ClassID:

104933

C09K2200/0657 - CPC Classification

Classification description:

Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers; Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds Polyethers

Sub-classes:
Recent Application in this class:
#1
20250361378
2025-11-27

CURABLE COMPOSITION FOR SEALING MATERIAL, AND PANEL STRUCTURE USING SAID CURABLE COMPOSITION

#2
20250354043
2025-11-20

SEALING RESIN COMPOSITION AND SEAL

#3
20250326926
2025-10-23

RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE

#4
20240409698
2024-12-12

GRAFT COPOLYMER AND CURABLE THERMOSETTING COMPOSITION COMPRISING THE SAME

#5
20220073821
2022-03-10

STABILIZER COMPOSITION FOR SEALANTS AND ADHESIVES

#6
20210206955
2021-07-08

PEROXIDE CROSSLINKABLE FLUORORUBBER COMPOSITION

#7
20210122878
2021-04-29

Highly active double metal cyanide compounds

#8
20210079214
2021-03-18

Polyetheretherketone-containing resin composition and seal ring

#9
20200317918
2020-10-08

Controlled cure rate using polyether-coated synergists

#10
20200140731
2020-05-07

Sealing resin composition

#11
20200109281
2020-04-09

Poly(arylene ether) copolymer

#12
20190322858
2019-10-24

Epoxy resin composition

#13
20160186862
2016-06-30

Seal ring

#14
20150175862
2015-06-25

Puncture sealing agent

#15
20140087115
2014-03-27

Large diameter thermoplastic seal

#16
20130217828
2013-08-22

Curable composition

#17
20120059130
2012-03-08

CURABLE COMPOSITIONS CONSISTING OF SILANES WITH THREE HYDROLYSABLE GROUPS

#18
20110232825
2011-09-29

CYCLOHEXANE POLYCARBOXYLIC ACID DERIVATIVES AS PLASTICIZERS FOR ADHESIVES AND SEALANTS

#19
20100216950
2010-08-26

Curable compositions consisting of silanes with three hydrolysable groups

#20
20100152373
2010-06-17

Curable composition

#21
20100117310
2010-05-13

LARGE DIAMETER THERMOPLASTIC SEAL

#22
20100116422
2010-05-13

Method of forming large diameter thermoplastic seal

#23
20090093590
2009-04-09

Seal Material for Semiconductor Production Apparatus

#24
20070021563
2007-01-25

Curable composition

#25
20060278391
2006-12-14

Hydrogel for use in downhole seal applications

#26
20060270819
2006-11-30

Curable composition

#27
20060211821
2006-09-21

Organic polymer containing reactive silicon group

#28
20060047028
2006-03-02

Hydrogel for use in downhole seal applications

#29
20050261412
2005-11-24

Curable compositions, sealing material, and adhesive

#30
20050171248
2005-08-04

Hydrogel for use in downhole seal applications