ClassID:

108104

C11D7/06 - page 2 - CPC Classification

Classification description:

Compositions of detergents based essentially on non-surface-active compounds; Inorganic compounds; Water-soluble compounds Hydroxides

Recent Application in this class:
#301
20060091110
2006-05-04

Cleaning solution and method for cleaning semiconductor device by using the same

#302
20060089285
2006-04-27

Stabilized chlorine bleach in alkaline detergent composition and method of making and using the same

#303
20060073997
2006-04-06

Solutions for cleaning silicon semiconductors or silicon oxides

#304
20060054181
2006-03-16

Cleaning method and solution for cleaning a wafer in a single wafer process

#305
20060040841
2006-02-23

Combination of a nonionic silicone surfactant and a nonionic surfactant in a solid block detergent

#306
20060040838
2006-02-23

Cleaning liquid and cleaning method

#307
20060025320
2006-02-02

Seminconductor surface treatment and mixture used therein

#308
20060016463
2006-01-26

Composition and process for removing titanium dioxide residues from surfaces

#309
20050284844
2005-12-29

Cleaning composition for semiconductor components and process for manufacturing semiconductor device

#310
20050277571
2005-12-15

Facility parts cleaning solution for processing of (meth)acrylic acid and/or (meth)acrylic esters and cleaning method using said cleaning solution

#311
20050272625
2005-12-08

Method of removing organic materials using aqueous cleaning solutions

#312
20050263739
2005-12-01

Method and composition to decrease iron sulfide deposits in pipe lines

#313
20050245422
2005-11-03

Alkali cleaner

#314
20050245420
2005-11-03

Method of enhancing a soiled porous surface and maintenance thereof

#315
20050239673
2005-10-27

Microelectronic cleaning compositions containing oxidizers and organic solvents

#316
20050227888
2005-10-13

Cleaning method and solution for cleaning a wafer in a single wafer process

#317
20050227491
2005-10-13

Methods of forming integrated circuit devices having polished tungsten metal layers therein

#318
20050197265
2005-09-08

Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate

#319
20050194261
2005-09-08

Electrochemically activated solutions and a new economical way of producing these solutions

#320
20050181961
2005-08-18

Alkaline chemistry for post-CMP cleaning

#321
20050119144
2005-06-02

Method of cleaning with demineralized water and composition therefor

#322
20050101508
2005-05-12

Detergent components with tailored physical properties

#323
20050090415
2005-04-28

Methods and compositions for removing resin coatings

#324
20050081892
2005-04-21

Cleaning composition containing EDTA for cleaning formers

#325
20050079985
2005-04-14

Method of preventing odors

#326
20050065050
2005-03-24

Selective silicon etch chemistries, methods of production and uses thereof

#327
20050065049
2005-03-24

Chemical composition for use with group IIA metal fluorides

#328
20050062016
2005-03-24

Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching

#329
20050059565
2005-03-17

Cleaning composition

#330
20050054548
2005-03-10

Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process

#331
20050045202
2005-03-03

Method for wafer surface cleaning using hydroxyl radicals in deionized water

#332
20050037937
2005-02-17

Process of treating a carpet with a composition comprising a zeolite

#333
20050026802
2005-02-03

Disinfectant glass wipe