ClassID:

120398

C23C18/1868 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy Radiation, e.g. UV, laser

Recent Application in this class:
#1
20250333846
2025-10-30

CATALYST FOR WATER ELECTROLYSIS USING FLUORINE-DOPED TIN OXIDE SUPPORT AND METHOD FOR MANUFACTURING THE SAME

#2
20240407107
2024-12-05

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORS

#3
20240295028
2024-09-05

PRODUCTION METHOD FOR PLATED SUBSTRATE

#4
20240188225
2024-06-06

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

#5
20190341324
2019-11-07

Manufacturing a package using plateable encapsulant

#6
20190264327
2019-08-29

Optical printing systems and methods

#7
20190093233
2019-03-28

Non-Seed Layer Electroless Plating of Ceramic

#8
20190029126
2019-01-24

Method for forming circuit on substrate

#9
20190017175
2019-01-17

METHOD OF FORMING A METAL LAYER ON A PHOTOSENSITIVE RESIN

#10
20180350670
2018-12-06

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL OXIDES ON A METAL SEED LAYER

#11
20180291198
2018-10-11

RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER

#12
20170256472
2017-09-07

Semiconductor package with plateable encapsulant and a method for manufacturing the same

#13
20170191165
2017-07-06

METHOD FOR PRODUCING PLATED ARTICLE

#14
20170067164
2017-03-09

Pretreatment solution for electroless plating and electroless plating method

#15
20160186325
2016-06-30

RESIN ARTICLE HAVING PLATING LAYER AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FILM

#16
20160168717
2016-06-16

Non-aqueous metal catalytic composition with oxyazinium photoreducing agent

#17
20160168714
2016-06-16

Forming silver catalytic sites from reducible silver-oximes

#18
20160167037
2016-06-16

Forming catalytic sites from reducible silver-heterocyclic complexes

#19
20160073497
2016-03-10

Circuit board and method for fabricating the same

#20
20160020164
2016-01-21

Wiring substrate and method for manufacturing the same

#21
20160002791
2016-01-07

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR

#22
20150361560
2015-12-17

RESIN ARTICLE HAVING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME

#23
20150305168
2015-10-22

Process of depositing a metallic pattern on a medium

#24
20150210849
2015-07-30

RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER

#25
20150189762
2015-07-02

Coating composition, composite prepared by using the coating composition and method for preparing the same

#26
20150140209
2015-05-21

Pre-treatment method for plating and storage medium

#27
20150056410
2015-02-26

Process for application of metal

#28
20140284849
2014-09-25

Method for manufacturing three-dimensional integrated circuit

#29
20140256128
2014-09-11

Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer

#30
20130180773
2013-07-18

CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

#31
20130095995
2013-04-18

Process for the surface-modification of flyash and industrial applications thereof

#32
20120231567
2012-09-13

Method of forming metal pattern and method of manufacturing display substrate having the same

#33
20110194673
2011-08-11

Microstructure manufacturing method and microstructure

#34
20110177359
2011-07-21

METALIZED PLASTIC ARTICLES AND METHODS THEREOF

#35
20110133192
2011-06-09

METHOD OF FORMING CONDUCTIVE PATTERN AND ORGANIC THIN FILM TRANSISTOR

#36
20110003086
2011-01-06

Method for fabricating blackened conductive patterns

#37
20090017624
2009-01-15

Nodule Defect Reduction in Electroless Plating

#38
20080283275
2008-11-20

Metal deposition

#39
20080044591
2008-02-21

Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same

#40
20070292667
2007-12-20

Molded polymer comprising silicone and at least one metal trace

#41
20070286964
2007-12-13

Method for Improving the Electrical Connection Properties of the Surface of a Product Made From a Polymer-Matrix Composite

#42
20070247822
2007-10-25

METHOD FOR THE PRODUCTION OF A PRINTED CIRCUIT STRUCTURE AS WELL AS A PRINTED CIRCUIT STRUCTURE THUS PRODUCED

#43
20070092638
2007-04-26

Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method

#44
20070065585
2007-03-22

Reducing electrical resistance in electrolessly deposited copper interconnects

#45
20070036888
2007-02-15

Electromagnetic-wave-shielding light-transmitting window member and method for producing the same

#46
20060228493
2006-10-12

Method of plating on a glass base plate and a method of manufacturing a perpendicular magnetic recording medium

#47
20060144713
2006-07-06

Optical filter for image display devices and manufacturing method thereof

#48
20060097622
2006-05-11

Method of forming metal pattern having low resistivity

#49
20050218487
2005-10-06

Method for manufacturing wiring substrate

#50
20050218110
2005-10-06

Method for manufacturing wiring substrate

#51
20050215721
2005-09-29

Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material

#52
20050214550
2005-09-29

Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern

#53
20050208428
2005-09-22

Surface graft material, conductive pattern material, and production method thereof

#54
20050121327
2005-06-09

Electroless-plated deposit process for silicon based dielectric insulating material

#55
20050003101
2005-01-06

High resolution patterning method