ClassID:

101129

C08K5/3155 - CPC Classification

Classification description:

Use of organic ingredients; Nitrogen-containing compounds; Compounds containing carbon-to-nitrogen triple bonds Dicyandiamide

Recent Application in this class:
#1
20250243363
2025-07-31

HEAT-CURABLE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE, AND COMMUNICATION DEVICE

#2
20250206921
2025-06-26

RESIN COMPOSITION FOR DIE ATTACH FILM WITH EXCELLENT PERFORMANCE WITH LARGE DIE APPLICATIONS

#3
20250188268
2025-06-12

SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL

#4
20250171629
2025-05-29

Mass Colored Polymer Composition For Use In Medical Technology Applications

#5
20250163267
2025-05-22

THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE AND COMMUNICATION DEVICE

#6
20250163229
2025-05-22

PREPREG, FIBER-REINFORCED COMPOSITE ARTICLE, AND METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE ARTICLE

#7
20250043127
2025-02-06

CURABLE EPOXY COMPOSITIONS FOR LOW TEMPERATURE CURING AND STRUCTURAL ADHESIVE THEREFROM, AND METHODS OF USING SAME

#8
20250026928
2025-01-23

CROSSLINKABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE AND HEAT-RESISTANT MEMBER

#9
20240417605
2024-12-19

EPOXY STRUCTURAL ADHESIVES RESISTANT TO UNCURED AND CURED HUMIDITY EXPOSURE

#10
20240409699
2024-12-12

RUBBER PARTICLES, COMPOSITE PARTICLES, AND MANUFACTURING METHODS THEREFOR

#11
20240391207
2024-11-28

SURFACE VEIL AND SURFACE FILM INTEGRATED PREPREG LAYER AND PROCESSES FOR MAKING THE SAME

#12
20240336738
2024-10-10

RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS

#13
20240101860
2024-03-28

COATING COMPOSITION

#14
20230312855
2023-10-05

PUMPABLE AND THERMALLY EXPANDABLE FILLER COMPOSITIONS WITH PROLONGED OPEN TIME

#15
20230046977
2023-02-16

Sheet molding compound and fiber-reinforced composite material

#16
20220340725
2022-10-27

Surface veil and surface film integrated prepreg layer and processes for making the same

#17
20220041898
2022-02-10

LOW MODULUS, HIGH ELONGATION STRUCTURAL ADHESIVES AND ASSOCIATED BONDED SUBSTRATES

#18
20220033686
2022-02-03

Structural adhesive tape and method of manufacturing the same

#19
20210284834
2021-09-16

Fire-retardant resins and composite materials

#20
20210095080
2021-04-01

THERMALLY CONDUCTIVE SHEET PRECURSOR, THERMALLY CONDUCTIVE SHEET OBTAINED FROM THE PRECURSOR, AND PRODUCTION METHOD THEREOF

#21
20200339773
2020-10-29

Surface veil and surface film integrated prepreg layer and processes for making the same

#22
20200308358
2020-10-01

Toughened adhesive and bonding method using the same

#23
20200255651
2020-08-13

Curable epoxy resin composition and fiber-reinforced composite material using same

#24
20200087438
2020-03-19

POLYURETHANE FOAMS BASED ON POLYETHERCARBONATE POLYOLS

#25
20200071524
2020-03-05

Cyanate ester resin composition and prepreg

#26
20200032047
2020-01-30

SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL

#27
20190338116
2019-11-07

Mass Colored Polymer Composition For Use In Medical Technology Applications

#28
20180305611
2018-10-25

Color conversion composition, color conversion sheet and light source unit including the same, display, lighting apparatus, backlight unit, LED chip, and LED package

#29
20180051126
2018-02-22

RESIN COMPOSITION, CONDUCTIVE RESIN COMPOSITION, ADHESIVE, CONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE

#30
20160297968
2016-10-13

Thermoset modified additive for asphalt mixture, preparation method thereof and asphalt mixture

#31
20150031819
2015-01-29

Anticorrosion coatings

#32
20130065978
2013-03-14

Additives for improving natural oil based polyurethane foam performance

#33
20120288659
2012-11-15

Adhesive sheet and bonding method using the same

#34
20120258314
2012-10-11

SINGLE-COMPONENT EPOXY RESIN COMPOSITION AND USE THEREOF

#35
20120071585
2012-03-22

EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

#36
20110303446
2011-12-15

Epoxy resin composition, and prepreg and printed circuit board using the same

#37
20110143136
2011-06-16

FLUOROPOLYMER FILM WITH EPOXY ADHESIVE

#38
20100261837
2010-10-14

DIMETHYLFORMAMIDE-FREE FORMULATIONS USING DICYANADIAMIDE AS CURING AGENT FOR THERMOSETTING EPOXY RESINS

#39
20100225069
2010-09-09

OIL RESISTANT RTV SILICONE

#40
20100155123
2010-06-24

Halogen-free prepreg and resin for preparing the same

#41
20100036032
2010-02-11

Vanish, heat-dissipation prepreg, and manufacturing method thereof

#42
20090171003
2009-07-02

Gas-barrier composition, coating film and method for production of the same, and layered material

#43
20070087201
2007-04-19

Self-bonding coating composition

#44
20060293448
2006-12-28

Gas-barrier composition, coating film and method for production of the same, and layered material

#45
18931127
2025-03-18

Packaging film and preparation method thereof, and filter chip packaging method

#46
16375087
2024-01-09

Nitrification inhibiting compositions and their use in agricultural applications