PREPREG AND FIBER-REINFORCED PLASTIC

RAPID-CURING RESIN COMPOSITION AND COMPOSITE MATERIAL CONTAINING THE SAME

Crosslinking compositions and coatings formed therefrom

Crosslinking compositions and coatings formed therefrom

CATALYST-FREE CURABLE EPOXY COMPOSITIONS

CURABLE EPOXY COMPOSITIONS

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Powder coating compositions with a polymeric aromatic product of an aromatic isocyanate manufacturing process

Long-chain alkylene group-containing epoxy resin composition

Epoxy resin composition, prepreg, and fiber reinforced material

High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof

Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection

White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case

Thermosetting resin composition, sliding member and method for producing sliding member

Coated film

Epoxy resin composition and light-emitting apparatus using the same

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

Epoxy resin composition and light emitting apparatus

Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same

Long chain alkylene group-containing epoxy compound

EPOXY RESIN COMPOSITION FOR OPTICAL USE, OPTICAL COMPONENT USING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING THE SAME

THERMOSETTING RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED MATERIAL THEREOF, AND OPTICAL-SEMICONDUCTOR DEVICE OBTAINED USING THE SAME

White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

HARDENABLE SELF-SUPPORTING STRUCTURES AND METHODS

Thermosetting epoxy resin composition and semiconductor device

Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same

Resin composition, molded article and production method thereof

Hardenable self-supporting structures and methods

Optoelectronic device

Modified epoxy resin composition

Coating compositions comprising epoxy resins and aminofunctional silicone resins

Liquid coating compositions that include a compound formed from at least one polyfunctional isocyanurate, related multi-layer composite coatings, methods and coated substrates

Epoxy resin composition with soda lime glass filler