C23C18/1621 - CPC Classification Index

ClassID:

120334 ⎘

C23C18/1621 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Apparatus for electroless plating Protection of inner surfaces of the apparatus

Sub-classes:

C23C18/1623 » {through electrochemical processes} 1
C23C18/1625 » {through chemical processes} 5
C23C18/1626 » {through mechanical processes} 1

Recent Application in this class:

20220208604

2022-06-30

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEMICONDUCTOR DEVICE MANUFACTURING

20150300404

2015-10-22

Bearing arrangement comprising a corrosion protection device

20070264451

2007-11-15

Method of manufacturing polymer member and polymer member

20050141150

2005-06-30

Electrical connection of components