols

Recent Application in this class:

20230357489

2023-11-09

MANNICH BASE EPOXY CURATIVE, CURED EPOXY RESINS THEREOF AND METHODS OF PREPARING THE SAME

20230257513

2023-08-17

Rehealable and reworkable polymer for electronic packaging

20230078413

2023-03-16

Curing agent for epoxy resins

20220298100

2022-09-22

DISTILLED CASHEW NUT SHELL LIQUID BASED, WATER THINABLE PHENALKAMINE AS CURING AGENT FOR EPOXY PAINT COMPOSITIONS

20220275148

2022-09-01

COATING COMPOSITIONS

20220162375

2022-05-26

TWO COMPONENT COATING COMPOSITIONS

20220145068

2022-05-12

Curable composition

20210395561

2021-12-23

Composition for coating the edge of an optical lens

20200231742

2020-07-23

Thermadapt shape memory polymer and application method thereof

#10

20200087552

2020-03-19

Epoxy resin adhesive with high compressive strength

#11

20200087446

2020-03-19

Low temperature anhydride epoxy cured systems

#12

20190352454

2019-11-21

Curing agent for epoxy resins

#13

20190169355

2019-06-06

Epoxy formula for integral capacitance probe

#14

20190153151

2019-05-23

Thermosetting resin composition, and prepreg and substrate using same

#15

20190144372

2019-05-16

Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured product

#16

20180319928

2018-11-08

Controlled glass transition polymeric material and method

#17

20180171067

2018-06-21

N-hydroxyl ethyl piperidine (NHEP): a novel curing agent for epoxy systems

#18

20180094175

2018-04-05

Cold curing epoxy resin primer or adhesive

#19

20180079710

2018-03-22

Amine for rapid-curing epoxy resin compositions

#20

20170029364

2017-02-02

Amine for low-emission epoxy resin products

#21

20160264719

2016-09-15

Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions

#22

20160122535

2016-05-05

Polyalkylene carbonate resin composition having high thermal stability

#23

20150353674

2015-12-10

Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions

#24

20150307651

2015-10-29

Epoxy composition

#25

20150105523

2015-04-16

Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions

#26

20140336353

2014-11-13

Polymers derived from renewably resourced lysinol

#27

20140329984

2014-11-06

Polymers derived from renewably resourced lysinol

#28

20130211017

2013-08-15

Elastomeric epoxy materials and the use thereof

#29

20120172493

2012-07-05

Curable epoxy resin compositions and composites made therefrom

#30

20120025132

2012-02-02

Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition

#31