120247 ⎘
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber Expansion of gas before it reaches the substrate
SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURING
#2GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME
#3SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURING
#4METHOD SYSTEM AND APPARATUS FOR REMOTE SOLID REFILL
#5Atomic layer deposition apparatus
#6METHODS FOR MANUFACTURING A SEMICONDUCTOR WAFER USING A PREHEAT RING IN A WAFER REACTOR
#7Asymmetric injection for better wafer uniformity
#8Processing system and method of delivering a reactant gas
#9REACTOR FOR GAS TREATMENT OF A SUBSTRATE
#10Systems and methods for a preheat ring in a semiconductor wafer reactor
#11Dogbone inlet cone profile for remote plasma oxidation chamber
#12GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME
#13Reactor system including a gas distribution assembly for use with activated species and method of using same
#14Asymmetric injection for better wafer uniformity
#15Dogbone inlet cone profile for remote plasma oxidation chamber
#16Effective and novel design for lower particle count and better wafer quality by diffusing the flow inside the chamber
#17Counter-flow multi inject for atomic layer deposition chamber
#18Chemical control features in wafer process equipment
#19Integrated cluster tool for selective area deposition
#20Apparatus for depositing chalcogenide thin films
#21Dogbone inlet cone profile for remote plasma oxidation chamber
#22Thin film encapsulation processing system and process kit
#23Film forming apparatus
#24Atomic Layer Deposition with Plasma Source
#25Integrated cluster tool for selective area deposition
#26Effective and novel design for lower particle count and better wafer quality by diffusing the flow inside the chamber
#27Gas distribution showerhead for semiconductor processing
#28Gas distribution showerhead for semiconductor processing
#29Gas jetting apparatus for film formation apparatus
#30Gas distribution apparatus for improved film uniformity in an epitaxial system
#31Chemical control features in wafer process equipment
#32Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system
#33SUBSTRATE PROCESSING APPARATUS
#34Modular gas injection device
#35Reaction system for growing a thin film
#36Atomic layer deposition processing apparatus to reduce heat energy conduction
#37Chemical control features in wafer process equipment
#38Atomic layer deposition chamber with counter-flow multi inject
#39FILM FORMATION APPARATUS, FILM FORMATION METHOD, AND STORAGE MEDIUM
#40Atomic layer deposition with plasma source
#41Method and system for controlling coating in non-line-of-sight locations
#42Gas supply manifold and method of supplying gases to chamber using same
#43Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer readable recording medium
#44Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
#45Low temperature silicon nitride films using remote plasma CVD technology
#46Plasma processing apparatus
#47STRUCTURE FOR IMPROVED GAS ACTIVATION FOR CROSS-FLOW TYPE THERMAL CVD CHAMBER
#48Showerhead electrode assembly with gas flow modification for extended electrode life
#49Chemical control features in wafer process equipment
#50Deposition reactor with plasma source
#51Atomic layer deposition with plasma source
#52Gas injection device with uniform gas velocity
#53Modular gas injection device
#54Reaction system for growing a thin film
#55Substrate cleaning apparatus and vacuum processing system
#56Process gas delivery for semiconductor process chambers
#57ALD systems and methods
#58GAS SUPPLY DEVICE, PROCESSING APPARATUS, PROCESSING METHOD, AND STORAGE MEDIUM
#59Apparatus for atomic layer deposition on a moving substrate
#60Apparatus and method for loading a film cassette for gaseous vapor deposition
#61Loaded film cassette for gaseous vapor deposition
#62APPARATUS AND METHOD FOR UNLOADING A FILM CASSETTE FOR GASEOUS VAPOR DEPOSITION
#63Apparatus for gaseous vapor deposition
#64Film cassette for gaseous vapor deposition
#65METHOD FOR MAKING A FILM CASSETTE FOR GASEOUS VAPOR DEPOSITION
#66APPARATUS FOR ATOMIC LAYER DEPOSITION
#67Gas supply device
#68Gas delivery apparatus and method for atomic layer deposition
#69Reaction chamber with removable liner
#70High accuracy vapor generation and delivery for thin film deposition
#71PLASMA ATOMIC LAYER DEPOSITION SYSTEM AND METHOD
#72System and method for thin film deposition
#73Integration of ALD tantalum nitride for copper metallization
#74In-situ chamber treatment and deposition process
#75Process gas delivery for semiconductor process chamber
#76Apparatus and method for hybrid chemical processing
#77Hardware set for growth of high k and capping material films
#78Chemical vapor deposition apparatus
#79Chemical vapor deposition apparatus
#80Apparatus for cyclical depositing of thin films
#81DEPOSITION APPARATUS
#82Apparatus for hybrid chemical processing
#83Showerhead electrode assembly with gas flow modification for extended electrode life
#84Vortex chamber lids for atomic layer deposition
#85VORTEX CHAMBER LIDS FOR ATOMIC LAYER DEPOSITION
#86PRECURSORS AND HARDWARE FOR CVD AND ALD
#87Methods for atomic layer deposition of hafnium-containing high-K dielectric materials
#88Gas delivery apparatus for atomic layer deposition
#89Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
#90ATOMIC LAYER DEPOSITION PROCESS
#91BATCH-TYPE DEPOSITION APPARATUS HAVING A GLAND PORTION
#92Apparatus and method for hybrid chemical processing
#93INTEGRATION PROCESS OF TUNGSTEN ATOMIC LAYER DEPOSITION FOR METALLIZATION APPLICATION
#94APPARATUS FOR CYCLICAL DEPOSITING OF THIN FILMS
#95Enhanced copper growth with ultrathin barrier layer for high performance interconnects
#96Enhanced copper growth with ultrathin barrier layer for high performance interconnects
#97Reaction system for growing a thin film
#98Wafer support pin assembly
#99Integration of ALD tantalum nitride for copper metallization
#100High accuracy vapor generation and delivery for thin film deposition
#101Apparatuses and methods for atomic layer deposition of hafnium-containing high-k dielectric materials
#102Apparatuses for atomic layer deposition
#103Atomic layer deposition apparatus having improved reactor and sample holder
#104Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
#105Batch-type deposition apparatus having gland portion
#106Gas delivery apparatus for atomic layer deposition
#107Integration of ALD tantalum nitride for copper metallization