ClassID:

103646

C09J125/06 - CPC Classification

Classification description:

Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers; Homopolymers or copolymers of hydrocarbons; Homopolymers or copolymers of styrene Polystyrene

Recent Application in this class:
#1
20260098189
2026-04-09

DYNAMICALLY CROSSLINKED TOUGH ADHESIVE WITH RECYCLABILITY

#2
20260072235
2026-03-12

DISPENSABLE ADHESIVE COMPOSITION FOR AUGMENTED REALITY WAVEGUIDE

#3
20260071102
2026-03-12

HOT-MELT ADHESIVE USING RECYCLED POLYMER MATERIALS

#4
20250145863
2025-05-08

LAMINATE PEELING METHOD, LAMINATE, AND LAMINATE PRODUCTION METHOD

#5
20240182754
2024-06-06

TEMPERATURE-SENSITIVE ADHESIVE FOR STOMA AND ADHESIVE TAPE FOR STOMA COMPRISING SAME

#6
20230164968
2023-05-25

High Density Carrier Tape

#7
20230121788
2023-04-20

Z-CNT filled meltable adhesives for bonding of deicers

#8
20230044696
2023-02-09

DYNAMICALLY CROSSLINKED TOUGH ADHESIVE WITH RECYCLABILITY

#9
20220041906
2022-02-10

Powder adhesive and bonded article

#10
20220002591
2022-01-06

Laminate peeling method, laminate, and laminate production method

#11
20210400975
2021-12-30

Methods and Compositions for Use in Glued-Wood Products

#12
20210324248
2021-10-21

HEAT AND HUMIDITY RESISTANT ADHESIVE COMPOSITION

#13
20210277291
2021-09-09

Pressure sensitive adhesive particles, method for producing printed material, and printed material

#14
20210071047
2021-03-11

Adhesive coating composition for electrical steel sheet, electrical steel sheet laminate and method for manufacturing electrical steel sheet product

#15
20200189752
2020-06-18

Z-CNT filled meltable adhesives for bonding of deicers

#16
20200087549
2020-03-19

Adhesive coating composition for non-oriented electrical steel sheet, and method for manufacturing non-oriented electrical steel sheet

#17
20200010743
2020-01-09

Styrene-based materials for hot melt adhesives

#18
20190390091
2019-12-26

One-component pressure-sensitive adhesive composition having gel content based on reversible crosslinking via metal salts

#19
20190292412
2019-09-26

Adhesive material and pressure-bonded print

#20
20190127613
2019-05-02

Polystyrene adhesive

#21
20190094455
2019-03-28

Light guide plate unit, backlight unit comprising same, and liquid crystal display device

#22
20180362811
2018-12-20

ADHESIVE ARTICLES THAT INCLUDE A POLYMER FOAM AND METHODS OF MAKING THE SAME

#23
20180105627
2018-04-19

SURFACE REACTIVE CROSSLINKABLE COPOLYMERS

#24
20170259544
2017-09-14

Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same

#25
20170148659
2017-05-25

Adhesive composition, laminate, and stripping method

#26
20170107333
2017-04-20

MANUFACTURE METHOD OF GRAPHENE BASED RESIN PELLET AND MANUFACTURE METHOD OF CONDUCTIVE SEAL

#27
20170101555
2017-04-13

Temporary adhesion method and method for producing thin wafer

#28
20170036403
2017-02-09

3D Print Bed Having Permanent Coating

#29
20170022399
2017-01-26

Hot-melt pressure-sensitive adhesive

#30
20160319056
2016-11-03

Radical polymerization initiator, multi-branched polymer, varnish, adhesive agent, coating material, sealing material, semiconductor, and electronic device

#31
20150299534
2015-10-22

Adhesive composition, laminate, and stripping method

#32
20150247031
2015-09-03

POLYMER PARTICLE DISPERSIONS WITH DIVINYLARENE DIOXIDES

#33
20150191637
2015-07-09

Hot melt pressure sensitive adhesive and thermoset comprising styrene-butadiene polymers having high vinyl and high di-block

#34
20150184035
2015-07-02

TEMPORARY BONDING LAYER FOR PRODUCTION OF SEMICONDUCTOR DEVICE, STACK AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE

#35
20150184032
2015-07-02

TEMPORARY ADHESIVE FOR PRODUCTION OF SEMICONDUCTOR DEVICE, AND ADHESIVE SUPPORT AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

#36
20150175723
2015-06-25

ELECTROCHEMICALLY DEGRADABLE POLYMERS

#37
20140186642
2014-07-03

Degradable flow medium for resin transfer molding processes

#38
20130225751
2013-08-29

Low molecular weight polystyrene resin and methods of making and using the same

#39
20130184425
2013-07-18

Low molecular weight polystyrene resin and methods of making and using the same

#40
20130143999
2013-06-06

Adhesive composition, adhesive layer and adhesive sheet

#41
20130030066
2013-01-31

POLYMERIC FLAME RETARDANT

#42
20110021647
2011-01-27

Expanded polystyrene solubilization method

#43
20070249741
2007-10-25

Method of recycling solid waste polystyrene packing materials

#44
20050075428
2005-04-07

Low emissions one part adhesive

#45
18829594
2025-07-08

Hot-melt adhesive and method of making same using recycled polymer materials