103606 ⎘
Adhesives based on organic macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
Sub-classes:BIODEGRADABLE HOT MELT ADHESIVE COMPOSITIONS
#2Thermally Conductive Grease Composition
#3USE OF HYDROTREATED SYNTHETIC FISCHER-TROPSCH-WAXES IN POLYOLEFIN-BASED HOT MELT ADHESIVES
#4HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
#5SYSTEM FOR PRODUCING A SEALING COMPOUND FOR INSULATING GLASS
#6Anti-powdering and anti-static polymer film for digital printing
#7LEG GASKETING CUFF WITH TACKIFIER-FREE ADHESIVE
#8ADHESIVE COMPOSITION AND ADHESIVE SHEET
#9Multilayer PSA foam particles
#10Dielectric-heating bonding film and joining method using dielectric-heating bonding film
#11Ionic polymers and their use as wet-adhesives and coatings
#12Composite adhesive layer for a laminate structure
#13Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
#14Organic electronic device
#15Ultrahigh melt flow styrenic block copolymers
#16Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
#17Adhesive composition
#18Polar-group-containing olefin copolymer, polar-group-containing multinary olefin copolymer, olefin-based resin composition, and adhesive and layered product each using the same
#19Adhesive strips
#20Aqueous dispersion and laminate
#21CARDBOARD WITH EDGE SEALED WITH MIXTURE OF HOT-MELT ADHESIVE AND WAX
#22Aqueous dispersion mixture
#23Adhesive composition
#24Adhesive composition
#25Hot-melt adhesive
#26Ionic polymers and their use as wet-adhesives and coatings
#27High cohesive strength polyolefin construction adhesive
#28HOT MELT ADHESIVE COMPOSITIONS AND USE THEREOF
#29Hot melt adhesive composition comprising at least one particular aldehyde scavenger
#30Composite adhesive layer for a laminate structure
#31Adhesive composition and production method thereof
#32Anti-powdering and anti-static polymer film for digital printing
#33Two-component hot-melt adhesive
#34Hot melt adhesive comprising cyanoacrylate curing compounds
#35ADHESION PROMOTION TO DIFFICULT SUBSTRATES FOR HOT MELT ADHESIVES
#36Substrate treating method, temporary fixing composition and semiconductor device
#37Expanding void filler and a process of manufacturing same
#38REMOVABLE ADHESIVE SHEET
#39Adhesive and laminate prepared using the adhesive
#40Adhesion promotion to difficult substrates for hot melt adhesives
#41Adhesive and laminate using the same
#42Laminate, Method for Producing the Same and Tire Using the Same