99646 ⎘
Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors; Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME
#2POLYIMIDE OR POLYIMIDE PRECURSOR, RESIN COMPOSITION, FILM
#3POLYIMIDE PRECURSOR COMPOSITION AND METHOD FOR PRODUCING THE SAME
#4RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#5PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
#6UNSATURATED CYCLIC ANHYDRIDE END CAPPED POLYIMIDES AND POLYAMIC ACIDS AND PHOTOSENSITIVE COMPOSITIONS THEREOF
#7SOLVENT-RESISTANT SELF-CROSSLINKED POLY(ETHER IMIDE)S
#8POLYIMIDES HAVING LOW DIELECTRIC LOSS
#9PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
#10SEMICONDUCTOR DEVICE AND METHOD
#11POLYMERS, COMPOSITIONS AND METHOD FOR MANUFACTURING AN ARTICLE BY 3D PRINTING
#12THERMOPLASTIC-THERMOSET HYBRID RESINS, METHODS, AND USES THEREOF
#13Variable Power Microwave Cured Polyimide, Polyimide Copolymers and Nanocomposites
#14Dual-cure method and system for fabrication of 3D polymeric structures cross-reference to earlier applications
#15Dual-cure method and system for fabrication of 3D polymeric structures cross-reference to earlier applications
#16Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
#17Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
#18Dual-cure method and system for fabrication of 3D polymeric structures cross-reference to earlier applications
#19COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
#20PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
#21UNSATURATED CYCLIC ANHYDRIDE END CAPPED POLYIMIDES AND POLYAMIC ACIDS AND PHOTOSENSITIVE COMPOSITIONS THEREOF
#22Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof
#23Semiconductor device and method
#24Dual-cure method and system for fabrication of 3D polymeric structures
#25Process for preparing polyimides
#26Polymer for liquid crystal aligning agent, liquid crystal aligning agent composition comprising the same, and liquid crystal aligning film and liquid crystal display device using the same
#27LASER-INITIATED ADDITIVE MANUFACTURING OF POLYIMIDE PRECURSOR
#28Semiconductor device and method
#29Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board
#30Composition for alignment layer, array substrate for display device comprising the same
#31Liquid crystal alignment composition, liquid crystal alignment film and liquid crystal display element
#32Photoaligning materials
#33Photoaligning materials
#34Production method for polyamide acid particles, production method for polyimide particles, polyimide particles and bonding material for electronic component
#35PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#36Polyimides as dielectric
#37Low temperature curable photosensitive resin composition and dry film manufactured by using the same
#38Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element
#39SPIN BOWL COMPATIBLE POLYAMIC ACIDS/IMIDES AS WET DEVELOPABLE POLYMER BINDERS FOR ANTI-REFLECTIVE COATINGS
#40Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same
#41Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films
#42Heat-resistant resin
#43Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part
#44Negative photosensitive polyimide polymer and uses thereof
#45Amic acid ester oligomer precursor composition for polyimide resin containing the same, and uses
#46Heat-Resistant Resin
#47Photo-alignment film and liquid crystal display element
#48Photosensitive resin and a method of preparing the same
#49Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
#50Composition for forming wiring protective film and uses thereof