103339 ⎘
Coating compositions based on condensation polymers of aldehydes or ketones ; Coating compositions based on derivatives of such polymers Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups , and
METHOD FOR THE MANUFACTURE OF MINERAL WOOL PRODUCTS
#2Fluoropolymer adhesives and methods thereof
#3Method for the manufacture of mineral wool products
#4Anti-reflective hardmask composition
#5Fluoropolymer adhesives and methods thereof
#6Process for preparing liquid compositions of etherified melamine formaldehyde resins
#7Anti-reflective hardmask composition
#8Thermally curable composition, varnish thereof, and thermally cured object
#9SEMICONDUCTOR SUBSTRATE TREATMENT AGENT AND SUBSTRATE-TREATING METHOD
#10Benzoxazine composition
#11Microcapsules having dual reagents separated by the capsule wall and methods for making same
#12Lignin-based phenolic resin
#13Method for roughening surface using wet treatment
#14Resist multilayer film-attached substrate and patterning process
#15Additives for coating compositions and related methods
#16Benzoxazine low temperature curable composition
#17Microcapsules having dual reagents separated by the capsule wall and methods for making same
#18Capsules having surfactant tethered outer shells and methods for making same
#19Resist underlayer film-forming composition containing novolac resin reacted with aromatic methylol compound
#20Polymer, organic layer composition, and method of forming patterns
#21Resist underlayer film-forming composition containing novolac resin to which aromatic vinyl compound is added
#22Reaction Hybrid Benzoxazine Resins and Uses Thereof
#23Method for coating pipe with acid-curable resin and acid curing agent
#24Treated aldehyde-based resins containing polyamines and methods for making and using same
#25Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition
#26Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
#27Resist overlayer film forming composition for lithography and method for manufacturing semiconductor device using the same
#28PHENOLIC RESIN, METHOD OF PREPARATION, SIZING COMPOSITION FOR MINERAL FIBRES AND RESULTING PRODUCTS
#29Aminoplast crosslinker resin compositions, process for their preparation, and method of use
#30Process for the preparation of a crosslinker composition
#31Water-based amino resin and water-based thermosetting resin composition containing the same
#32PHENOLIC RESIN, METHOD OF PREPARATION , SIZING COMPOSITION FOR MINERAL FIBRES, AND RESULTING PRODUCTS
#33Dispersion