ClassID:

120384

C23C18/182 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy Radiation, e.g. UV, laser

Recent Application in this class:
#1
20250053080
2025-02-13

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

#2
20230273516
2023-08-31

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

#3
20230266662
2023-08-24

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

#4
20230247774
2023-08-03

Semi-Additive Process for Printed Circuit Boards

#5
20220379535
2022-12-01

METHOD OF MANUFACTURING A MOLD FOR INJECTION MOLDING

#6
20220186376
2022-06-16

PRE-INITIATED OPTICAL FIBERS AND METHODS OF MAKING THEREOF

#7
20220075260
2022-03-10

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

#8
20200208270
2020-07-02

LASER SURFACE STRUCTURING TREATMENT FOR PLATING

#9
20200181777
2020-06-11

Pre-initiated optical fibers and methods of making thereof

#10
20200116032
2020-04-16

Impeller for rotary machine, compressor, forced induction device, and method for manufacturing impeller for rotary machine

#11
20200089104
2020-03-19

Vacuum-integrated hardmask processes and apparatus

#12
20190341324
2019-11-07

Manufacturing a package using plateable encapsulant

#13
20190264327
2019-08-29

Optical printing systems and methods

#14
20190094685
2019-03-28

Vacuum-integrated hardmask processes and apparatus

#15
20180036082
2018-02-08

Pre-initiated optical fibers and methods of making thereof

#16
20180004083
2018-01-04

Vacuum-integrated hardmask processes and apparatus

#17
20170256472
2017-09-07

Semiconductor package with plateable encapsulant and a method for manufacturing the same

#18
20170067164
2017-03-09

Pretreatment solution for electroless plating and electroless plating method

#19
20160186324
2016-06-30

RESIN ARTICLE AND METHOD OF MANUFACTURING RESIN ARTICLE

#20
20160168717
2016-06-16

Non-aqueous metal catalytic composition with oxyazinium photoreducing agent

#21
20160168714
2016-06-16

Forming silver catalytic sites from reducible silver-oximes

#22
20160167037
2016-06-16

Forming catalytic sites from reducible silver-heterocyclic complexes

#23
20160005514
2016-01-07

METHOD FOR FORMING ELECTRONIC ELEMENT

#24
20150315708
2015-11-05

Method of fabricating substrate structure and substrate structure fabricated by the same method

#25
20150230865
2015-08-20

Pre-initiated optical fibers for medical applications

#26
20150221519
2015-08-06

Vacuum-integrated hardmask processes and apparatus

#27
20150056410
2015-02-26

Process for application of metal

#28
20110281135
2011-11-17

SURFACE METALLIZING METHOD, METHOD FOR PREPARING PLASTIC ARTICLE AND PLASTIC ARTICLE MADE THEREFROM

#29
20090311429
2009-12-17

Plating method and apparatus

#30
20070117365
2007-05-24

Plating method and apparatus

#31
20070092638
2007-04-26

Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method

#32
20070065585
2007-03-22

Reducing electrical resistance in electrolessly deposited copper interconnects

#33
20050208428
2005-09-22

Surface graft material, conductive pattern material, and production method thereof

#34
20050003101
2005-01-06

High resolution patterning method