120248 ⎘
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber Compression of gas before it reaches the substrate
SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURING
#2GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME
#3SLOT-DIE TYPE GAS DISTRIBUTION DEVICE FOR PHOTOVOLTAIC MANUFACTURING
#4GAS DISTRIBUTION ASSEMBLY AND METHOD OF USING SAME
#5Thin film encapsulation processing system and process kit
#6Film forming apparatus
#7Substrate processing apparatus
#8Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
#9Gas distribution plate for chemical vapor deposition systems and methods of using same
#10Method and apparatus to apply material to a surface
#11SEMICONDUCTOR PROCESSING SYSTEM AND METHODS USING CAPACITIVELY COUPLED PLASMA
#12Metal organic chemical vapor deposition equipment
#13High productivity deposition reactor comprising a gas flow chamber having a tapered gas flow space
#14High accuracy vapor generation and delivery for thin film deposition
#15METHOD FOR PRODUCING GROUP III-V COMPOUND SEMICONDUCTOR
#16Chemical vapor deposition apparatus
#17Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
#18Metalorganic chemical vapor deposition reactor
#19Metal organic chemical vapor deposition equipment
#20High accuracy vapor generation and delivery for thin film deposition