C23C18/1632 - CPC Classification Index

ClassID:

120340 ⎘

C23C18/1632 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Apparatus for electroless plating Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells

Recent Application in this class:

20240309511

2024-09-19

PLATING METHOD AND PLATING APPARATUS

20240044007

2024-02-08

ELECTROLESS PLATING APPARATUS

20230212754

2023-07-06

CARTRIDGE ASSEMBLY, JIG, JIG ASSEMBLY, AND APPARATUS FOR ELECTROLESS PLATING

20220406605

2022-12-22

SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS

20210002770

2021-01-07

Substrate liquid processing apparatus, substrate liquid processing method and recording medium

20200325581

2020-10-15

Plating method and recording medium

20200224315

2020-07-16

Surface treating apparatus

20200224314

2020-07-16

Surface treating apparatus and surface treatment method

20200080204

2020-03-12

Surface treating apparatus

#10

20190233964

2019-08-01

Plating apparatus

#11

20190157083

2019-05-23

Forming method of hard mask

#12

20190048472

2019-02-14

Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias

#13

20190024238

2019-01-24

Wet type processing apparatus for resin film

#14

20180240930

2018-08-23

METHOD AND APPARATUS FOR MANUFACTURING LEAD WIRE FOR SOLAR CELL

#15

20180117618

2018-05-03

Surface treating apparatus

#16

20180100237

2018-04-12

Surface treating apparatus

#17

20180002811

2018-01-04

Substrate liquid processing apparatus, substrate liquid processing method and recording medium

#18

20170292192

2017-10-12

Plating apparatus, plating method, and recording medium

#19

20170285261

2017-10-05

Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber

#20

20170283953

2017-10-05

METHOD FOR REGENERATING PLATING LIQUID, PLATING METHOD, AND PLATING APPARATUS

#21

20170175285

2017-06-22

Plating apparatus

#22

20170167029

2017-06-15

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM

#23

20170029951

2017-02-02

Web transport system including fluid shield

#24

20170028706

2017-02-02

Web transport system including scavenger blade

#25

20160333480

2016-11-17

Method of electrolessly plating nickel on tubulars

#26

20160305032

2016-10-20

Plating apparatus and container bath

#27

20160281254

2016-09-29

Plating apparatus

#28

20160258066

2016-09-08

Plating method

#29

20160160352

2016-06-09

ELECTROLESS PLATING APPARATUS

#30

20160040294

2016-02-11

METHOD OF CONTROLLING OXYGEN LEVELS FOR ELECTROLESS PLATING OF CATALYTIC FINE LINES OR FEATURES

#31

20160025925

2016-01-28

Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber

#32

20160023292

2016-01-28

Joining method and joining system

#33

20160013101

2016-01-14

PRE-TREATMENT METHOD OF PLATING, PLATING SYSTEM, AND RECORDING MEDIUM

#34

20150232994

2015-08-20

Plating apparatus, plating method and storage medium

#35

20150165471

2015-06-18

Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program

#36

20150159276

2015-06-11

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

#37

20150096490

2015-04-09

Apparatus for plating process

#38

20150079785

2015-03-19

Plating method, plating system and storage medium

#39

20150037512

2015-02-05

Method for regenerating plating liquid, plating method, and plating apparatus

#40

20150030774

2015-01-29

Plating method, plating system and storage medium

#41

20150013905

2015-01-15

WET PROCESSING APPARATUS AND PLATING APPARATUS

#42

20140357015

2014-12-04

Method and apparatus for manufacturing lead wire for solar cell

#43

20140356539

2014-12-04

Plating apparatus, plating method and storage medium

#44

20140318975

2014-10-30

Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

#45

20140302242

2014-10-09

Plating apparatus, plating method and storage medium having plating program stored thereon

#46

20140295093

2014-10-02

Plating apparatus and plating method

#47

20140245954

2014-09-04

Plating apparatus

#48

20130122704

2013-05-16

Electroless plating apparatus and electroless plating method

#49

20120282483

2012-11-08

Method for strengthening adhesion between dielectric layers formed adjacent to metal layers

#50

20120269987

2012-10-25

Processes and Systems for Engineering a Barrier Surface for Copper Deposition

#51

20120213914

2012-08-23

Apparatus and method for electroless deposition of materials on semiconductor substrates

#52

20120045897

2012-02-23

Wafer electroless plating system and associated methods

#53

20110203518

2011-08-25

Substrate processing method and apparatus

#54

20110027987

2011-02-03

Method and apparatus for manufacturing semiconductor device

#55

20110014489

2011-01-20

Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers

#56

20100221432

2010-09-02

Substrate processing method and apparatus

#57

20100149724

2010-06-17

Method and apparatus for producing a ceramic electronic component

#58

20100124619

2010-05-20

Solar cell metallization using inline electroless plating

#59

20100105154

2010-04-29

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

#60

20100062159

2010-03-11

Cap metal forming method

#61

20100009535

2010-01-14

Methods and systems for barrier layer surface passivation

#62

20090311429

2009-12-17

Plating method and apparatus

#63

20080254621

2008-10-16

Wafer electroless plating system and associated methods

#64

20080146025

2008-06-19

Methods and systems for barrier layer surface passivation

#65

20080057198

2008-03-06

Method for barrier interface preparation of copper interconnect

#66

20080011228

2008-01-17

Semiconductor device, method for manufacturing the same, and plating solution

#67

20080000776

2008-01-03

Method and apparatus for processing substrate

#68

20070292603

2007-12-20

Processes and systems for engineering a barrier surface for copper deposition

#69

20070224811

2007-09-27

Substrate processing method and substrate processing apparatus

#70

20070131164

2007-06-14

Electroless metal film-plating system

#71

20070117365

2007-05-24

Plating method and apparatus

#72

20070085162

2007-04-19

CAPPING OF COPPER STRUCTURES IN HYDROPHOBIC ILD USING AQUEOUS ELECTRO-LESS BATH

#73

20060194431

2006-08-31

Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process

#74

20060163075

2006-07-27

Method and apparatus for downhole pipe or casing repair

#75

20060144714

2006-07-06

Substrate plating method and apparatus

#76

20060062897

2006-03-23

Patterned wafer thickness detection system

#77

20060040487

2006-02-23

Semiconductor device, method for manufacturing the same, and plating solution

#78

20060037855

2006-02-23

Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces

#79

20060033678

2006-02-16

Integrated electroless deposition system

#80

20060032758

2006-02-16

Method and system for idle state operation

#81

20050260345

2005-11-24

Apparatus for electroless deposition of metals onto semiconductor substrates

#82

20050245080

2005-11-03

Method for processing substrate

#83

20050241955

2005-11-03

Substrate processing apparatus and substrate processing method

#84

20050236268

2005-10-27

Substrate processing apparatus

#85

20050227488

2005-10-13

Capping of copper structures in hydrophobic ILD using aqueous electro-less bath

#86

20050221015

2005-10-06

Apparatus and method for electroless deposition of materials on semiconductor substrates

#87

20050173253

2005-08-11

Method and apparatus for infilm defect reduction for electrochemical copper deposition

#88

20050170080

2005-08-04

System and method for electroless surface conditioning

#89

20050163916

2005-07-28

Electroless plating systems and methods

#90

20050160990

2005-07-28

Apparatus for electroless deposition of metals onto semiconductor substrates

#91

20050089639

2005-04-28

Continuous plating method of filament bundle and apparatus therefor

#92

20050064703

2005-03-24

Substrate processing method

#93

15286421

2017-12-05

Atomic layer etching for enhanced bottom-up feature fill