ClassID:

100637

C08J2383/16 - CPC Classification

Classification description:

Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms

Recent Application in this class:
#1
20260062520
2026-03-05

THERMOPLASTIC RESIN AND MOLDED OBJECT INCLUDING THERMOPLASTIC RESIN

#2
20250161976
2025-05-22

NEW LOW-K MATERIALS DERIVED BY HYDROSILYLATION AND METHODS OF USING THEM FOR DEPOSITION

#3
20230303775
2023-09-28

Polycarbosilazane, and composition comprising the same, and method for producing silicon-containing film using the same

#4
20210403659
2021-12-30

Resin composition, prepreg for printed circuit and metal-coated laminate

#5
20210115253
2021-04-22

Film forming composition and film forming method using the same

#6
20200270456
2020-08-27

SILICON-CONTAINING RESIN COMPOSITION

#7
20200102432
2020-04-02

FLAME-RESISTANT STRUCTURAL COMPOSITE MATERIAL

#8
20200024408
2020-01-23

CROSSLINKABLE POLYMER COMPOSITION WITH CURING CATALYST

#9
20190106595
2019-04-11

Method for preparing a barrier film

#10
20180201736
2018-07-19

Composition for forming coating film and method for forming coating film using same

#11
20180187010
2018-07-05

Silicon-containing resin composition

#12
20180002508
2018-01-04

Film with void spaces bonded through catalysis and method of producing the same

#13
20170306120
2017-10-26

Optical member, optical semiconductor device, and illumination apparatus

#14
20170144935
2017-05-25

Silicon-based polymer-derived ceramic composites comprising H-BN nanosheets

#15
20170107381
2017-04-20

ANTIFOULING SHEET

#16
20170088684
2017-03-30

Gas barrier laminated body, method for producing same, member for electronic device, and electronic device

#17
20160362580
2016-12-15

Hybrid material for optoelectronic applications

#18
20160244638
2016-08-25

Film-forming composition and film-forming method using same

#19
20160172552
2016-06-16

Encapsulation material for light emitting diodes

#20
20150252152
2015-09-10

Method for forming bond between different elements

#21
20150247265
2015-09-03

Method for curing of green polysilazane-based silicon carbide precursor fibers

#22
20140284306
2014-09-25

METHOD FOR MANUFACTURING POROUS STRUCTURE AND METHOD FOR FORMING PATTERN

#23
20130122763
2013-05-16

COMPOSITE MATERIALS

#24
20120318662
2012-12-20

METHOD FOR FORMING BOND BETWEEN DIFFERENT ELEMENTS

#25
20120041121
2012-02-16

Method for manufacturing porous structure and method for forming pattern

#26
20120037595
2012-02-16

Method for manufacturing porous structure and method for forming pattern

#27
20120037594
2012-02-16

Method for manufacturing porous structure and method for forming pattern

#28
20090130380
2009-05-21

Method for manufacturing porous structure and method for forming pattern

#29
20080268264
2008-10-30

Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation

#30
20080234163
2008-09-25

SOLVENT FOR TREATING POLYSILAZANE AND METHOD OF TREATING POLYSILAZANE WITH THE SOLVENT

#31
20070270625
2007-11-22

Treatment of Polysilazane Waste

#32
20060231525
2006-10-19

Method for manufacturing porous structure and method for forming pattern

#33
20050119402
2005-06-02

Hydrophilicity promoting and maintaining agent for polysilazane-containing coating films and method of using same

#34
20050027089
2005-02-03

Solvent for treating polysilazane and method of treating polysilazane with the solvent