ClassID:

103758

C09J161/34 - CPC Classification

Classification description:

Adhesives based on condensation polymers of aldehydes or ketones ; Adhesives based on derivatives of such polymers Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups , and

Recent Application in this class:
#1
20240199918
2024-06-20

ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING PROCESSED SUBSTRATE

#2
20240150631
2024-05-09

COMPOSITE PRODUCTS

#3
20230002557
2023-01-05

Fluoropolymer adhesives and methods thereof

#4
20210309568
2021-10-07

Sizing composition for mineral fibers and resulting products

#5
20210102104
2021-04-08

Composite products

#6
20200290402
2020-09-17

Metallic or metallized reinforcement, 1HE surface of which is coated with a polybenzoxazine

#7
20200199299
2020-06-25

Fluoropolymer adhesives and methods thereof

#8
20190048236
2019-02-14

Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same

#9
20180079856
2018-03-22

Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device

#10
20180030264
2018-02-01

Benzoxazine low temperature curable composition

#11
20170334776
2017-11-23

Sizing composition for mineral fibers and resulting products

#12
20170190902
2017-07-06

COMPOSITE MAILLARD-RESOLE BINDERS

#13
20170107318
2017-04-20

Structural adhesive compositions

#14
20170008994
2017-01-12

Reaction Hybrid Benzoxazine Resins and Uses Thereof

#15
20160304757
2016-10-20

High residual content (HRC) kraft/soda lignin as an ingredient in wood adhesives

#16
20160272764
2016-09-22

Thermosetting resin composition

#17
20160244611
2016-08-25

Halogen-free resin composition and use thereof

#18
20160152759
2016-06-02

Thermosetting resin composition containing polymer having specific terminal structure

#19
20160115271
2016-04-28

Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition

#20
20150148484
2015-05-28

Aqueous binder compositions of aliphatic or cycloaliphatic dicarboxaldehydes and resorcinol

#21
20150013878
2015-01-15

Adhesive compositions and use thereof

#22
20140308530
2014-10-16

Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition

#23
20140296372
2014-10-02

Binder composition for making self-hardening foundry molds, and method of producing foundry mold using the same

#24
20140088225
2014-03-27

Composite maillard-resole binders

#25
20110190425
2011-08-04

Composite maillard-resole binders

#26
20110111226
2011-05-12

SIZING COMPOSITION FOR MINERAL FIBERS AND RESULTING PRODUCTS

#27
20110101260
2011-05-05

SIZING COMPOSITION FOR MINERAL FIBERS AND RESULTING PRODUCTS

#28
20110083805
2011-04-14

ADHESIVES

#29
20110021669
2011-01-27

Binder for materials based on wood chips and/or wood fibers, method for the production of said binder, and molded article

#30
20100119824
2010-05-13

PHENOLIC RESIN, METHOD OF PREPARATION, SIZING COMPOSITION FOR MINERAL FIBRES, AND RESULTING PRODUCTS

#31
20100075146
2010-03-25

SIZING COMPOSITION FOR MINERAL FIBERS COMPRISING A PHENOLIC RESIN, AND RESULTING PRODUCTS

#32
20100001225
2010-01-07

PHENOLIC RESIN, METHOD OF PREPARATION , SIZING COMPOSITION FOR MINERAL FIBRES, AND RESULTING PRODUCTS

#33
20090054592
2009-02-26

Dispersion

#34
20080242753
2008-10-02

Adhesive composition

#35
20080064284
2008-03-13

Phenol-formaldehyde resin having low concentration of tetradimer

#36
20070117263
2007-05-24

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

#37
20060058446
2006-03-16

Rheology control for adhesives based on formaldehyde resins

#38
20050250900
2005-11-10

Adhesive compositions for bonding lignocellulosic materials, bonding methods and apparatus, and bonded articles

#39
20050196906
2005-09-08

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material