ClassID:

120339

C23C18/163 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Apparatus for electroless plating; Specific elements or parts of the apparatus Supporting devices for articles to be coated

Recent Application in this class:
#1
20240425988
2024-12-26

APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE HAVING UPPER AND LOWER INLETS FOR SUPPLYING SUPERCRITICAL FLUIDS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

#2
20240309511
2024-09-19

PLATING METHOD AND PLATING APPARATUS

#3
20240200195
2024-06-20

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

#4
20240141501
2024-05-02

SUBSTRATE PROCESSING METHOD

#5
20240050992
2024-02-15

Pre-wet module, deaerated liquid circulation system, and pre-wet method

#6
20230313382
2023-10-05

PREVENTION OF UNWANTED PLATING ON RACK COATINGS FOR ELECTRODEPOSITION

#7
20230098105
2023-03-30

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#8
20230047104
2023-02-16

Apparatus for electroless metallization of a target surface of at least one workpiece, and method and diffuser plate for this purpose

#9
20220396882
2022-12-15

Substrate liquid processing apparatus and substrate liquid processing method

#10
20220379352
2022-12-01

Pre-wet module, deaerated liquid circulation system, and pre-wet method

#11
20220154342
2022-05-19

Substrate processing apparatus and substrate processing method

#12
20220145468
2022-05-12

Substrate processing apparatus, substrate processing method and recording medium

#13
20220136111
2022-05-05

Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same

#14
20220056590
2022-02-24

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#15
20220049356
2022-02-17

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

#16
20220010452
2022-01-13

ELECTROLESS PLATING PROCESS

#17
20210404754
2021-12-30

Applying coatings to the interior surfaces of heat exchangers

#18
20210375662
2021-12-02

Methods and apparatus for electroless plating dispense

#19
20210317581
2021-10-14

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

#20
20210189568
2021-06-24

COATING CARRIER ASSEMBLY AND COATING DEVICE

#21
20210175079
2021-06-10

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

#22
20210079529
2021-03-18

DEVICE FOR ELECTROLESS METALLIZATION OF A TARGET SURFACE OF A LEAST ONE WORKPIECE

#23
20200326145
2020-10-15

Applying coatings to the interior surfaces of heat exchangers

#24
20200325581
2020-10-15

Plating method and recording medium

#25
20200291526
2020-09-17

Device for electroless metallization of a target surface of at least one workpiece

#26
20200102654
2020-04-02

Substrate processing apparatus

#27
20200080218
2020-03-12

Method and apparatus for processing a substrate

#28
20200080204
2020-03-12

Surface treating apparatus

#29
20190281735
2019-09-12

Selectively Plated Rolls Of Materials And Related Methods

#30
20190267256
2019-08-29

Semiconductor-manufacturing apparatus and method for manufacturing semiconductor device

#31
20190233964
2019-08-01

Plating apparatus

#32
20190157083
2019-05-23

Forming method of hard mask

#33
20180282893
2018-10-04

Substrate transporting apparatus, control apparatus for substrate transporting apparatus, displacement compensation method for substrate transporting apparatus, program for implementing method and recording medium that records program

#34
20180235115
2018-08-16

Selectively plated rolls of materials and related methods

#35
20180179656
2018-06-28

Method and apparatus for processing a substrate

#36
20180100237
2018-04-12

Surface treating apparatus

#37
20180080139
2018-03-22

SYSTEMS AND METHODS FOR PREPARING AND PLATING OF WORK ROLLS

#38
20180002811
2018-01-04

Substrate liquid processing apparatus, substrate liquid processing method and recording medium

#39
20170362693
2017-12-21

Air skive with vapor injection

#40
20170330831
2017-11-16

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

#41
20170292192
2017-10-12

Plating apparatus, plating method, and recording medium

#42
20170283979
2017-10-05

Electrolytic stripping agent for jig

#43
20170175285
2017-06-22

Plating apparatus

#44
20170159183
2017-06-08

Resin plating method

#45
20170157917
2017-06-08

Liquid ejection hole configuration for web guide

#46
20170157916
2017-06-08

Liquid ejection hole orientation for web guide

#47
20170029952
2017-02-02

Electroless plating system including bubble guide

#48
20170028706
2017-02-02

Web transport system including scavenger blade

#49
20160333480
2016-11-17

Method of electrolessly plating nickel on tubulars

#50
20160322244
2016-11-03

Wafer rotating apparatus

#51
20160305032
2016-10-20

Plating apparatus and container bath

#52
20160281254
2016-09-29

Plating apparatus

#53
20160258066
2016-09-08

Plating method

#54
20160254222
2016-09-01

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

#55
20160168713
2016-06-16

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH LIQUID FLOW BEARING

#56
20160160352
2016-06-09

ELECTROLESS PLATING APPARATUS

#57
20160102403
2016-04-14

Metallization inhibitors for plastisol coated plating tools

#58
20160102397
2016-04-14

Vacuum pre-wetting apparatus and methods

#59
20160053378
2016-02-25

Plating method, plating apparatus, and storage medium

#60
20160040293
2016-02-11

METHOD FOR ROLL-TO-ROLL ELECTROLESS PLATING WITH LOW DISSOLVED OXYGEN CONTENT

#61
20160040292
2016-02-11

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH LOW DISSOLVED OXYGEN CONTENT

#62
20160040291
2016-02-11

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH MICRO-BUBBLE INJECTOR

#63
20160040290
2016-02-11

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH

#64
20150348772
2015-12-03

Metallization of the wafer edge for optimized electroplating performance on resistive substrates

#65
20150232994
2015-08-20

Plating apparatus, plating method and storage medium

#66
20150099355
2015-04-09

Plating apparatus, plating method, and storage medium

#67
20150096885
2015-04-09

Systems and methods for preparing and plating of work rolls

#68
20150001177
2015-01-01

Process for metallizing nonconductive plastic surfaces

#69
20140295093
2014-10-02

Plating apparatus and plating method

#70
20140245954
2014-09-04

Plating apparatus

#71
20140161979
2014-06-12

Fabrication methods for chemical compound thin films

#72
20140099433
2014-04-10

BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

#73
20130122704
2013-05-16

Electroless plating apparatus and electroless plating method

#74
20130036971
2013-02-14

LIFTING AND CONVEYING APPARATUS FOR CHEMICAL BATH DEPOSITION

#75
20120305404
2012-12-06

METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE

#76
20120279867
2012-11-08

METHOD FOR PRODUCING METAL COATINGS ON PLASTICS MATERIAL PARTS

#77
20120272895
2012-11-01

Bandoleer of article carriers

#78
20120213914
2012-08-23

Apparatus and method for electroless deposition of materials on semiconductor substrates

#79
20110318493
2011-12-29

Chemical bath deposition apparatuses and fabrication methods for chemical compound thin films

#80
20110203518
2011-08-25

Substrate processing method and apparatus

#81
20110011335
2011-01-20

Simultaneous electroless plating of two substrates

#82
20100221432
2010-09-02

Substrate processing method and apparatus

#83
20090120360
2009-05-14

Plating jig

#84
20090081386
2009-03-26

Systems and methods for in situ annealing of electro- and electroless platings during deposition

#85
20080178800
2008-07-31

Substrate holding apparatus

#86
20080085370
2008-04-10

Electroless plating method and apparatus

#87
20070122552
2007-05-31

COATING DEVICE

#88
20070012560
2007-01-18

Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces

#89
20060091016
2006-05-04

Method and apparatus for plating extrusion dies

#90
20050281947
2005-12-22

Substrate processing unit and substrate processing apparatus

#91
20050221015
2005-10-06

Apparatus and method for electroless deposition of materials on semiconductor substrates