101494 ⎘
Compositions of condensation polymers of aldehydes or ketones ; Compositions of derivatives of such polymers Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups , and
INSULATED WIRES
#2UREA-GLYOXAL CROSSLINKING COMPOUNDS FOR PHENOLIC BINDER COMPOSITIONS
#3METHODS FOR SOL-GEL POLYMERIZATION IN ABSENCE OF SOLVENT AND CREATION OF TUNABLE CARBON STRUCTURE FROM SAME
#4MODIFIED PHENOLIC RESINS FOR MAKING COMPOSITE PRODUCTS
#5UREA-GLYOXAL CROSSLINKING COMPOUNDS FOR PHENOLIC BINDER COMPOSITIONS
#6Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
#7BENZOXAZINES AND COMPOSITIONS CONTAINING THE SAME
#8Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device
#9Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
#10Urea-glyoxal crosslinking compounds for phenolic binder compositions
#11Composite materials containing benzoxazines and method for making the same
#12Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
#13Hard-mask forming composition and method for manufacturing electronic component
#14Functionalized rubber composition
#15Modified wood product and a process for producing said product
#16Oxazine compound, composition and cured product
#17Method for preparing ligand for polyketone polymerization catalyst
#18Oxazine compound, composition and cured product
#19Surface-modified inorganic substance, method for manufacturing same, resin composition, thermally conductive material, and device
#20Core-shell particle-based security pigment, and production method
#21Core-shell particle-based security pigment and method for production thereof
#22Security pigment based on core-shell particles, and production method
#23POLYMERS, COMPOSITES, AND METHODS FOR MAKING POLYMERS AND COMPOSITES
#24FRICTION MATERIAL COMPOSITION, AND FRICTION MATERIAL AND FRICTION MEMBER USING SAID FRICTION MATERIAL COMPOSITION
#25Cyanate ester compound, curable resin composition containing the compound, and hardened product thereof
#26Dispersing additive for asphaltenes and its uses
#27Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
#28Benzoxazine low temperature curable composition
#29Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#30High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof
#31Cyanic acid ester compound and method for producing same, resin composition, and cured product
#32Polymers, composites, and methods for making polymers and composites
#33Fluoropolymer composition
#34Structural adhesive compositions
#35Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product
#36Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
#37Halogen-free flame retardant type resin composition
#38Reaction Hybrid Benzoxazine Resins and Uses Thereof
#39High temperature three dimensional printing compositions
#40Friction material
#41High residual content (HRC) kraft/soda lignin as an ingredient in wood adhesives
#42Treated aldehyde-based resins containing polyamines and methods for making and using same
#43Thermosetting resin composition
#44Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same
#45Halogen-free resin composition and uses thereof
#46Thermosetting resin composition containing polymer having specific terminal structure
#47Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition
#48Prepreg, fiber-reinforced composite material, and resin composition containing particles
#49Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
#50Polymers, composites, and methods for making polymers and composites
#51Clay-compatible additive for construction chemicals
#52Aqueous binder compositions of aliphatic or cycloaliphatic dicarboxaldehydes and resorcinol
#53Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition
#54Prepreg, metal foil-clad laminate, and printed wiring board
#55Composite maillard-resole binders
#56Flame Retardant Material with Orthogonally Functional Capsules
#57Benzoxazines and compositions containing the same
#58Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor
#59Phenolic resin molding compound
#60FORMULATION AND USE THEREOF
#61PHENOLIC RESIN FOAMED PLATE AND METHOD FOR PRODUCING SAME
#62Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
#63CYANATE ESTER RESIN COMPOSITION, AND PREPREG AND LAMINATE MADE THEREFROM
#64ANTISEPTIC COMPOSITION FOR ENGINEERING WOOD PRODUCTION, AND ENGINEERING WOOD
#65Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility
#66Method of sealing a semiconductor element with an epoxy resin composition
#67THERMOSENSITIVE IMAGING COMPOSITION AND LITHOGRAPHIC PLATE COMPRISING THE SAME
#68Epoxy resin composition, and prepreg and printed circuit board using the same
#69Composite maillard-resole binders
#70PHENOL NOVOLAC RESIN, PHENOL NOVOLAC EPOXY RESIN AND EPOXY RESIN COMPOSITION
#71RUBBER COMPOSITION
#72Binder for materials based on wood chips and/or wood fibers, method for the production of said binder, and molded article
#73RESIN FOR PRODUCING AN INORGANIC FIBER MATERIAL
#74PHENOL RESIN COMPOSITION, CURED ARTICLE THEREOF, RESIN COMPOSITION FOR COPPER-CLAD-LAMINATE, COPPER-CLAD LAMINATE, AND NOVEL PHENOL RESIN
#75PHENOLIC RESIN, METHOD OF PREPARATION, SIZING COMPOSITION FOR MINERAL FIBRES, AND RESULTING PRODUCTS
#76Gluing and Sealing Compounds Having Antimicrobial Properties
#77Thermosetting composition
#78Thermosetting composition
#79PHENOLIC RESIN, METHOD OF PREPARATION , SIZING COMPOSITION FOR MINERAL FIBRES, AND RESULTING PRODUCTS
#80Formaldehyde-free phenolic resin binder
#81Phenolic resin, production method and use thereof
#82Functional cornstalk board and preparation method thereof
#83Dispersion
#84Thermosetting resin material
#85Flame-Resistant Amino Resin System
#86Anti-bacterial additive
#87Adhesives
#88Stable phenolic resin polymer dispersions having low free aldehyde content
#89Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler
#90Modified phenol-formaldehyde resole resins, methods of manufacture, methods of use, and articles formed therefrom
#91Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
#92Adhesive compositions for bonding lignocellulosic materials, bonding methods and apparatus, and bonded articles
#93Conducting polymer for pretreatment of metallic and non-metallic surfaces
#94Method for recovering, regenerating and repairing polymer