Patents-Review.com
ClassID:

99619 ⎘

C08G73/0293 - CPC Classification

Classification description:

Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups  - ; Polyamines; Polyamidoamines Quaternisation of polyamidoamines

Recent Application in this class:
#1
20240277854
2024-08-22

IMMOLATIVE CELL-PENETRATING COMPLEXES FOR NUCLEIC ACID DELIVERY TO THE LUNG

 #2
20220143199
2022-05-12

Immolative cell-penetrating complexes for nucleic acid delivery to the lung

 #3
20210289782
2021-09-23

Polymers with antimicrobial functionalities

 #4
20210040265
2021-02-11

Chemical compositions with antimicrobial functionality

 #5
20200347265
2020-11-05

Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device

 #6
20200221695
2020-07-16

Polymers with antimicrobial functionalities

 #7
20200181328
2020-06-11

TWIN-TAIL HYDROCARBON SURFACTANTS FOR FOAM COMPOSITIONS

 #8
20200040136
2020-02-06

Biodegradable polyionenes

 #9
20190177479
2019-06-13

Chemical compositions with antimicrobial functionality

 #10
20190174756
2019-06-13

Polymers with antimicrobial functionalities

 #11
20190100499
2019-04-04

Metal plating compositions

 #12
20180345632
2018-12-06

Wood adhesive, method for adhering wood materials using the same, and composite wood structure using the same

 #13
20180334588
2018-11-22

Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device

 #14
20180327547
2018-11-15

Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device

 #15
20180179427
2018-06-28

Creping adhesives containing functionalized crosslinked resins

 #16
20180093957
2018-04-05

Metal plating compositions

 #17
20170073471
2017-03-16

Condensation polymers for antimicrobial applications

 #18
20160115315
2016-04-28

Resin compositions and methods for making and using same

 #19
20150353807
2015-12-10

Polyaminopolyamide-epichlorohydrin resins for use as clay and shale inhibition agents for the drilling industry

 #20
20150344708
2015-12-03

Swellable pre-treatment coating

 #21
20150320670
2015-11-12

Hair care polymer

 #22
20150068697
2015-03-12

Method for dissolving cationic starch, papermaking agent and its use

 #23
20130263520
2013-10-10

Aqueous resin composition for abrasive articles and resulting articles

 #24
20130198975
2013-08-08

Combined warp sizing and fixing agent and new method for fixing sulfur dyestuffs on warp

 #25
20130143008
2013-06-06

Liquid composition, recording method, and recorded matter

 #26
20120199299
2012-08-09

Wet strength resins derived from renewable resources

 #27
20120138473
2012-06-07

ZINC PLATING BATH ADDITIVE AND ALKALINE NON-CYANIDE ZINC PLATING BATH

 #28
20120092413
2012-04-19

Treatment solution for ink-jet recording, water-based ink set for ink-jet recording, ink-jet recording method and ink-jet recording apparatus

 #29
20110178218
2011-07-21

Ionic organic compound, production method thereof, hydrogelling agent composed of the ionic organic compound, hydrogel containing same, methanol gelling agent, methanol gel containing same, and carbon nanotube dispersant

 #30
20110114275
2011-05-19

RESIN PRECURSOR

 #31
20100147476
2010-06-17

Hydrophobically modified poly(aminoamides)

 #32
20080249049
2008-10-09

Polycationically charged polymer and the use of the same as a carrier for nucleic acid

 #33
20070179270
2007-08-02

Modified polyaminoamides

 #34
20050222377
2005-10-06

Stable wet strength resin

 #35
20050217817
2005-10-06

Stable wet strength resin