ClassID:

103331

C09D161/18 - CPC Classification

Classification description:

Coating compositions based on condensation polymers of aldehydes or ketones ; Coating compositions based on derivatives of such polymers Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only

Recent Application in this class:
#1
20250377597
2025-12-11

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERN FORMING METHOD, AND POLYMER

#2
20250147418
2025-05-08

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE

#3
20230416560
2023-12-28

SURFACE TREATMENT AGENT AND METHOD OF PRODUCING SUBSTRATE HAVING SURFACE-TREATED LAYER

#4
20230183450
2023-06-15

FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE

#5
20210296120
2021-09-23

Method of filling high aspect ratio, small dimension gaps and formulations useful therein

#6
20210124268
2021-04-29

Resist underlayer film-forming composition including cyclic carbonyl compound

#7
20200387071
2020-12-10

Composition for forming organic film, patterning process, and polymer

#8
20200131376
2020-04-30

Composition for forming film protecting against aqueous hydrogen peroxide solution

#9
20190264035
2019-08-29

SEMICONDUCTOR SUBSTRATE TREATMENT AGENT AND SUBSTRATE-TREATING METHOD

#10
20190092681
2019-03-28

Method for roughening surface using wet treatment

#11
20160363864
2016-12-15

Polymer, organic layer composition, organic layer, and method of forming patterns

#12
20160340543
2016-11-24

Method for coating pipe with acid-curable resin and acid curing agent

#13
20160125972
2016-05-05

RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE

#14
20160115271
2016-04-28

Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition

#15
20120171611
2012-07-05

Aromatic hydrocarbon resin and composition for forming underlayer film for lithography