Patents-Review.com
ClassID:

104881 ⎘

C09K2200/0247 - CPC Classification

Classification description:

Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers; Inorganic compounds; Silica-rich compounds, e.g. silicates, cement, glass Silica

Recent Application in this class:
#1
20260125538
2026-05-07

METAL OXIDE PARTICLE MATERIAL, METHOD FOR PRODUCING SAME, SLURRY COMPOSITION, RESIN COMPOSITION, AND FILLER FOR SEALING MATERIAL FOR SEMICONDUCTOR PACKAGE

 #2
20260042878
2026-02-12

Curable Compositions Comprising At Least One Silane-Modified Polymer

 #3
20250215200
2025-07-03

SEALING APPARATUS

 #4
20230312868
2023-10-05

AMORPHOUS SILICA POWDER AND RESIN COMPOSITION CONTAINING SAME

 #5
20230272203
2023-08-31

ACRYLIC RUBBER COMPOSITION

 #6
20230242798
2023-08-03

SEAL MEMBER

 #7
20230202849
2023-06-29

ULTRA-WHITE SILICA-BASED FILLER

 #8
20230174763
2023-06-08

ELASTOMER COMPOSITION AND SEALING MATERIAL COMPRISING SAME

 #9
20230017563
2023-01-19

SEMICONDUCTOR PRODUCTION DEVICE SEALING MATERIAL

 #10
20220411685
2022-12-29

FLUORORUBBER COMPOSITION AND SEALING MATERIAL

 #11
20220227909
2022-07-21

Composition containing fluorine-containing polymer and crosslinked article

 #12
20220186010
2022-06-16

Rubber composition for sealing material and sealing material using the same

 #13
20210061666
2021-03-04

Ultra-white silica-based filler

 #14
20200385513
2020-12-10

Light-fixable and heat-curing compounds based on epoxy resins and thiols

 #15
20200362153
2020-11-19

Gasket material

 #16
20200317918
2020-10-08

Controlled cure rate using polyether-coated synergists

 #17
20200194325
2020-06-18

Liquid resin composition for sealing and electronic component apparatus

 #18
20200168753
2020-05-28

PID-FREE ENCAPSULANT FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE INCLUDING SAME, AND METHOD OF MANUFACTURING SAME

 #19
20190256647
2019-08-22

Epoxy resin composition and structure

 #20
20190241782
2019-08-08

Curable compositions and related methods

 #21
20190203089
2019-07-04

POLYSULFIDE OR POLYTHIOETHER SEALANT COMPOSITION INCLUDING GLYCOL ORGANIC ACID ESTERS

 #22
20170152420
2017-06-01

Hydrophobic silicone-based putty composition

 #23
20160017197
2016-01-21

ELEMENT SEALING RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, ELEMENT SEALING RESIN SHEET FOR ORGANIC ELECTRONIC DEVICE, ORGANIC ELECTROLUMINESCENCE ELEMENT, AND IMAGE DISPLAY

 #24
20140363679
2014-12-11

Material for gasket

 #25
20130245155
2013-09-19

Sealant composition

 #26
20120041127
2012-02-16

Nitrile rubber composition, cross-linkable nitrile rubber composition and cross-linked rubber

 #27
20100261004
2010-10-14

Rubber-Metal Laminate

 #28
20100163156
2010-07-01

Can cap sealing composition and use thereof

 #29
20090234054
2009-09-17

Nitrile rubber composition, cross-linkable nitrile rubber composition and cross-linked rubber

 #30
20090186977
2009-07-23

Cross-linkable nitrile rubber composition and cross-linked rubber

 #31
20090025870
2009-01-29

Curable composition and sealing method

 #32
20080279617
2008-11-13

Curable Composition and Sealing Method

 #33
20080200613
2008-08-21

Curable composition

 #34
20060273117
2006-12-07

Valve seal and device for dispensing a fluid product while being provided with a seal of this type

 #35
20050124749
2005-06-09

High-whiteness hydrophobic precipitated silica with ultralow moisture absorption

 #36
20050065228
2005-03-24

Energy curable sealant composition