ClassID:

100881

C08J2471/10 - CPC Classification

Classification description:

Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain ; Derivatives of such polymers; Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols

Sub-classes:
Recent Application in this class:
#1
20240343901
2024-10-17

POLYMER COMPOSITION BASED ON POLY(METH)ACRYLIMIDE FOR TRIBOLOGICAL APPLICATIONS

#2
20240317950
2024-09-26

BONDING FILMS

#3
20240254332
2024-08-01

BLENDS OF POLY(ETHERKETONEKETONE) POLYMERS

#4
20240066758
2024-02-29

PREPREG, MOLDED ARTICLE, AND INTEGRALLY MOLDED ARTICLE

#5
20230416486
2023-12-28

MICROPOROUS ARTICLES AND CORRESPONDING FORMATION METHODS

#6
20230212386
2023-07-06

EPOXY MOLDING COMPOUNDS, PREPARATION METHOD THEREOF, AND USE THEREOF

#7
20230174772
2023-06-08

Insulating film, metal-clad laminate member, and rewiring layer

#8
20230131319
2023-04-27

PEI or PEI-PEEK particle foams for applications in lightweight construction

#9
20230028442
2023-01-26

SLIDING TENDONS FOR HIGH-STRAIN ELASTOMER ACTUATORS

#10
20220356349
2022-11-10

RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

#11
20190345324
2019-11-14

CURABLE EPOXY COMPOSITION AND CIRCUIT MATERIAL PREPREG, THERMOSET EPOXY COMPOSITION, AND ARTICLE PREPARED THEREFROM

#12
20190338119
2019-11-07

RESIN COMPOSITION FOR BONDING METAL, PRODUCTION FORMED BY BONDING METAL WITH RESIN COMPOSITION, AND MANUFACTURING METHOD THEREOF

#13
20190127581
2019-05-02

HIGH-FLOW POLYPHENYLSULFONE COMPOSITIONS

#14
20190093907
2019-03-28

Blended membranes for water vapor transport and methods for preparing same

#15
20190077932
2019-03-14

Rubberized textile material for a belt ply, associated rubber mixture and belt

#16
20180134856
2018-05-17

Press-molded product and composite material

#17
20180090655
2018-03-29

COMPOSITE MATERIAL FOR THERMOELECTRIC DEVICES

#18
20180072884
2018-03-15

Resin composition, copper clad laminate and printed circuit board using same

#19
20180009960
2018-01-11

FIBER-REIMFORCED MOLDED BODIES MADE OF EXPANDED PARTICLE FOAM MATERIAL

#20
20170253013
2017-09-07

Thermosetting resin composition and prepreg and laminated board prepared therefrom

#21
20170184317
2017-06-29

Blended membranes for water vapor transport and methods for preparing same

#22
20170129225
2017-05-11

Polymeric materials

#23
20160222204
2016-08-04

Resin composition, copper clad laminate and printed circuit board using same

#24
20150344649
2015-12-03

FIRE RETARDANT EPOXY RESIN FORMULATIONS AND THEIR USE

#25
20150299407
2015-10-22

FAST CURE EPOXY RESIN SYSTEMS

#26
20120241686
2012-09-27

Carbon nanotube masterbatch, preparation thereof, and use in forming electrically conductive thermoplastic composition

#27
20110152420
2011-06-23

POLY(ARYLENE ETHER)/POLYAMIDE COMPOSITIONS, METHODS, AND ARTICLES

#28
20090275718
2009-11-05

Resin composition and optical films formed by using the same