100576 ⎘
Characterised by the use of epoxy resins; Derivatives of epoxy resins Epoxynovolacs
EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, FIBER-REINFORCED COMPOSITE MATERIAL, AND HIGH-PRESSURE GAS CONTAINER
#2PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, TUBULAR BODY MADE OF FIBER-REINFORCED COMPOSITE MATERIAL, GOLF CLUB SHAFT, AND FISHING ROD
#3FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS
#4PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE
#5PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING PREPREG, AND METHOD FOR MANUFACTURING METAL-CLAD LAMINATED PLATE
#6FORMALDEHYDE FREE SAFE TO USE BINDER FORMULATION FOR WOVEN, NONWOVEN AND GRANULAR MATERIALS
#7CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
#8DISPERSION OF NANOPARTICLES IN A POLYMERIC MATRIX
#9Flame retardant masterbatch composition for foams containing a pH moderator
#10PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION
#11COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
#12Self-adhesive prepreg
#13Flame retardant masterbatch composition for foams containing a pH moderator
#14Resin composition, prepreg containing same, laminate, and printed circuit board
#15Curable epoxy composition and its use in prepregs and core filling
#16Formaldehyde free safe to use binder formulation for woven, nonwoven and granular materials
#17USE OF BORON NITRIDE NANOSHEETS TO INCREASE COMPOSITE MODULUS AND DECREASE VISCOSITY AND PHASE SEPARATION IN COMPOSITES WITH HYDROPHOBIC MONOMERS
#18IMPROVED CURATIVE COMPOSITION
#19Molding material, fiber-reinforced composite article and method for producing fiber-reinforced composite article
#20Epoxy resin, epoxy resin composition, epoxy resin composition for carbon fiber-reinforced composite material, prepreg, and carbon fiber-reinforced composite material
#21Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor
#22Prepregs and production of composite material using prepregs
#23Thermoplastic toughened matrix resins containing nanoparticles
#24RESIN COMPOSITION AND MATERIALS CONTAINING A RESIN COMPOSITION
#25Fast-cure resin formulations with consistent handling characteristics
#26High temperature composite honeycomb
#27High Tg epoxy formulation with good thermal properties
#28RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR FABRICATING THE METAL-CLAD LAMINATE
#29Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board
#30Curable epoxy resin composition, fiber-reinforced composite material and molded body using same
#31Halogen-free epoxy resin composition and a prepreg and a laminate using the same
#32Resin composition and method of producing laminate
#33Curable epoxy resin composition, and fiber-reinforced composite material using same
#34Sheet-shaped prepreg
#35RESIN MATERIAL AND LAMINATE
#36Resin varnish, prepreg, laminate, and printed wiring board
#37Resin composition and method of producing laminate
#38Matrix resins toughened with hybrid polyamide particles
#39Resin composition for semiconductor package, prepreg, and metal clad laminate using the same
#40Fast-cure pre-preg
#41Thermoplastic particle-toughened prepreg for use in making composite parts which tolerate hot and wet conditions
#42QUARTZ GLASS FIBER-CONTAINING PREPREG, QUARTZ GLASS FIBER-CONTAINING FILM AND QUARTZ GLASS FIBER-CONTAINING SUBSTRATE
#43Epoxy resin, production method, epoxy resin composition and cured product of same
#44Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same
#45Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg
#46Thermosetting resin composition, sheet-molding compound and production method therefor, and fiber-reinforced composite material
#47Composite material with thermoplastic toughened novolac-based epoxy resin matrix
#48EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR
#49Molding compound having randomly oriented filaments and methods for making and using same
#50Method for producing FRP precursor and device for producing same
#51Prepreg tape and use thereof
#52FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES
#53High Tg epoxy formulation with good thermal properties
#54Prepregs and production of composite material using prepregs
#55Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board
#56Adhesive sheet
#57Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof
#58Semipreg with thermoplastic toughened novolac-based epoxy resin matrix
#59Resin composition, article of manufacture made therefrom and method of making the same
#60Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
#61Epoxy resin composition, prepreg, and fiber reinforced composite material
#62Composite material with thermoplastic toughened novolac-based epoxy resin matrix
#63Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
#64Resin composition and product made therefrom
#65EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
#66Adduct Thermosetting Surfacing Film and Method of Forming the Same
#67Halogen-free epoxy resin composition, prepreg and laminate using same
#68Resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same
#69Bump-forming material, method for producing electronic component, method for producing semiconductor device, and semiconductor device
#70Particulate poly(phenylene ether)-containing varnish composition, composite and laminate prepared therefrom, and method of forming composite
#71Curable Epoxy Composition Including Accelerator
#72Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article
#73Fast curing high glass transition temperature epoxy resin system
#74Continuous process for polymer/fiber molding compounds using polymer dispersions
#75Methods, systems and apparatuses for curing epoxy-containing prepreg composite assembly
#76Phosphazene compound, a prepreg and a composite metal laminate
#77Bonding of composite materials
#78Phosphazene compound, and a composition, a prepreg and a wiring board comprising the same
#79THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME
#80Epoxy systems employing triethylaminetetraamine and tin catalysts
#81Resin composition, prepreg, and laminated sheet
#82Peel ply, method of surface preparation and bonding composite structures using the same
#83Composites and epoxy resins based on aryl substituted compounds
#84Thermosetting resin composition and prepreg and laminate both made with the same
#85Protective film forming film, protective film forming sheet and work product manufacturing method
#86Method for producing molded article, molded article, back plate and brake pad
#87Fast curing high glass transition temperature epoxy resin system
#88HALOGEN FREE EPOXY FORMULATIONS WITH LOW DIELECTRIC CONSTANT
#89Novolac curing agent with alkoxysilyl group, method for preparing the same, composition containing the same, the cured product, and use thereof
#90Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#91Reinforcing fiber fabric substrate, preform, and fiber-reinforced composite material
#92Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same
#93Rapidly curing adhesives using encapsulated catalyst and focused ultrasound
#94AN EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER-CLAD LAMINATE MADE BY USING SAME
#95Flame retardant for epoxy resin containing phosphonate and phosphinate functionality
#96Curable epoxy compositions
#97Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device
#98CYANATE RESIN COMPOSITION AND USE THEREOF
#99CYANATE RESIN COMPOSITION AND USE THEREOF
#100Carbon fibre-containing prepregs
#101High Tg epoxy formulation with good thermal properties
#102ADDUCT AND THERMOSETTING SURFACING FILM AND METHOD OF FORMING THE SAME
#103RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE
#104EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
#105Sprayable, carbon fiber-epoxy material and process
#106Fiber reinforced polymer composite with a hard interphase
#107Photosensitive resin composition and photosensitive film using same
#108THERMOSETTING RESIN COMPOSITION AND ITS USAGE
#109HIGH MODULUS FIBER REINFORCED POLYMER COMPOSITE
#110Resin composition, prepreg, metal foil-clad laminate and printed wiring board
#111Epoxy Resin Composition, Prepreg, and Fiber-Reinforced Composite Material
#112Bonding of composite materials
#113Carbon fiber forming raw material, formed material, and carbon fiber-reinforced composite material
#114Composites and epoxy resins based on aryl substituted compounds
#115Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment
#116Resin composition and uses of the same
#117FIBER-REINFORCED COMPOSITE MATERIAL
#118Adduct thermosetting surfacing film and method of forming the same
#119EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL
#120EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRONIC OR ELECTRICAL COMPONENT
#121THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE BOTH MADE WITH THE SAME.
#122Thermosetting resin composition and prepreg and laminate obtained with the same
#123Dielectric composition for use in circuitized substrates and circuitized substrate including same