ClassID:

104929

C09K2200/0647 - CPC Classification

Classification description:

Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers; Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds Polyepoxides

Recent Application in this class:
#1
20260092139
2026-04-02

TWO-COMPONENT CURABLE RESIN COMPOSITION FOR HYDROGEN GAS SEALING AND CURED MATERIAL THEREOF

#2
20240034833
2024-02-01

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

#3
20230312868
2023-10-05

AMORPHOUS SILICA POWDER AND RESIN COMPOSITION CONTAINING SAME

#4
20230151255
2023-05-18

MULTILAYER STRUCTURE FOR TRANSPORTING OR STORING HYDROGEN

#5
20220372271
2022-11-24

COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, AND STORAGE METHOD

#6
20220356298
2022-11-10

Room temperature ionic liquid curing agent

#7
20220170549
2022-06-02

Material for gasket

#8
20220145000
2022-05-12

PULTRUSION WITH EXTRUDED GASKET FOAM

#9
20220073727
2022-03-10

RESIN COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#10
20220064367
2022-03-03

Cationically curable composition and method for the joining, casting and coating of substrates using the composition

#11
20210020461
2021-01-21

Method for manufacturing electronic device

#12
20200385513
2020-12-10

Light-fixable and heat-curing compounds based on epoxy resins and thiols

#13
20200194325
2020-06-18

Liquid resin composition for sealing and electronic component apparatus

#14
20200140731
2020-05-07

Sealing resin composition

#15
20190367788
2019-12-05

Liquid epoxy resin sealing material and semiconductor device

#16
20190330412
2019-10-31

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

#17
20190256751
2019-08-22

Polythiol sealant compositions

#18
20190256647
2019-08-22

Epoxy resin composition and structure

#19
20150267096
2015-09-24

Frame-sealing agent, display panel and display device

#20
20150225631
2015-08-13

Resin Composition, Application Method Thereof and Liquid Crystal Display Panel Using Same

#21
20140242301
2014-08-28

Sealant composition

#22
20130082547
2013-04-04

SEALING RESIN COMPOSITION FOR HDD MOTOR AND HDD MOTOR FABRICATED BY USING THE SAME

#23
20120258314
2012-10-11

SINGLE-COMPONENT EPOXY RESIN COMPOSITION AND USE THEREOF

#24
20100210793
2010-08-19

One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same

#25
20100152315
2010-06-17

Sealing material for flat panel display

#26
20100084174
2010-04-08

Sealing material and mounting method using the sealing material

#27
20100006329
2010-01-14

SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL

#28
20090114272
2009-05-07

Sealing Agent for Photoelectric Converter and Photoelectric Converter Using Same

#29
20080105992
2008-05-08

MIXED MASSES SEALANT

#30
20070193171
2007-08-23

Sealant material

#31
20070021524
2007-01-25

Curing resin composition and sealants and end-sealing materials for displays

#32
20060160932
2006-07-20

Heat activated sealants and foamed materials

#33
20060020076
2006-01-26

Method of sealing an interface

#34
20050261412
2005-11-24

Curable compositions, sealing material, and adhesive