Patents-Review.com
ClassID:

119997 ⎘

C23C14/0047 - CPC Classification

Classification description:

Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material; Reactive sputtering or evaporation; Reactive sputtering Activation or excitation of reactive gases outside the coating chamber

Sub-classes:
Recent Application in this class:
#1
20230221467
2023-07-13

COATINGS OF NON-PLANAR SUBSTRATES AND METHODS FOR THE PRODUCTION THEREOF

 #2
20210332469
2021-10-28

METHOD FOR MANUFACTURING TWO-DIMENSIONAL MATERIAL

 #3
20210003744
2021-01-07

Coatings of non-planar substrates and methods for the production thereof

 #4
20200219704
2020-07-09

Deposition system with integrated cooling on a rotating drum

 #5
20190284685
2019-09-19

THIN FILM FORMATION APPARATUS, SPUTTERING CATHODE, AND METHOD OF FORMING THIN FILM

 #6
20190214234
2019-07-11

DEPOSITION SYSTEM WITH INTEGRATED COOLING ON A ROTATING DRUM

 #7
20190185993
2019-06-20

Selective atomic layer deposition of ruthenium

 #8
20180011225
2018-01-11

Coatings of non-planar substrates

 #9
20170117119
2017-04-27

Deposition system with integrated cooling on a rotating drum

 #10
20150368783
2015-12-24

DEPOSITION APPARATUS WITH GAS SUPPLY AND METHOD FOR DEPOSITING MATERIAL

 #11
20130075247
2013-03-28

METHOD AND SYSTEM FOR FORMING CHALCOGENIDE SEMICONDUCTOR MATERIALS USING SPUTTERING AND EVAPORATION FUNCTIONS

 #12
20130015057
2013-01-17

CATHODE SPUTTER DEPOSITION OF A Cu(In,Ga)X2 THIN FILM

 #13
20100264022
2010-10-21

Sputtering And Ion Beam Deposition

 #14
20100258437
2010-10-14

APPARATUS FOR REACTIVE SPUTTERING DEPOSITION

 #15
20070181421
2007-08-09

Sputtering system providing large area sputtering and plasma-assisted reactive gas dissociation

 #16
20050029091
2005-02-10

Apparatus and method for reactive sputtering deposition

 #17
20050023131
2005-02-03

Method and apparatus for forming fluoride thin film

 #18
20050011757
2005-01-20

Sputtering apparatus