C23C18/1675 - CPC Classification Index

ClassID:

120364 ⎘

C23C18/1675 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating Process conditions

Sub-classes:

C23C18/1676 » {Heating of the solution} 71
C23C18/1678 » {Heating of the substrate} 59
C23C18/168 » {Control of temperature, e.g. temperature of bath, substrate} 66
C23C18/1682 » {Control of atmosphere} 51
C23C18/1683 » {Control of electrolyte composition, e.g. measurement, adjustment } 64
C23C18/1685 » {with supercritical condition, e.g. chemical fluid deposition} 18
C23C18/1687 » {with ionic liquid} 12

Recent Application in this class:

20250185181

2025-06-05

METHOD FOR PLATING EDGE CONNECTORS ON CIRCUIT BOARD WITH GOLD, AND CIRCUIT BOARD

20240309511

2024-09-19

PLATING METHOD AND PLATING APPARATUS

20240200195

2024-06-20

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

20240044039

2024-02-08

IN-SITU FINGERPRINTING FOR ELECTROCHEMICAL DEPOSITION AND/OR ELECTROCHEMICAL ETCHING

20230304795

2023-09-28

AGITATION MONITORING SYSTEM FOR PLATING PROCESS

20220208604

2022-06-30

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEMICONDUCTOR DEVICE MANUFACTURING

20210375662

2021-12-02

Methods and apparatus for electroless plating dispense

20210108316

2021-04-15

PLATING METHOD, PLATING SYSTEM, AND RECORDING MEDIUM

20210017666

2021-01-21

In-situ fingerprinting for electrochemical deposition and/or electrochemical etching

#10

20200325581

2020-10-15

Plating method and recording medium

#11

20190393173

2019-12-26

Method of manufacturing a semiconductor element front side electrode

#12

20190267242

2019-08-29

Plating method, plating apparatus and recording medium

#13

20190233964

2019-08-01

Plating apparatus

#14

20190157083

2019-05-23

Forming method of hard mask

#15

20190048472

2019-02-14

Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias

#16

20180350670

2018-12-06

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL OXIDES ON A METAL SEED LAYER

#17

20180243958

2018-08-30

Two-shot molding for selectively metalizing parts

#18

20180122641

2018-05-03

Substrate processing method

#19

20180010252

2018-01-11

Substrate processing apparatus, substrate processing method and recording medium

#20

20170292192

2017-10-12

Plating apparatus, plating method, and recording medium

#21

20170260631

2017-09-14

Roll-to-roll electroless plating system with spreader duct

#22

20170175285

2017-06-22

Plating apparatus

#23

20170159183

2017-06-08

Resin plating method

#24

20160333480

2016-11-17

Method of electrolessly plating nickel on tubulars

#25

20160281254

2016-09-29

Plating apparatus

#26

20160222534

2016-08-04

Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition

#27

20160122551

2016-05-05

Compositions of coated diamond nanoparticles, methods of forming coated diamond nanoparticles, and methods of forming coatings

#28

20160115597

2016-04-28

Plating bath solutions

#29

20160097129

2016-04-07

METHOD FOR FABRICATING METAL AND OXIDE HYBRID-COATED NANOCARBON

#30

20160076150

2016-03-17

Roll-to-roll electroless plating system with spreader duct

#31

20160040293

2016-02-11

METHOD FOR ROLL-TO-ROLL ELECTROLESS PLATING WITH LOW DISSOLVED OXYGEN CONTENT

#32

20160040292

2016-02-11

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH LOW DISSOLVED OXYGEN CONTENT

#33

20160040290

2016-02-11

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM FOR CONTROLLED SUBSTRATE DEPTH

#34

20150345027

2015-12-03

Aqueous electroless nickel plating bath and method of using the same

#35

20150267559

2015-09-24

Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine

#36

20150252488

2015-09-10

Device and method for the treatment of flat material to be treated

#37

20150247242

2015-09-03

Pre-treatment method of plating, storage medium, and plating system

#38

20150232995

2015-08-20

Electroless deposition of continuous platinum layer

#39

20150191825

2015-07-09

Liquid deposition composition and process for forming metal therefrom

#40

20150165471

2015-06-18

Substrate processing apparatus, substrate processing method, and computer-readable storage medium storing substrate processing program

#41

20150159276

2015-06-11

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

#42

20150056378

2015-02-26

Method of manufacturing palladium thin film by using electroless-plating method

#43

20150050422

2015-02-19

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS

#44

20150008132

2015-01-08

In-situ fingerprinting for electrochemical deposition and/or electrochemical etching

#45

20140312003

2014-10-23

Fabrication of tunneling junction for nanopore DNA sequencing

#46

20140312002

2014-10-23

Fabrication of tunneling junction for nanopore DNA sequencing

#47

20140295093

2014-10-02

Plating apparatus and plating method

#48

20140272110

2014-09-18

Methods of plating or coating ultrasound transducers

#49

20140256128

2014-09-11

Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer

#50

20140245954

2014-09-04

Plating apparatus

#51

20140148006

2014-05-29

Liquid treatment apparatus and liquid treatment method

#52

20140127410

2014-05-08

Plating method, plating apparatus and storage medium

#53

20140120245

2014-05-01

Plating method

#54

20130122704

2013-05-16

Electroless plating apparatus and electroless plating method

#55

20120295013

2012-11-22

ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

#56

20110247936

2011-10-13

TECHNOLOGY FOR THE DEPOSITION OF ELECTRICALLY AND CHEMICALLY ACTIVE LAYERS FOR USE IN BATTERIES, FUEL CELLS AND OTHER ELECTROCHEMICAL DEVICES

#57

20110022210

2011-01-27

Process for selecting surrogate part

#58

20100075053

2010-03-25

Non-electrolytic method for metallizing a substrate by the reduction of metallic salt(s) and the spraying of aerosol(s)

#59

20090000549

2009-01-01

Substrate processing method and apparatus

#60

20080206474

2008-08-28

Stabilization and Performance of Autocatalytic Electroless Processes

#61

20060062897

2006-03-23

Patterned wafer thickness detection system

#62

20050088647

2005-04-28

Apparatus and method of detecting the electroless deposition endpoint

#63

20050009213

2005-01-13

Substrate processing method