103712 ⎘
Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
Sub-classes:COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
#2RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
#3COATINGS FOR MATERIALS TO REDUCE FRICTION AND ENERGY CONSUMPTION
#4Crosslinked copolymer having repeating unit carrying amide group and carboxyl and/or its ammonium salt and repeating unit of a-monoolefin
#5HOT MELT ADHESIVE COMPOSITION
#6HEAT-CROSSLINKABLE ADHESIVE COMPOSITION FORMING A HEAT-STABLE ADHESIVE SEAL
#7ASSEMBLY AND METHOD FOR MANUFACTURING SAME
#8Methods, Articles and Adhesive Composition Comprising Unpolymerized Cyclic Olefin, Catalyst, and Adhesion Promoter Polymer
#9RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
#10Preparation method of hydrogenated petroleum resin
#11METHOD AND SYSTEM FOR IMPROVING CREEP PERFORMANCE IN ELASTIC APPLICATIONS
#12Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition comprising same
#13Solvent blends for olefin shrink film seaming, shrink labels formed with said solvent blends and methods of providing seams with said solvent blends
#14PROPYLENE RANDOM COPOLYMER BASED HOT MELT ADHESIVE COMPOSITION
#15Method for producing hydrocarbon resins and hydrogenation products thereof
#16Petroleum resin, hydrogenated petroleum resin, and production method for hydrogenated petroleum resin
#17Hydrogenated petroleum resin, and production method and use therefor
#18Hydrocarbon resin, method for preparing hydrocarbon resin, and adhesive composition
#19Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
#20Adhesive composition
#21Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
#22Curable petroleum resin, preparation method therefor, and use thereof
#23Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
#24Hot melt adhesive
#25Modified hydrocarbon resin, method for producing the resin, and hot-melt adhesive composition
#26Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
#27Hydrocarbon resin, method for preparing hydrocarbon resin, and adhesive composition
#28Hydrocarbon resin, method for preparing hydrocarbon resin, and adhesive composition
#29Hydrogenated petroleum resin, and production method and use therefor
#30Thermoplastic resin compositions, adhesive coating materials, and laminates using the same
#31Method for improving creep performance in elastic applications
#32Pressure-sensitive adhesive sheet for touch panel, laminate for touch panel, and capacitance-type touch panel
#33Hot melt adhesive
#34Curable petroleum resin and method for preparing same
#35Adhesive composition, laminate, and stripping method
#36Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
#37POLARIZING PLATE COMPOSITION, POLARIZING PLATE PROTECTIVE FILM, POLARIZER, POLARIZING PLATE, LIQUID CRYSTAL DISPLAY DEVICE, AND COMPOUND USED IN THE LIQUID CRYSTAL DISPLAY DEVICE
#38Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof
#39Photoreactive copolymer and alignment layer comprising the same
#40Metathesis-active adhesion agents and methods for enhancing polymer adhesion to surfaces
#41Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same
#42Adhesive resins for wafer bonding
#43Pressure sensitive adhesive film
#44Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
#45Hot melt adhesive
#46Method of preparing anode of lithium ion batteries or electrode plate of supercapacitor
#47Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
#48Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
#49Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
#50COMPOSITE PART
#51Adhesive composition, laminate, and stripping method
#52Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
#53TEMPORARY BONDING LAYER FOR PRODUCTION OF SEMICONDUCTOR DEVICE, STACK AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE
#54High solids cross-linked ethylene propylene diene terpolymer latex
#55Wax-Containing Hot Melt Adhesives and Disposable Absorbent Articles
#56Amide-extended crosslinking compounds and methods for use thereof
#57ADHESIVE COMPOSITION
#58TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#59Amide-extended crosslinking compounds and methods for use thereof
#60Methods of disassembling apparel products having cycloalkene adhesives
#61Method for making a high solids cross-linked ethylene propylene diene terpolymer latex