103821 ⎘
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
METHOD OF MAKING SILICONE POLYOXAMIDE COPOLYMERS
#2METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATION PEELING
#3ADHESIVE COMPOSITION, LAMINATE, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING PROCESSED SUBSTRATE
#4SILICONE POLYOXAMIDE COPOLYMERS WITH AMINE-BASED END GROUPS
#5A CURABLE COMPOSITION AND A METHOD FOR ADHERING SUBSTRATES WITH THE SAME
#6Hotmelt silicone composition, encapsulant, hotmelt adhesive and optical semiconductor devise
#7ELECTRICALLY CONDUCTIVE SILICONE COMPOSITION WITH HIGH ADHESION STRENGTH
#8ADHESIVE COMPOSITION FOR OPTICAL IRRADIATION PEELING, LAMINATE BODY, AND LAMINATE BODY PRODUCTION METHOD AND PEELING METHOD
#9Polyfunctional organosiloxanes, compositions containing same, and methods for the preparation thereof
#10Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device
#11Adhesive for joining metals and resins, its adhesive layer and application thereof
#12Dual temperature curable silicone compositions, methods of manufacture, and articles prepared therefrom
#13Hot melt adhesive composition containing a polyolefin-polydiorganosiloxane copolymer and methods for the preparation and use thereof
#14Dual cure adhesive composition and methods for its preparation and use
#15DUAL CURE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE
#16DISPLAY PANEL AND DISPLAY DEVICE
#17ORGANOSILICON COMPOUND AND METHOD FOR PRODUCING SAME
#18Condensation-curable electrically conductive silicone adhesive composition
#19Thermal conducting silicone polymer composition
#20Curable resin composition, cured product thereof, and bonded body bonded by cured product
#21Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion
#22Modification of siloxane polyoxamide copolymers with ultraviolet light
#23Wafer processing laminate and method for processing wafer
#24Pressure sensitive adhesives with amphiphilic copolymer
#25Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process
#26Curable siloxane compositions
#271K High Temperature Debondable Adhesive
#28LAMINATE
#29Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition
#30Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
#31Cross-linkable materials based on organyl-oxysilane-terminated polymers
#32Radiation curable article and method for making and using same
#33Wafer laminate and making method
#34Wafer processing laminate and method for processing wafer
#351K UV and thermal cure high temperature debondable adhesive
#36Adhesive composition for high-power optical fiber
#37Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
#38Display device
#39Self-adhesive article with foam support
#40Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device
#41Dual curable composition
#42Silicone pressure sensitive adhesive compositions and protective films containing the same
#43Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
#44Optoelectronic component comprising a bonding layer and method for producing a bonding layer in an optoelectronic component
#45Curable siloxane compositions
#46Cross-linkable masses based on organyl-oxysilane-terminated polymers
#47Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
#48Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
#49Clustered functional polyorganosiloxanes, processes for forming same and methods for their use
#50Method for forming thermally conductive thermal radical cure silicone compositions
#51Stable thermal radical curable silicone adhesive compositions
#52In situ method for forming thermally conductive thermal radical cure silicone composition
#53Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same
#54Organopolysiloxane compound having ethynyl groups, method for preparing linear organopolysiloxane compound having ethynyl groups at both terminals of molecular chain, method for preparing organopolysiloxane polymer having alkoxysilyl-ethylene group at terminal, room temperature curable composition and molded product which is cured product thereof
#55Alkoxyalkylsilane-modified polysiloxanes and processes for the production thereof
#56Silicone adhesive composition, a method for the preparation thereof and an adhesive film
#57Microparticles and curable organopolysiloxane composition containing the same
#58Silicone pressure-sensitive adhesive composition having improved substrate adhesion and pressure-sensitive adhesive article
#59Self-adhesive article with foam support
#60Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
#61Thermosetting poly(siloxane-diphenylbutadiyne) with readily tunable glass transition temperature and high thermal stability
#62Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
#63Dual curable composition
#64Joining a thermoplastic material and a metal
#65Organopolysiloxane, method for producing the same, and curable resin composition containing the organopolysiloxane
#66Method for Making a Thermo-Stable and Transparent Resin
#67Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
#68Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
#69Compound having hindered amine backbone, and resin composition
#70Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
#71Adhesive composition and adhesive dry film
#72Temporary adhesive composition, and method of producing thin wafer
#73Pressure sensitive adhesives with amphiphilic copolymers
#74Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
#75Amphiphilic silicone copolymers for pressure sensitive adhesive applications
#76Polyborosiloxane and Method of Preparing Same
#77High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device
#78Oily surface adhesive room temperature curing type organopolysiloxane composition and seal
#79SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT
#80Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound
#81Silane functional prepolymer and isocyanate functional prepolymer blend based adhesive composition
#82Room temperature-curable organopolysiloxane compositions
#83Organopolysiloxane composition for bonding to magnesium alloy
#84Solid silane coupling agent composition, process for producing the same, and resin composition containing the same
#85Moisture cured polymer and recycled glass roof coating, caulk/sealant and patching compound membranes