ClassID:

100578

C08J2363/08 - CPC Classification

Classification description:

Characterised by the use of epoxy resins; Derivatives of epoxy resins Epoxidised polymerised polyenes

Recent Application in this class:
#1
20260015455
2026-01-15

EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME

#2
20250341050
2025-11-06

Bio-Based Artificial Leather and Method

#3
20240327566
2024-10-03

Vegetable oil-derived epoxy compositions having improved performance

#4
20220259424
2022-08-18

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

#5
20210371579
2021-12-02

Vegetable oil-derived epoxy compositions having improved performance

#6
20180086911
2018-03-29

Resin composition, article of manufacture made therefrom and method of making the same

#7
20170298218
2017-10-19

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

#8
20170292018
2017-10-12

High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof

#9
20170198135
2017-07-13

Halogen free resin composition and prepreg and laminated board prepared therefrom

#10
20170156207
2017-06-01

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME

#11
20160355645
2016-12-08

Sizing composition for reinforcing fibres and applications thereof

#12
20160297921
2016-10-13

CURABLE EPOXY COMPOSITION, FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE

#13
20160257812
2016-09-08

Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article

#14
20160244471
2016-08-25

PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF

#15
20160234934
2016-08-11

Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board

#16
20120259028
2012-10-11

REACTIVE POLYMERIC MIXTURE

#17
20110207378
2011-08-25

USE OF POLYMERISABLE RESINS WITH LOW VACUUM OUTGASSING FOR THE MANUFACTURE OF COMPOSITE MATERIALS FOR USE IN SPACE

#18
20100294548
2010-11-25

Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board

#19
20100143728
2010-06-10

Thermosetting resin composition and prepreg and laminate obtained with the same