101154 ⎘
Use of organic ingredients; Nitrogen-containing compounds; Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
Sub-classes:POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR
#2Film forming composition
#3THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR MOUNTED ARTICLE
#4Porous polyurethane polishing pad and method for manufacturing same
#5Resin composition for sealing semiconductor and semiconductor device
#6Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
#7Coated film
#8Polymer production method
#9Resin composition
#10Hindered amine light stabilizer, methods of making, and compositions
#11Stabilization of thermoplastic nanocomposites
#12Acrylic resin