ClassID:

120376

C23C18/1696 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating; After-treatment; Heat-treatment Control of atmosphere

Recent Application in this class:
#1
20260149092
2026-05-28

NICKEL PLATED STEEL SHEET FOR BATTERY CASE HAVING EXCELLENT SURFACE CORROSION RESISTANCE AND METHOD FOR MANUFACTURING

#2
20250034717
2025-01-30

ELECTROLESS NI-P PLATING FILM FOR SLIDING MEMBER AND MANUFACTURING METHOD THEREFOR

#3
20220235468
2022-07-28

Laminate

#4
20190211434
2019-07-11

Thermal spraying of ceramic materials comprising metal or metal alloy coating

#5
20180163309
2018-06-14

Electroless process for depositing refractory metals

#6
20180122641
2018-05-03

Substrate processing method

#7
20180076275
2018-03-15

High resistivity soft magnetic material for miniaturized power converter

#8
20170009350
2017-01-12

Metallic coating and a method for producing the same

#9
20160281250
2016-09-29

Electrochemical process for the preparation of lead foam

#10
20160276654
2016-09-22

Anode active material for lithium secondary batteries

#11
20160247683
2016-08-25

Catalyst layer forming method, catalyst layer forming system and recording medium

#12
20160013102
2016-01-14

Catalyst layer forming method, catalyst layer forming system, and recording medium

#13
20150380254
2015-12-31

Method for forming a metal silicide using a solution containing gold ions and fluorine ions

#14
20150030774
2015-01-29

Plating method, plating system and storage medium

#15
20140242460
2014-08-28

Anode active material for lithium secondary batteries and method for manufacturing same

#16
20140120250
2014-05-01

Surface-treated mold and method of producing surface-treated mold

#17
20130299450
2013-11-14

Method of forming low-resistance metal pattern, patterned metal structure, and display devices using the same

#18
20130101832
2013-04-25

NOBLE METAL COATING AND MANUFACTURING METHOD THEREOF

#19
20120196441
2012-08-02

Solution and method for activating the oxidized surface of a semiconductor substrate

#20
20120164328
2012-06-28

FILM FORMATION METHOD AND STORAGE MEDIUM

#21
20120156892
2012-06-21

Solution and process for activating the surface of a semiconductor substrate

#22
20110168669
2011-07-14

Method of preparing low resistance metal line, patterned metal line structure, and display device using the same

#23
20110127403
2011-06-02

Surface-treated mold and method of producing surface-treated mold

#24
20110117271
2011-05-19

Method for forming a seed layer for the deposition of a metal on a substrate

#25
20100230643
2010-09-16

Process for producing metal film

#26
20100212590
2010-08-26

Apparatus for manufacturing molten zinc coated steel sheet

#27
20100200120
2010-08-12

Conductive film, corrosion-resistant conduction film, corrosion-resistant conduction material and process for producing the same

#28
20080268280
2008-10-30

METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME

#29
20080248194
2008-10-09

METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL DISPLAY MANUFACTURING PROCESS

#30
20080241558
2008-10-02

Method for forming corrosion-resistant film and high-temperature apparatus member

#31
20080206530
2008-08-28

METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STRUCTURE, AND DISPLAY DEVICES USING THE SAME

#32
20080199627
2008-08-21

CATALYTIC TREATMENT METHOD, ELECTROLESS PLATING METHOD, AND METHOD FOR FORMING CIRCUIT USING ELECTROLESS PLATING

#33
20080014355
2008-01-17

Method for Preparing a Palladium-Containing Layer

#34
20070105377
2007-05-10

Fabrication of semiconductor interconnect structure

#35
20060228569
2006-10-12

Production method of substrate with black film and substrate with black film

#36
20060115724
2006-06-01

Method of forming a nickel layer on the cathode casing for a zinc-air cell

#37
20060070885
2006-04-06

Chip interconnect and packaging deposition methods and structures

#38
20050175773
2005-08-11

Metal/ceramic bonding member and method for producing same