99243 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
Sub-classes:RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED USING THE SAME
#2Radiation-Curable Adhesive Composition
#3COATING COMPOSITIONS
#4NONELECTROLYTIC PLATING PRIMER COMPOSITION, LAMINATE, AND METHOD FOR MANUFACTURING SAME
#5METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHESIVES
#6CHEMICAL-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING HYDROXYARYL-TERMINATED POLYMER
#7PROCESSES FOR FORMING BISPHENOLS, EPOXY RESIN COMPOSITIONS
#8TWO-COMPONENT CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
#9CURABLE COMPOSITION AND CURED PRODUCT OF THE SAME, AND WAFER-LEVEL LENS
#10THERMOSETTING EPOXY RESIN COMPOSITION, MOLDED ARTICLE OF SAME, FIBER-REINFORCED COMPOSITE MATERIAL, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIALS, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL
#11Coating compositions
#12PHOTOCATIONICALLY CURABLE COMPOSITION AND DENTAL CURABLE COMPOSITION
#13Coating compositions
#14Photocurable composition and method for producing semiconductor device
#15COMPOSITION INCLUDING UNSATURATED POLYESTER RESIN, EPOXY RESIN, AND PHOTOINITIATOR AND METHOD OF USING THE SAME
#16INK-JET APPLICATION TYPE COMPOSITION FOR WIRING-LINE PROTECTION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE
#17Cationic curing agent, method for producing same and cationically curable composition
#18Anisotropic conductive film and method of producing the same
#19Coating composition and wood article manufactured therefrom
#20A CURABLE COMPOSITION AND A CURED PRODUCT THEREOF
#21Chemical-resistant protective film forming composition containing hydroxyaryl-terminated polymer
#22Curable resin composition
#23Epoxy resin composition, intermediate substrate, and fiber-reinforced composite material
#24Epoxy resin composition
#25Materials for photoinitiated cationic ring-opening polymerization and uses thereof
#26CATIONICALLY CURABLE COMPOSITIONS
#27CURABLE RESIN AND METHOD AND SYSTEM FOR INSULATING ELECTRICAL ITEMS THEREWITH
#28Chemical-resistant protective film-forming composition containing polymerization product of arylene compound having glycidyl group
#29Photocurable composition and liquid crystal display device
#30Encapsulating or filling composition for electronic devices and electronic apparatus
#31PROCESSES FOR PRODUCING VISCOUS EPOXY SYRUPS AND EPOXY SYRUPS OBTAINABLE THEREBY
#32Epoxy dual cure resins for additive manufacturing
#33Cationic polymerizable compositions and methods of use thereof
#34Two-part cyanoacrylate curable adhesive system
#35METHOD FOR PRODUCING A THREE-DIMENSIONAL OBJECT BY A MULTIPHOTON PHOTOPOLYMERISATION PROCESS, AND ASSOCIATED DEVICE
#36Epoxy resin material, preparation method therefor and application thereof
#37Coating compositions
#38Electrodeposition system
#39Corrosion Protected Mold Compound
#40Epoxy dual cure resins for additive manufacturing
#41Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
#42Anisotropic conductive film and method of producing the same
#43REINFORCED DYNAMICALLY CROSSLINKED POLYESTER NETWORK
#44Fast-curing epoxy systems
#45Process for frontal polymerization of cationically polymerizable monomers
#46Sulfonium salt, photoacid generator, photocurable composition, and cured product thereof
#47Light generating microcapsules for photo-curing
#48Sulfonium salt, heat- or photo-acid generator, heat- or photo-curable composition, and cured product thereof
#49Support-provided insulating layer, laminate, and wiring board
#50Cationic photoinitiator and preparation method and use thereof
#51Sealant composition, liquid crystal cell, and method of producing liquid crystal cell
#52Photocurable composition and method for producing semiconductor device
#53METHODS OF FORMING DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS USING FUNCTIONAL, POLYMERIC CHAIN EXTENDERS UNDER BATCH PROCESS
#54Monomer composition and curable composition containing same
#55MONOMER COMPOSITION AND CURABLE COMPOSITION CONTAINING SAME
#56Heat-curing Two-component Epoxide Resin
#57Curable composition, cured film, display panel or OLED light, and method for producing cured product
#58EPOXY CURATIVE COMPOSITION AND COMPOSITIONS THEREFROM
#59Adhesive compositions
#60Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
#61Light generating microcapsules for photo-curing
#62Controlled glass transition polymeric material and method
#63Rapid curing and high thixotropy epoxy adhesive compositions
#64Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same
#65ACTINIC RADIATION-INITIATED EPOXY ADHESIVE AND ARTICLES MADE THEREFROM
#66Cationic polymerizable compositions and methods of use thereof
#67Tow prepreg, composite material-reinforced pressure vessel, and method of producing composite material-reinforced pressure vessel
#68Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor
#69Initiators and use thereof for cationic photopolymerization
#70Fluorene derivative, method for producing the same, resin composition, and article
#71Solid insulation material
#72OPTICAL COMPONENT AND OPTICAL DEVICE EQUIPPED WITH SAME
#73Epoxy Resin Composition
#74Epoxy resin composition, molded article, prepreg, fiber-reinforced composite material and structure
#75Use of a composition for stabilizing a geological formation in oil fields, gas fields, water pumping fields, mining or tunnel constructions
#76FIBRILLATED DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS AND METHODS OF THEIR MANUFACTURE AND USE
#77Epoxy resin composition
#78THERMOSETTING RESIN COMPOSITION, ELECTRONIC PART, ELECTRIC MACHINE COIL, ELECTRIC MACHINE, AND CABLE
#79Fast curing optical adhesive
#80CATALYTIC SYSTEMS FOR THERMOSETTING RESINS WHICH ARE DEFORMABLE IN THE THERMOSET STATE
#81Electrodeposition system
#82Radiation curable resin composition and rapid three dimensional imaging process using the same
#83Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same
#84Liquid, hybrid UV/vis radiation curable resin compositions for additive fabrication
#85Curable composition and optical element obtained using same
#86MODIFIER FOR CURABLE COMPOSITIONS COMPRISING BENZYL ALCOHOL ALKOXYLATES
#87Sulfonate compound, photoacid generator, and resin composition for photolithography
#88Cationically photopolymerizable composition, bonding method, electronic device, method for manufacturing electronic device, display device and method for manufacturing display device
#89Methods of forming dynamic cross-linked polymer compositions
#90Thermoplastic epoxy matrix formulation, prepreg, composite and method for manufacturing the same
#91Monomer composition and curable composition containing same
#92Cycloaliphatic carbonates as reactive diluents in epoxy resins
#93Epoxy resin compositions
#94Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission
#95Heat-curable composition, dry film, and printed wiring board
#96Dual-cure cationically polymerisable composition and method for producing a coating or a composite material implementing said composition
#97Processes for producing viscous epoxy syrups
#98Sealing epoxy resin composition, hardened product, and semiconductor device
#99Optical waveguide photosensitive resin composition including a diaryliodonium cation-based photoacid generator, photocurable film for forming optical waveguide core layer, optical waveguide using same, and mixed flexible printed circuit board for optical/electrical transmission
#100Onium salt and composition comprising the same
#101Adhesive agent composition for multilayer semiconductor
#102Curable composition for sealing optical semiconductor
#103Photosensitive epoxy resin composition, curable film for formation of optical waveguide core layer, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition or the curable film
#104Photosensitive epoxy resin composition for optical waveguide, curable film for formation of optical waveguide, and optical waveguide and optical/electrical transmission hybrid flexible printed wiring board produced by using the photosensitive epoxy resin composition, and optical waveguide production method
#105Alkylphenyl derivatives and application thereof as photoinitiator
#106Photosensitive resin composition, photosensitive film, and method for forming resist pattern
#107Phase-segmented non-isocyanate elastomers
#108Thiol-cured elastomeric epoxy resins
#109Electrically conductive adhesive composition, connection structure, solar battery module, and method for producing same
#110Foam, composition, and method
#111Curable compositions
#112Cationic polymerizable compositions and methods of use thereof
#113Photosensitive resin composition, cured product thereof, and optical component
#114Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product
#115Shape memory epoxy materials using aromatic alcohol cure agents
#116Curable resin composition
#117Method of producing high voltage electrical insulation
#118Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same
#119Adhesive for polarizing plate, and polarizing plate comprising the same
#120Photocurable adhesive film for organic electronic device seal, organic electronic device and method for sealing same
#121Ink-jet print head comprising a layer made by a curable resin composition
#122Curable epoxy resin composition
#123Adhesive for polarizing plate and polarizing plate including the same
#124Pressure sensitive adhesives based on renewable resources, UV curing and related methods
#125High performance die attach adhesives (DAAs) nanomaterials for high brightness LED
#126Optical waveguide forming epoxy resin composition, optical waveguide forming curable film, light transmission flexible printed board, and production method for the flexible printed board
#127Foam, composition, and method
#128Pressure-sensitive adhesives with acid-epoxy crosslinking systems
#129Multicomponent resin system
#130Photosensitive resin composition production kit, and use thereof
#131Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device
#132Radiation curable composition
#133Epoxy structural adhesive
#134Thermosetting epoxy resin composition and uses thereof
#135Sealant, inkjet recording head using sealant, and method for manufacturing the same
#136CURABLE COMPOSITIONS
#137RADIATION CURABLE RESIN COMPOSITION AND RAPID THREE DIMENSIONAL IMAGING PROCESS USING THE SAME
#138Photosensitive resin composition, method for manufacturing structural body, and liquid discharge head
#139Photo-curable transparent resin composition
#140ORGANIC EL ELEMENT SEALING MEMBER
#141PROCESS FOR PRODUCTION OF CURED MOLDED ARTICLE, AND CURED MOLDED ARTICLE
#142Light-curing resin composition and optical material
#143Photosensitive composition
#144Aromatic sulfonium salt compound
#145Cationically curable compositions and a primer therefor
#146Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin
#147RESIN COMPOSITION FOR NANOIMPRINT, AND METHOD FOR FORMING STRUCTURE
#148Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility
#149Divinylarene dioxide resin compositions
#150Method of mounting electronic component and mounting substrate
#151EPOXY RESIN COMPOSITION
#152Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical property
#153PROCESSES FOR PRODUCING POLYALKYLENE CARBONATES
#154Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition
#155Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof
#156RESIN COMPOSITION FOR OPTICAL LENS AND OPTICAL PACKAGING
#157Bismuth-Containing Catalytic System for Polymerising Polymers
#158Method for determining the production parameters for a substrate coating process
#159Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
#160Resin composition for encapsulating semiconductor and semiconductor device using the same
#161Process for preparing self-healing composite materials of high efficiency for structural applications
#162Method for Preparing a Hard Film or Coating from a Cationically Cross-Linkable/Polymerizable Composition Comprising an Iodonium Borate and Giving Off an Acceptable Odour
#163Resist composition and method of forming resist pattern
#164Cationic photopolymerization initiator
#165Radiation curable resin composition and rapid three dimensional imaging process using the same
#166FLEXIBLE MICROELECTRONICS ADHESIVE
#167Chip attach adhesive to facilitate embedded chip build up and related systems and methods
#168Assembly of prepregs for producing structures, for example ones which deploy through inflation
#169Photocurable resin composition for sealing organic EL device
#170Sensitizer for cationic photoinitiators
#171Metal compounds for use as initiators
#172POLYMERS WITH TRANSMISSION INTO THE ULTRAVIOLET
#173Curable resin compositions and interlayer dielectric films
#174RADIATION-CURING RESIN COMPOSITION AND PREPREG
#175PHOTORADICAL- AND PHOTOCATION-CURABLE COMPOSITION
#176Adhesive composition and adhesive sheet
#177Uv curable electrically conductive film containing a polysilane
#178EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD
#179ADHESIVE COMPOSITIONS FOR HIGH TEMPERATURE SENSORS AND METHODS OF MAKING THE SAME
#180Epoxy Formulations for Use in Lithography Techniques
#181CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION
#182Low shrinkage epoxy-cationic curable compositions
#183Epoxy resin composition using latent curing agent and curable by photo and heat in combination
#184Rigidification of structures to be deployed by inflating, particularly for use in space
#185FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF
#186Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device
#187Article and associated method
#188Process for producing microparticulate hardening catalyst
#189Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
#190Curcumin and curcuminoid compounds, and use thereof as photosensitizers of onium salts
#191Ink Jet Ink
#192Base multiplying agents and base-reactive curable compositions
#193Actinic Ray Curable Composition, Actinic Ray Curable Ink, Image Forming Method Utilizing the Same, Ink-Jet Recording Apparatus and Epoxy Compound
#194Process and activated carbon catalyst for ring-opening polymerization
#195Heterocycle-bearing onium salts
#196Polymerizable composition
#197RADIATION CURABLE RESIN COMPOSITION FOR MAKING COLORED THREE DIMENSIONAL OBJECTS
#198Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same
#199Radiation curable resin composition and rapid prototyping process using the same
#200FLEXIBLE MICROELECTRONICS ADHESIVE
#201Flame retardative resin composition
#202Thermally curable compositions and method
#203Diluent free epoxy resin formulation
#204Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board
#205Low viscosity curable compositions
#206Photoinitiated Cationic Epoxy Compositions
#207Methods For Improving The Flux Compatibility Of Underfill Formulations
#208Fluorinated alkyl fluorophoshoric acid salts of onium and transition metal complex
#209Thermally stable cationic photocurable compositions
#210Photosensitive resin composition for optical waveguide formation and optical waveguide
#211Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
#212Photosensitive epoxy resin adhesive composition and use thereof
#213Radiation curable resin composition and rapid prototyping process using the same
#214METHOD OF MANUFACTURING A REPLICA AS WELL AS A REPLICA OBTAINED BY CARRYING OUT AN UV LIGHT-INITIATED CATIONIC POLYMERIZATION
#215Accelerator systems for low-temperature curing
#216Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound
#217Radiation curable resin composition for making colored three dimensional objects
#218Resin composition for photofabrication of three dimensional objects
#219Photo cation polymerizable resin composition and surface protective material for optical disk
#220Molding composition and method, and molded article
#221Cure catalyst, composition, electronic device and associated method
#222ACTIVE ENERGY RAY CURABLE COMPOSITION
#223Actinic radiation curable compositions and their use
#224Photosensitive epoxy resin adhesive composition and use thereof
#225Underfill encapsulant for wafer packaging and method for its application
#226Epoxy resin composition, process for providing latency to the composition and a semiconductor device
#227UV curable catalyst compositions
#228Ink for ink jet-recording curable through irradiation with a radioactive ray and method for preparing lithographic printing plates using the same
#229Radiation curable compositions having improved flexibility
#230Curable compositions and rapid prototyping process using the same
#231Epoxy resin composition
#232Photopolymerizable epoxide and oxetane compositions
#233Photocurable resin composition and resin composition for plastics comprising the same
#234Resin composition for encapsulating semiconductor chip and semiconductor device therewith
#235Refractory solid, adhesive composition, and device, and associated method
#236Ferrocenium-derived catalyst for cationically polymerizable monomers
#237Cationically photocurable epoxy resin compositions
#238Heterocycle-bearing onium salts
#239Phenol-reacted non-ester alicyclic diepoxides
#240Actinic ray curable composition, image forming method using the same and ink-jet recording apparatus using the same
#241Resin composition for photofabrication of three dimensional objects
#242Resin compositions and methods of use thereof
#243Solventless, non-polluting radiation curable coatings
#244Thermally stable cationic photocurable compositions
#245Cationic polymerizable composition, actinic ray curable ink-jet ink and stabilization method of the cationic polymerizable composition
#246Radiation curable resin composition for making colored three dimensional objects
#247Photocurable adhesive compositions, reaction products of which have low halide ion content
#248Cationically curable composition
#249Photoimaged dielectric polymer and film, and circuit package containing the same
#250Curable compositions and rapid prototyping process using the same
#251Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization
#252Catalysts for low-cure powder coatings and methods for using the same
#253Solventless, non-polluting radiation and thermal curable coatings
#254Curable epoxy compositions and articles made therefrom
#255Liquid, hybrid UV/vis radiation curable resin compositions for additive fabrication