ClassID:

99653

C08G73/105 - page 2 - CPC Classification

Classification description:

Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups  - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors; Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety

Recent Application in this class:
#301
20090263639
2009-10-22

Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto

#302
20090258211
2009-10-15

Polyimide film made of multicomponent polyimide and process of producing the same

#303
20090202831
2009-08-13

Insulated wire and insulating varnish used therefor

#304
20090192287
2009-07-30

Method of evaluating polymide dissolution rate, method of producing polymide, and polymide obtained using same methods

#305
20090182114
2009-07-16

Tetracarboxylic acid compound, polyimide thereof, and production method thereof

#306
20090156753
2009-06-18

Silphenylene compound and process for producing the same

#307
20090143521
2009-06-04

Polyimide material and preparation method thereof

#308
20090137770
2009-05-28

POLYMIDE OPTICAL COMPENSATION FILMS

#309
20090136689
2009-05-28

Liquid crystal display device

#310
20090093608
2009-04-09

POLYIMIDE MATERIAL WITH IMPROVED THERMAL AND MECHANICAL PROPERTIES

#311
20090075198
2009-03-19

Photosensitive polyimide resin composition

#312
20090069531
2009-03-12

Polyimide Film

#313
20090068482
2009-03-12

Polyimide resin, polyimide film, and polyimide laminate

#314
20090035591
2009-02-05

FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAME

#315
20080319161
2008-12-25

Method of purifying a polymer

#316
20080287642
2008-11-20

Process for production of polyimide film having high adhesiveness

#317
20080219135
2008-09-11

Method for high density data storage and imaging

#318
20070275222
2007-11-29

Porous insulating film and its laminates

#319
20070195682
2007-08-23

METHOD FOR HIGH DENSITY DATA STORAGE AND IMAGING

#320
20070154717
2007-07-05

Thermally stable composite material

#321
20070073035
2007-03-29

Method for making polyetherimides

#322
20070065603
2007-03-22

Liquid crystal display device

#323
20070059517
2007-03-15

Porous insulating film and its laminates

#324
20060178499
2006-08-10

Low dielectric constant organo-soluble polyimides

#325
20060142540
2006-06-29

Two-stage cure polyimide oligomers

#326
20060135732
2006-06-22

Cross-linked polyimide and method of making them

#327
20060063908
2006-03-23

Polyimide precursor liquid composition and polyimide coating film

#328
20060054589
2006-03-16

Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate

#329
20050165196
2005-07-28

Adhesive resin and film adhesive made by using the same

#330
20050048297
2005-03-03

Polyimide metal laminate