103388 ⎘
Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors Unsaturated polyimide precursors
POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF
#2HIGH TEMPERATURE SURFACING FILM FOR COMPOSITE SUBSTRATES
#3Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component
#4POLYMER BACKSIDE FILM LAYER FOR MITIGATING SUBSTRATE WARPAGE
#5CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
#6PHOTOIMAGABLE DIELECTRICS
#7CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
#8Fixing film and method of producing same, fixing device, and electrophotographic image forming apparatus
#9Resin composition and article made therefrom
#10METHOD OF INSULATING A MOTOR
#11Amine-Substituted 2-Amino-Ethan-1-Olyl Polymers, Polyimides, Articles, and Methods
#12Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component
#13Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
#14FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
#15FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
#16HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTRATE MATERIAL, PRIMER, COATING MATERIAL AND SEMICONDUCTOR DEVICE USING SAME
#17IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL USING THESE
#18Polyimide, laminate, and electronic device including same
#19POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POLYIMIDE FILM
#20COMPOUND, RESIN, COMPOSITION, AND FILM FORMING MATERIAL FOR LITHOGRAPHY USING THE SAME
#21POLYIMIDE PRECURSOR RESIN COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
#22Method for producing aqueous polyimide precursor solution composition
#23COVER FILM AND APPLICATION THEREOF
#24Polyimide-forming compositions, methods of manufacture, and articles prepared therefrom
#25Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these
#26Vinyl-modified maleimide, composition and article made thereby
#27Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
#28Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
#29Polyimide-forming compositions, methods of manufacture, and articles prepared therefrom
#30Polymer Used For Orientation Film Material and Method For Preparing Orientation Film
#31Aqueous semi-finished and primary non-stick coating compositions comprising aromatic polymers
#32Aqueous semi-finished and primary non-stick coating compositions comprising heterocyclic polymers
#33THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
#34AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION
#35POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF AND POLYIMIDE MADE THEREFROM
#36LOW DIELECTRIC CONSTANT, LOW DIELECTRIC DISSIPATION FACTOR COATINGS, FILMS AND ADHESIVES
#37INDUSTRIAL TOOLS WITH THERMOSET COATING
#38Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
#39High temperature hybridized molecular functional group adhesion barrier coating
#40Polyimides, coating composition formed therefrom and use thereof
#41Solvent-free wire enamel composition
#42Insulating composition for substrate, and prepreg and substrate using the same
#43Phosphoric acid resistant polymaleimide prepolymer compositions
#44Water-entrained-polyimide chemical compositions for use in high-performance composite fabrication
#45Insulating layer composition for substrate, and prepreg and substrate using the same
#46RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM
#47Photosensitive resin composition and cured film
#48Phosphoric acid resistant polymaleimide prepolymer compositions
#49Coating composition and method of forming coating film
#50Coating composition and method of forming coating film
#51Water-entrained-polyimide chemical compositions for use in high-performance composite fabrication
#52Coating composition and method of forming coating film