ClassID:

120397

C23C18/1865 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy Heat

Recent Application in this class:
#1
20230095982
2023-03-30

SYSTEM AND METHOD FOR DIRECT ELECTROLESS PLATING OF 3D-PRINTABLE GLASS FOR SELECTIVE SURFACE PATTERNING

#2
20190264327
2019-08-29

Optical printing systems and methods

#3
20190093233
2019-03-28

Non-Seed Layer Electroless Plating of Ceramic

#4
20180350670
2018-12-06

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL OXIDES ON A METAL SEED LAYER

#5
20180332713
2018-11-15

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS

#6
20170354040
2017-12-07

Patterning of electroless metals by selective deactivation of catalysts

#7
20150247242
2015-09-03

Pre-treatment method of plating, storage medium, and plating system

#8
20150140209
2015-05-21

Pre-treatment method for plating and storage medium

#9
20140370313
2014-12-18

Adhesion promoting agents for metallization of substrate surfaces

#10
20140308450
2014-10-16

Method of metalizing surface and article obtainable

#11
20140256128
2014-09-11

Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer

#12
20120231567
2012-09-13

Method of forming metal pattern and method of manufacturing display substrate having the same

#13
20110117338
2011-05-19

OPEN PORE CERAMIC MATRIX COATED WITH METAL OR METAL ALLOYS AND METHODS OF MAKING SAME

#14
20110086165
2011-04-14

Metallization of a porous silicon zone by in situ reduction and application to a fuel cell

#15
20090252866
2009-10-08

METHOD OF PRODUCING GLASS FORMING MOLD

#16
20090236016
2009-09-24

METHOD FOR MANUFACTURING GLASS MOLDING DIE

#17
20090017624
2009-01-15

Nodule Defect Reduction in Electroless Plating

#18
20080283275
2008-11-20

Metal deposition

#19
20080274577
2008-11-06

Method of the application of a zinc sulfide buffer layer on a semiconductor substrate

#20
20070286964
2007-12-13

Method for Improving the Electrical Connection Properties of the Surface of a Product Made From a Polymer-Matrix Composite

#21
20070026642
2007-02-01

Surface modification method and surface modification apparatus for interlayer insulating film

#22
20060233963
2006-10-19

Method for electroless plating and metal-plated article

#23
20060194431
2006-08-31

Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process

#24
20060182881
2006-08-17

Plating method

#25
20060102487
2006-05-18

Platable coating and plating process

#26
20050287304
2005-12-29

Method of treating a substrate for electroless plating and method of increasing adhesion therebetween, and magnetic recording medium and magnetic recording device thereof

#27
20050260846
2005-11-24

Substrate processing method, semiconductor device production method, and semiconductor device

#28
20050233593
2005-10-20

Plating of multi-layer structures

#29
20050224461
2005-10-13

Method for metallizing titanate-based ceramics

#30
20050189628
2005-09-01

Process for producing a resin composition and electrophotographic fixing member

#31
20050157396
2005-07-21

Microstructure array, mold for forming a microstructure array, and method of fabricating the same

#32
20050052326
2005-03-10

Process for producing a metal layer on a substrate body, and substrate body having a metal layer