ClassID:

120412

C23C18/2033 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of  -  by radiant energy Heat

Recent Application in this class:
#1
20260149092
2026-05-28

NICKEL PLATED STEEL SHEET FOR BATTERY CASE HAVING EXCELLENT SURFACE CORROSION RESISTANCE AND METHOD FOR MANUFACTURING

#2
20250109549
2025-04-03

CONDUCTIVE FABRIC

#3
20230407482
2023-12-21

SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM

#4
20230272535
2023-08-31

METHOD FOR SURFACE TREATMENT PRIOR TO METALLIZATION

#5
20220074053
2022-03-10

Substrate processing apparatus, substrate processing method, and storage medium

#6
20210262094
2021-08-26

COATING METHOD FOR PREVENTING DEGASSING OF AEROSPACE PART MADE OF RESIN

#7
20180332713
2018-11-15

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS

#8
20180030600
2018-02-01

METHOD FOR PLATING ON SURFACE OF NON-CONDUCTIVE SUBSTRATE

#9
20170354040
2017-12-07

Patterning of electroless metals by selective deactivation of catalysts

#10
20170290150
2017-10-05

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

#11
20170159184
2017-06-08

METALLIZATION OF LOW TEMPERATURE FIBERS AND POROUS SUBSTRATES

#12
20170044672
2017-02-16

Metalization of surfaces

#13
20170044670
2017-02-16

Metalization of surfaces

#14
20150104565
2015-04-16

Method for forming flexible transparent conductive film

#15
20140370313
2014-12-18

Adhesion promoting agents for metallization of substrate surfaces

#16
20140308450
2014-10-16

Method of metalizing surface and article obtainable

#17
20130037513
2013-02-14

Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board

#18
20110174524
2011-07-21

Flexible circuits

#19
20100273009
2010-10-28

Method of silver plating and articles and/or objects formed by the method of silver plating

#20
20100159260
2010-06-24

CHROME-FREE METHOD OF CONDITIONING AND ETCHING OF A THERMOPLASTIC SUBSTRATE FOR METAL PLATING

#21
20100092680
2010-04-15

PROCESS FOR PRODUCING METAL CLAD LAMINATE

#22
20100059259
2010-03-11

RESIN BOARD TO BE SUBJECTED TO OZONE TREATMENT, WIRING BOARD, AND METHOD OF MANUFACTURING THE WIRING BOARD

#23
20090317853
2009-12-24

Method for producing a layer on a molded article and use thereof

#24
20090281267
2009-11-12

Material for planting and use thereof

#25
20090257056
2009-10-15

Surface enhanced raman detection on metalized nanostructured polymer films

#26
20080057191
2008-03-06

METHOD OF MANUFACTURING ULTRA-THIN SOFT CONDUCTIVE CLOTH

#27
20070264490
2007-11-15

Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them

#28
20070110973
2007-05-17

Resin substrate having a resin-metal composite layer and method for manufacturing thereof

#29
20060233963
2006-10-19

Method for electroless plating and metal-plated article

#30
20060154099
2006-07-13

Multilayer body and method for producing same

#31
20060153990
2006-07-13

UV curable catalyst compositions

#32
20060134338
2006-06-22

Method and apparatus for forming a metallic feature on a substrate

#33
20060121249
2006-06-08

Plated-polyester article and production process thereof

#34
20060102487
2006-05-18

Platable coating and plating process

#35
20060086619
2006-04-27

Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment

#36
20050266352
2005-12-01

Metallic pattern forming method and conductive pattern material

#37
20050214693
2005-09-29

Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material

#38
20050052326
2005-03-10

Process for producing a metal layer on a substrate body, and substrate body having a metal layer

#39
12779867
2014-12-16

Flexible circuit formation