COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR MANUFACTURING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHODS FOR PREPARING CARBON MATERIALS

PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN

LIGNIN-MODIFIED NOVOLAC-TYPE PHENOL RESIN, METHOD FOR PRODUCING SAME, MOLDING MATERIAL, RESIN COMPOSITION, AND GRINDSTONE

HEAT-CURABLE RESIN COMPOSITION FOR FRICTION MATERIAL, AND FRICTION MATERIAL

RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD AND METHOD FOR PURIFYING RESIN

NOVEL FORMO-PHENOLIC RESINS, PROCESS FOR THE PREPARATION THEREOF, AND USE OF SAME IN THE EXTRACTION OF URANIUM FROM WATER

PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

Stable Lignin-Phenol Blend for Use in Lignin Modified Phenol-Formaldehyde Resins

Method for producing a binder composition, binder composition, and wood product

METHOD FOR PRODUCING POLYPHENOL DERIVATIVE, POLYPHENOL DERIVATIVE, AND POLYPHENOL DERIVATIVE-CONTAINING RESIN COMPOSITION MATERIAL

COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD, AND PURIFICATION METHOD

COMPOSITION, RESIST UNDERLAYER FILM, AND RESIST PATTERN-FORMING METHOD

BIS-PROPYLCATECHOL, METHOD FOR PRODUCING BIS-PROPYLCATECHOL, RESIN COMPOSITION AND CURED RESIN PRODUCT CONTAINING BIS-PROPYLCATECHOL, EPOXIDIZED BIS-PROPYLCATECHOL, METHOD FOR PRODUCING EPOXIDIZED BIS-PROPYLCATECHOL, AND CURABLE RESIN COMPOSITION AND CURED RESIN PRODUCT CONTAINING EPOXIDIZED BIS-PROPYLCATECHOL

COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD

Aromatic alcohol-lignin-aldehyde resins and processes for making and using same

Composition for forming resist underlayer film, resist underlayer film, method for forming resist pattern and method for producing semiconductor device

COMPOUND, RESIST COMPOSITION CONTAINING COMPOUND AND PATTERN FORMATION METHOD USING SAME

METHOD FOR PURIFYING COMPOUND OR RESIN AND METHOD FOR PRODUCING COMPOSITION

Hard-mask forming composition and method for manufacturing electronic component

Method for producing dihydroxynaphthalene condensate and dihydroxynaphthalene condensate

Method for increasing the reactivity of lignin

Halogen and polyhalide mediated phenolic polymerization

Method for increasing the reactivity of lignin

High-strength rubber composition comprising an aromatic polyphenol derivative

Novolak resins and resist materials

Composition for film formation, film, resist underlayer film-forming method, production method of patterned substrate, and compound

NOVOLAC-TYPE PHENOLIC HYDROXY GROUP-CONTAINING RESIN, AND RESIST FILM

Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same

Composition for forming organic film

LIQUID PHENOLIC RESOL RESIN, METHOD FOR PREPARING LIQUID PHENOLIC RESOL RESIN, AND ARTICLE

Resin containing phenolic hydroxyl groups, and resist film

Phenolic-hydroxyl-group-containing novolac resin and resist film

Resist base material, resist composition and method for forming resist pattern

Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming method

Resist underlayer film-forming composition, resist underlayer film, resist underlayer film-forming process, and production method of patterned substrate

COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, PATTERN FORMING METHOD, AND METHOD FOR PURIFYING COMPOUND OR RESIN

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT SUBSTRATE

Novolac phenol resin, manufacturing method therefor, photosensitive composition, resist material and coating film

Emulsion and suspension polymerization processes, and improved electrochemical performance for carbon derived from same

Resist underlayer film composition, patterning process, and compound

Pattern-forming method, resin, and composition

Use of low molecular weight lignin together with lignin for the production of a phenol-formaldehyde binder composition

Method for increasing the reactivity of lignin

Process for the high-yield preparation of P-(R)calix[9-20]arenes

Resist under layer film composition and patterning process

Organic layer composition and method of forming patterns

Composition for forming a resist underlayer film, and pattern-forming method

Method for increasing the reactivity of lignin

Compound containing phenolic hydroxy group, photosensitive composition, composition for resists, resist coating film, curable composition, composition for resist underlayer films, and resist underlayer film

Bio-Oil Polyols, Alkoxylated Bio-Oil Polyols and Bio-Oil Phenolic Resins

Compositions comprising lignin

Method for producing a composition for forming an organic film

Emulsion and suspension polymerization processes, and improved electrochemical performance for carbon derived from same

Cellular porous monoliths containing condensed tannins

Method for the high-yield production of giant P-(R)calixarenes

Composition for forming a resist underlayer film, and pattern-forming method

Clay-compatible additive for construction chemicals

Phenolic resin composition

Use of low molecular weight lignin together with lignin for the production of a phenol-formaldehyde binder composition

Liquid resol-type phenolic resin and wet paper friction material

Radiation-sensitive composition

Phenol monomer, polymer for forming a resist underlayer film including same, and composition for a resist underlayer film including same

Method for increasing the reactivity of lignin

Process for fungal modification of lignin and preparing wood adhesives with the modified lignin and wood composites made from such adhesives

Composition for forming resist underlayer film and pattern-forming method

Compositions comprising lignin

Positive photoresist composition, coating film thereof, and novolac phenol resin

Compositions comprising lignin

Radiation-sensitive composition

Adhesion-promoting system for rubber goods

Curing agent composition

PROCESS FOR PRODUCING CARBON MATERIAL

POLYACETAL RESIN COMPOSITION

Radiation-sensitive composition

Electric double-layer capacitor

Photoresist undercoat-forming material and patterning process

Modified phenol-formaldehyde resole resins, methods of manufacture, methods of use, and articles formed therefrom

Modified phenolic novolak resins and applications thereof

Phenol resin, use of a phenol resin as well as moulded product formed therefrom