100864 ⎘
Characterised by the use of epoxy resins; Derivatives of epoxy resins Epoxidised polymerised polyenes
THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
#2Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
#3PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF
#4Resin-coated metal sheet for containers