103852 ⎘
Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
Sub-classes:POLYMER COMPOSITION AND METHODS OF PREPARTION THEREOF
#2THIOL COMPOUND AND USES THEREOF
#3FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE
#4Electrically conductive adhesive
#5BONDING ADHESIVE AND ADHERED ROOFING SYSTEMS PREPARED USING THE SAME
#6ADHESIVE COMPOSITION
#7Optical body including multilayer optical film and thin adhesive layer
#8Bonding adhesive and adhered roofing systems prepared using the same
#9Electrically conductive adhesive
#10Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
#11Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device
#12Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
#13Adhesive composition for foldable display, adhesive film using same, and foldable display comprising same
#14ADHESIVE ARTICLE
#15ACTIVATABLE WRAP MATERIALS AND RELATED METHODS
#16Friction-activated adhesive formulations and application devices
#17BONDING IN ELECTROCHEMICAL CELLS, AND STACKING OF ELECTROCHEMICAL CELLS
#18OPTICAL BODY INCLUDING MULTILAYER OPTICAL FILM AND THIN ADHESIVE LAYER
#19LASER-MARKABLE ARTICLE WITH CUSTOMIZED WATERMARKS AND PREPARATION METHOD THEREOF
#20BONDING ADHESIVE AND ADHERED ROOFING SYSTEMS PREPARED USING THE SAME
#21Electrically conductive adhesive
#22Pressure-sensitive adhesive tape for protecting semiconductor
#23Adhesive film and adhesive substrate
#24Polarizing film, method for producing same, optical film, image display device, and adhesion improvement-treated polarizer
#25DOUBLE-SIDED TAPE DEVICE
#26DOUBLE-SIDED TAPE DEVICE
#27Display device
#28Double-sided tape and display device including the same
#29Pressure-sensitive adhesive tape, method for manufacturing same, and electronic device comprising same
#30Support film for tape material, and tape material
#31Method for producing a single-sided adhesive film for securing a load and single-sided adhesive film for securing a load
#32Thermoplastic resin, molded product, film, and layered product
#33ADHESIVE PRODUCT
#34Tape system with a longitudinal filament for slitting film
#35Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#36PRESSURE-SENSITIVE ADHESIVE SHEET
#37Ultrasmall securing tape and article including same
#38PRESSURE-SENSITIVE ADHESIVE SHEET
#39Stretch releasing adhesive assembly, housing assembly and mobile terminal
#40BIODEGRADABLE FILM HAVING AN ADHESIVE AND METHODS OF USE THEREOF
#41Adhesive coating composition for non-oriented electrical steel sheet, non-oriented electrical steel sheet product, and manufacturing method therefor
#42Adhesive
#43BONDING ADHESIVE AND ADHERED ROOFING SYSTEMS PREPARED USING THE SAME
#44ADHESIVE TAPE
#45Impact-resistant polyester pressure-sensitive adhesive
#46Web with adhesive layer having partially embedded filaments
#47Frictional enhancement of mating surfaces of power cable installed in coiled tubing
#48Semiconductor wafer surface protection film and method for manufacturing semiconductor device
#49Flexible sheet, thermally conductive component, electrically conductive component, antistatic component, heating element, electromagnetic wave shield, and method of producing flexible sheet
#50Multilayer conformable composites
#51Composite nanofiber sheet
#52Multilayer composites comprising adhesive and one or more nanofiber sheets
#53Adhesive composition
#54Composition, apparatus, kit and method and uses thereof
#55Adhesive label
#56Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
#57Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#58Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#59Process of assembling and repositioning two parts
#60Assembly of timepiece parts assembled using repositionable hot melt adhesive and process for assembling and repositioning such parts
#61Aqueous resin dispersion, paint, adhesive, and laminate
#62Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheet
#63Bonding adhesive and adhered roofing systems prepared using the same
#64Adhesive including pendant (meth)acryloyl groups, article, and method
#65Adhesive agent
#66Adhesive
#67Pressure sensitive adhesive composition
#68Adhesive for electronic component
#69Hot melt adhesive
#70PROCESSES EMPLOYING SILANE-CONTAINING POLYOLEFIN FILMS TENACIOUSLY ADHERED TO SUBSTRATES
#71COMPOSITION, APPARATUS, KIT AND METHOD AND USES THEREOF
#72Adhesive resin composition, laminate, and self-stripping method
#73Adhesive for electronic component
#74Laminate body, gas barrier film, and method of manufacturing the same
#75ADHESIVE BLENDS, ARTICLES, AND METHODS
#76Pressure-sensitive adhesives and process for preparing them
#77REACTION ADHESIVE
#78THERMOSETTING COATING COMPOSITIONS WITH THREE OR MORE CURE MECHANISMS
#79MULTILAYER OPTICAL ARTICLE
#80Die attach adhesives with improved stress performance
#81Michael addition compositions
#82Ionomer-containing hot melt adhesive
#83Thermoplastic hydrophilic adhesive compositions for attachment on dry and wet surfaces and with increased water adhesion stability