Patents-Review.com
ClassID:

103697 ⎘

C09J135/00 - CPC Classification

Classification description:

Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers

Sub-classes:
Recent Application in this class:
#1
20250206865
2025-06-26

CURABLE COMPOSITION CONTAINING WATER-INSOLUBLE POLYFUNCTIONAL (METH)ACRYLAMIDE

 #2
20250002707
2025-01-02

CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE

 #3
20230178509
2023-06-08

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME

 #4
20230138786
2023-05-04

GREEN, SAFE AND ENVIRONMENTALLY-FRIENDLY PROCESS AND PRODUCTION EQUIPMENT FOR INDUSTRIALIZED CONTINUOUS LARGE-SCALE PRODUCTION OF FORMALDEHYDE-FREE WATER-BASED ADHESIVE

 #5
20230054785
2023-02-23

CURABLE COMPOSITION

 #6
20220186093
2022-06-16

ADHESIVE COMPOSITION, ADHESIVE LAYER AND ADHESIVE SHEET

 #7
20210040252
2021-02-11

MATERIAL FOR PRINTED CIRCUIT BOARD, METAL LAMINATE, METHODS FOR PRODUCING THEM, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

 #8
20200063004
2020-02-27

ADHESIVE COMPOSITION, ADHESIVE LAYER AND ADHESIVE SHEET

 #9
20190292425
2019-09-26

Adhesive composition, adhesive layer and adhesive sheet

 #10
20190211238
2019-07-11

Two-Component Composition Based on Compounds With At Least Two Exo-Vinylene Cyclic Carbonate Units

 #11
20180050516
2018-02-22

Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board

 #12
20170226339
2017-08-10

Multifunctional bonding of hydrogels

 #13
20170029671
2017-02-02

Light curable resin composition

 #14
20160053418
2016-02-25

Binder-consolidated textile fabric, method for producing it, and use thereof

 #15
20150247071
2015-09-03

Adhesive bonding by polymer chain reconfiguration

 #16
20130123406
2013-05-16

Formaldehyde free binder compositions for fibrous materials

 #17
20130066014
2013-03-14

Organosilicon compounds, production processes thereof, pressure-sensitive adhesive compositions containing the organosilicon compounds, self-adhesive polarizers and liquid crystal displays

 #18
20130053515
2013-02-28

Organosilicon compounds, production processes thereof, pressure-sensitive adhesive compositions containing the organosilicon compounds, self-adhesive polarizers and liquid crystal displays

 #19
20120322946
2012-12-20

Organosilicon compounds, production processes thereof, pressure-sensitive adhesive compositions containing the organosilicon compounds, self-adhesive polarizers and liquid crystal displays

 #20
20120319306
2012-12-20

Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

 #21
20120258640
2012-10-11

Aqueous Nonwoven Binder and Treated Nonwoven Prepared Therefrom

 #22
20100182679
2010-07-22

Pressure-Sensitive Adhesive Composition,Optical Filter and Plasma Display Panel Display Device Using the Same

 #23
20100060829
2010-03-11

ORGANOSILICON COMPOUNDS, PRODUCTION PROCESSES THEREOF, PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS CONTAINING THE ORGANOSILICON COMPOUNDS, SELF-ADHESIVE POLARIZERS AND LIQUID CRYSTAL DISPLAYS

 #24
20100021644
2010-01-28

Formaldehyde free binder compositions for fibrous materials

 #25
20100010182
2010-01-14

Adhesive composition, film adhesive, and method for producing the adhesive composition

 #26
20090275699
2009-11-05

Starch containing formaldehyde-free thermoset binders for fiber products

 #27
20090246513
2009-10-01

Process for producing anti-fog coating