100861 ⎘
Characterised by the use of epoxy resins; Derivatives of epoxy resins Polyglycidyl ethers of bis-phenols
POLYAMIDE ADHESIVE AND INSULATING COMPOSITE LAYER AND PREPARATION METHODS AND USES THEREOF
#2RESIN COMPOSITION, PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
#3FIBER-REINFORCED THERMOPLASTIC RESIN MOLDED ARTICLE
#4ELASTIC RESIN COMPOSITION, AND RESIN FILM, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED SHEET, WIRING BOARD AND CIRCUIT MOUNTED ARTICLE OBTAINED USING SAME
#5THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME
#6CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED FIBER-REINFORCED RESIN ARTICLE
#7CONDUCTING POLYMER COMPOSITES CONTAINING IRON OXIDE/HYDROXIDE AND THEIR PREPARATION USING FERRATE SALTS
#8PREPREG, METHOD FOR PRODUCING SAME, AND SLIT TAPE PREPREG
#9SMA resin formulation
#10Methods for treating thermoplastic polyurethane covers for golf balls with epoxy compositions
#11FIBER-REINFORCED THERMOPLASTIC RESIN MOLDED ARTICLE
#12Extraction Materials for In-Situ Consolidation and Multi-Packaging of Underwater Fragile Cultural Relics, and Extraction and Restoration Methods
#13Self-adhesive prepreg
#14Thermosetting sheet, dicing die bonding film, and semiconductor apparatus
#15Catalyst-doped sizing agent for preparation of high areal weight fiber shelf-stable prepreg or molding compound intermediates
#16Interlayer insulating material and multilayer printed wiring board
#17Methods for treating thermoplastic polyurethane covers for golf balls with epoxy compositions
#18IMPROVEMENT OF IMPACT PROPERTIES OF DYNAMICALLY CROSS-LINKED NETWORKS BY USING REACTIVE IMPACT MODIFIERS
#19MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR
#20Curable epoxy resin composition, and fiber-reinforced composite material using same
#21Metal-clad laminate, circuit board, and multilayer circuit board
#22Prepreg, method for producing same, and slit tape prepreg
#23CURABLE EPOXIDE/POLYURETHANE HYBRID RESIN SYSTEM FOR SMCS
#24SMA resin formulation
#25LOW-VISCOSITY EPOXY RESINS AND LOW VOC CURABLE FORMULATIONS THEREFROM
#26Particulate curing components
#27Methods for treating thermoplastic polyurethane covers for golf balls with epoxy compositions
#28Reinforced thermoplastic resin composition and molded article thereof
#29Preform, fiber-reinforced composite material, and method of manufacturing fiber-reinforced composite material
#30THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
#31EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION OF EPOXY RESIN COMPOSITION
#32Adhesive sheet
#33FIBRILLATED DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS AND METHODS OF THEIR MANUFACTURE AND USE
#34Pumpable and thermally expandable filler compositions
#35Composition comprising a multistage polymer, its method of preparation and its use
#36Composite material with thermoplastic toughened novolac-based epoxy resin matrix
#37Epoxy resin composition for fiber-reinforced composite material, method for producing epoxy resin composition for fiber-reinforced composite material, prepreg, and honey-comb panel
#38Resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same
#39Fiber reinforced thermoplastic resin molding material, and fiber reinforced thermoplastic resin molded article
#40Triple shape memory composite foams
#41FILM ADHESIVE
#42Methods of forming dynamic cross-linked polymer compositions
#43Bonding of composite materials
#44PRIMER COMPOSITION AND COMPOSITE ARTICLE
#45Reinforced thermoplastic resin composition and molded article thereof
#46Method for Preparing Fiber-Reinforced Parts Based on Cyanate Ester/Epoxy Blends
#47Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate
#48Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
#49Reinforcing fiber fabric substrate, preform, and fiber-reinforced composite material
#50Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same
#51Polyamide resin composition, method of manufacturing and molded product
#52Epoxy resin composition, fiber-reinforced composite material, and method for producing the same
#53Prepreg, fiber-reinforced composite material, and resin composition containing particles
#54Epoxy resin formulations
#55Nanoparticulates and a linear polymer delivery system
#56Prepreg, fiber-reinforced composite material, and resin composition containing particles
#57Fiber-reinforced thermoplastic resin prepreg, molded body of same, and method for producing fiber-reinforced thermoplastic resin prepreg
#58RELEASE FILM
#59Underfill material and method for manufacturing semiconductor device using the same
#60FIRE RETARDANT EPOXY RESIN FORMULATIONS AND THEIR USE
#61Fiber-reinforced epoxy resin material, prepreg and, tubular body made of fiber-reinforced epoxy resin material
#62Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and cured materials thereof
#63Epoxy resin composition
#64Fiber-reinforced composite material
#65Bonding of composite materials
#66Resin-coated metal sheet for containers
#67COATED ARTICLE COMPRISING CURABLE EPOXY COMPOSITION WITH QUATERNARY AMMONIUM BICARBONATE CURING CATALYST, AND METHOD FOR PREPARING
#68METHOD OF FABRICATING A COMPOSITE STRUCTURE WITH A CONDUCTIVE SURFACE
#69METHOD FOR PREPARING MULTILAYER ARTICLE BY CURING A CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT
#70EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME
#71Epoxy resin varnishes, laminates and printed circuit boards
#72Circuit build-up film for wafer-level packaging, and fabrication method and use thereof
#73Retaining compressive strength of thermoplastic-toughened epoxy composites under hot and wet conditions