120330 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus coating on selected surface areas plating on one side
Sub-classes:Selectively Plated Rolls Of Materials And Related Methods
#2Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
#3Lead-frame structure, lead-frame, surface mount electronic device and methods of producing same
#4Polymer-metal composite structural component
#5Two-shot molding for selectively metalizing parts
#6Selectively plated rolls of materials and related methods
#7Composition for forming conductive pattern by irradiation of electromagnetic waves, method for forming conductive pattern using same, and resin structure having conductive pattern
#8Plating method for printed layer
#9Method for manufacturing polymer-metal composite structural component
#10Silver plating in electronics manufacture
#11Fabrication methods for chemical compound thin films
#12APPARATUS FOR DEPOSITING THIN FILM
#13Plating apparatus, plating method and storage medium
#14Silver plating in electronics manufacture
#15Chemical bath deposition apparatuses and fabrication methods for chemical compound thin films
#16Silver coated nylon fibers and associated methods of manufacture and use
#17Second surface metallization
#18Plating process
#19Silver plating in electronics manufacture
#20Apparatus and method for electroless spray deposition